Products in Thermoset Prepregs: Laminate

33N is a flame retardant (UL94 V-O) polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg (250°C) results in low overall z-axis expansion, and minimizes risk of latent PTH defects in-service.

Arlon 85HP’s unique blend of pure polyimide resin and micro-fi ne proprietary fi llers results in superior performance for demanding applications. Compared to conventional polyimide systems, 85HP has a lower Z-axis expansion and twice the thermal conductivity. 85HP reduces resin cracking and wicking in designs with high density plated through holes and vias. 85HP prepreg has resin fl ow characteristics and pressed thickness matching standard polyimides.

35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.

85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.