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Arlon® 85HP

Arlon 85HP’s unique blend of pure polyimide resin and micro-fi ne proprietary fi llers results in superior performance for demanding applications. Compared to conventional polyimide systems, 85HP has a lower Z-axis expansion and twice the thermal conductivity. 85HP reduces resin cracking and wicking in designs with high density plated through holes and vias. 85HP prepreg has resin fl ow characteristics and pressed thickness matching standard polyimides.

Brand: Arlon (35 products)

Polymer Name: Polyimide (PI)

Functions: Laminate, Prepreg

End Uses: Semiconductor Applications

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Polyimides (PI)
Polymer Name
Polyimide (PI)
Composite Materials Functions
Laminate,
Prepreg
Technologies
Composite Materials
Product Families
Composite Materials — Prepregs & Molding Compounds
Laminates,
Thermoset Prepregs

Features & Benefits

Labeling Claims
Lead-free

Applications & Uses

Markets
Automotive & Transportation,
Electrical & Electronics,
Industrial
Applications
Automotive & Transportation — Automotive
Powertrain & UTH
Industrial — Chemical & Industrial Manufacturing
Other Industrial Applications
Electrical & Electronics — Devices & Assemblies
Other Devices & Assemblies
Industrial — Military & Defense
Advanced Materials
Industrial — Oil, Gas & Mining
Exploration & Upstream
Electrical & Electronics — Parts & Components
Semiconductor Manufacturing
Automotive & Transportation — Transportation
Aerospace & Aviation
Plastics & Elastomers End Uses
Semiconductor Applications

Properties

Flame Rating
UL 94 HB
Physical Form
Prepreg
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Strength (MD)35Kpsi-
Tensile Strength (CD)35Kpsi-
Peel Strength to Copper (1 oz/35 micron) After Thermal Stress6.5 (1.1)lb/in (N/mm)IPC TM-650 2.4.8
Peel Strength to Copper (1 oz/35 micron) at Elevated Temperatures6.5 (1.1)lb/in (N/mm)IPC TM-650 2.4.8.2
Peel Strength to Copper (1 oz/35 micron) After Process Solutions6.5 (1.1)lb/in (N/mm)IPC TM-650 2.4.8
Young's Modulus3Mpsi (GPa)IPC TM-650 2.4.18.3
Poisson's Ratio0.15-ASTM D-3039
Physical Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.7-ASTM D 792
Water Absorption (0.062)0.32%IPC TM-650 2.6.2.1
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg) - TMA250°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion (X,Y)17ppm/°CIPC TM-650 2.4.41
Coefficient of Thermal Expansion (Z) - Above Tg150ppm/°CIPC TM-650 2.4.24
z-axis Expansion (50-260oC)1%IPC TM-650 2.4.24
Coefficient of Thermal Expansion (Z) - Below Tg45ppm/°CIPC TM-650 2.4.24
Decomposition Temperature (Td) - Initial380°CIPC TM-650 2.3.41
Decomposition Temperature (Td, 5%)430°CIPC TM-650 2.3.41
T260min. 60minIPC TM-650 2.4.24.1
T288min. 60minIPC TM-650 2.4.24.1
T300min. 60minIPC TM-650 2.4.24.1
Thermal Conductivity0.5W/mK-
Electrical Properties
ValueUnitsTest Method / Conditions
Electrical Strength1500 (59)Volts/mil (kV/mm)IPC TM-650 2.5.6.2
Dielectric Constant (1 MHz)4-ASTM D 150
Dissipation Factor (1 MHz)0.008-ASTM D 150
Volume Resistivity (C96/35/90)1.5 x 10^8MΩ-cmIPC TM-650 2.5.17.1
Volume Resistivity (E24/125)3.0 x 10^8MΩ-cmIPC TM-650 2.5.17.1
Surface Resistivity (C96/35/90)1.6 x 10^9MΩIPC TM-650 2.5.17.1
Surface Resistivity (E24/125)1.6 x 10^8MΩIPC TM-650 2.5.17.1
Arc Resistance143secASTM D495
Flammability
ValueUnitsTest Method / Conditions
FlammabilityHB-UL 94

Regulatory & Compliance

Certifications & Compliance
UL 94