Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Fillers Included
- Polymer Name
- Plastics & Elastomers Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Key Features
D33 / 6120 has a low water absorption, high dielectric strength, and low dissipation factor along with a fast cure.
Applications & Uses
- Markets
- Applications
- Plastics & Elastomers End Uses
- Plastics & Elastomers Processing Methods
- Product Applications
Switches, terminals, insulators, cups, cases and other applications requiring strength. Also useful for encapsulation of electrical and electronic components. Has easy flow and is useful for molding thin parts..
Properties
- Physical Form
- Mechanical Properties
Value Units Test Method / Conditions Flexural Strength 13 - 15,000 psi - Compressive Strength 24 - 26,000 psi - Tensile Strength 6 - 10,000 psi - Impact Strength (Izod Notched) 0.5 - 1.2 ft-lb / inch - - Thermal Properties
Value Units Test Method / Conditions Dimensional Stability max. 0.01 % - Thermal Expansion (at -40 °C to 100 °C) 1.2 10⁻⁵ / °C - Heat Distortion Temperature (at 18.6 kg/cm²) 260 °C - - Electrical Properties
Value Units Test Method / Conditions Arc Resistance 145 seconds - Dielectric Strength (Kv Step-by-Step, Dry) 380 volts/mil - Dielectric Strength (Kv Step-by-Step, Wet) 340 volts/mil - Dielectric Breakdown (Step-by-Step, Dry) 62 Kv - Dielectric Breakdown (Step-by-Step, Wet) 60 Kv - Dielectric Constant (at 1 KHz, Dry) 4.2 - - Dielectric Constant (at 1 KHz, Wet) 4.3 - - Dissipation Factor (at 1KHz, Dry) 0.007 - - Dissipation Factor (at 1KHz, Wet) 0.011 - - Surface Resistance Megaohms (As is) min. 10¹⁰ - - Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH) 10⁴ - - Dielectric Constant (at 1 MHz, Dry) 4 - - Dielectric Constant (at 1 MHz, Wet) 4.2 - - Dissipation Factor (at 1MHz, Dry) 0.013 - - Dissipation Factor (at 1MHz, Wet) 0.015 - - - Moisture Properties
Value Units Test Method / Conditions Water Absorption (at 50 °C,48 hours) 0.25 % - - Processing Information (Molding)
Value Units Test Method / Conditions Specific Gravity 1.72 - - Bulk Factor 2.5 - - Molding Pressure 500 - 8,000 psi - Molding Temperature 135 - 190 °C - Mold Shrinkage 0.001 - 0.004 In / In -
Regulatory & Compliance
- Certifications & Compliance