Products in Industrial: Cost Effective

SABIC's Specialties Business LNP THERMOCOMP SF006 compound is based on Nylon 12 resin containing 30% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP™ THERMOCOMP™ LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: High Modulus, High impact, Easy Molding, Electrical Conductive.

LNP THERMOCOMP JF002 compound is based on Polyethersulfone (PES) resin containing 10% glass fiber.

SABIC's Specialties Business LNP THERMOCOMP EC004XXC compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP UF0069S compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.

SABIC's Specialties Business LNP THERMOCOMP OF006 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 30% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP 2C004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business LNP THERMOCOMP RF004XXD compound is based on Nylon 6/6 resin containing 20% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP PF006S compound is based on Nylon 6 resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.

SABIC's Specialties Business LNP THERMOCOMP UF007SXC compound is based on Polyphthalamide (PPA) resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP JF006EXZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP PDXE98480 compound is based on Polyetherimide (PEI) resin containing 40% glass fiber.

LNP THERMOCOMP LX03447 compound is based on Polyetheretherketone (PEEK) resin containing 35% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business LNP THERMOCOMP MF00AS compound is based on Polypropylene (PP) resin containing 50% glass fiber. Added features of this grade include: Heat Stabilized. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP™ THERMOCOMP™ LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.

LNP THERMOCOMP 2C003 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP 2X95787 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% glass fiber.

SABIC's Specialties Business LNP THERMOCOMP GF004 compound is based on Polysulfone (PSU) resin containing 20% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LC00APXQ compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Exceptional Processing, Electrically Conductive.

LNP™ THERMOCOMP™ Compound 5C003 is a Polyvinylidene Fluoride (PVDF) resin-based compound with 15% carbon fiber, offering electrically conductive properties. It is characterized by its high stiffness and strength, making it ideal for applications in electrical and electronics, energy management, electronic components, and industrial material handling. This compound is processed through injection molding.

SABIC's Specialties Business LNP THERMOCOMP TF002 compound is based on Polyurethane (TPU) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP MF004S compound is based on Polypropylene (PP) resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP CX05470 compound is based on Polystyrene (PS) resin containing 20% glass fiber.

LNP THERMOCOMP 2F005 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 25% glass fiber.

LNP THERMOCOMP UF008AR compound is based on Polyphthalamide (PPA) resin, containing 40% glass fiber. Added features of this grade include: Mold Release.

SABIC's Specialties Business LNP™ THERMOCOMP™ LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

SABIC's Specialties Business LNP™ THERMOCOMP™ LF004E1 compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding and Low Warpage

LNP THERMOCOMP LC006EXQ compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

LNP™ THERMOCOMP™ Compound 5C004 is a Polyvinylidene fluoride (PVDF) resin-based compound infused with 20% carbon fiber, imparting excellent electrical conductivity. This grade offers remarkable stiffness and strength characteristics, making it well-suited for applications in electrical and electronics, energy management, electronic components, and industrial material handling. The compound is processed using injection molding techniques.

SABIC's Specialties Business LNP™ THERMOCOMP™ ZC004XXAR1 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Lower Thermal Expansion, Improved Hydrolytic Stability, Higher strength to Weight Ratio, Higher Temperature Performance and improved processing vs. ABS based grades.

SABIC's Specialties Business LNP™ THERMOCOMP™ AM Compound AF004XXAR1 is a top-quality material based on acrylonitrile butadiene styrene (ABS) resin containing 20% glass fiber specifically designed for large format additive manufacturing (LFAM) applications. This grade is easy to process, has low warp, and provides excellent print surface quality, making it an ideal candidate for a broad range of applications and tooling, including thermoforming and vacuum forming. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP DF004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP DC004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish.FeaturesCost EffectiveHigh DuctilityHigh Impact ResistanceHigh StiffnessHigh StrengthHigh Temperature StrengthSmooth Surface FinishVery Good Heat ResistanceApplications3D PrintingAdditive Manufacturing This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP LUBRICOMP OCP36 compound is based on Polyphenylene Sulfide (PPS) - linear resin containing 30% carbon fiber and 15% PTFE/silicone. Added features of this grade include: Wear Resistant, Bearing Grade, Electrically Conductive.

SABIC's Specialties Business LNP™ THERMOCOMP™ EC004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

SABIC's Specialties Business LNP™ THERMOCOMP™ AM DC004XXA11is a compound based on High Heat PC copolymer resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications, including mid-temperature autoclaving tooling. This compound can offer higher temperature performance than standard PC and avoid some of the processing challenges associated with high temperature materials.