Products in Potting Compounds: Chemical Resistant

ELASTOSIL® RT 745 S" A/B" is a pourable, two-part silicone rubber that can be thermally cured. It is an addition-curing type, making it suitable for various applications. Some notable industries where it finds use are automotive, electronics, and measurement and control. Specifically, it is employed in potting and encapsulation processes, ensuring the protection and stability of sensitive components and systems.

ELASTOSIL® RT 646 A/B is a castable, addition-curing, two-component silicone rubber that vulcanizes at room temperature. It is a flowable material with resistance against casting resins, making it suitable for various applications such as encapsulation of electronic components, all-round potting compound, and mold making in reproduction molding.

CHT Group QSil 553 is a 2-component silicone elastomer system specially designed for electronic potting and encapsulation applications. It offers good protection against chemicals, environmental contamination, mechanical shock, vibration, and impact damage. It can be employed in areas where low flammability is a prerequisite. The cured elastomer can be repaired. The component parts have relatively low viscosities and are readily mixed, either by hand or machine.

CHT Group SE3000 is a 2-component silicone elastomer system specially designed for electronic potting and encapsulation applications. It offers good protection against chemicals, environmental contamination, mechanical shock, vibration, and impact damage. It can be employed in areas where low flammability is a prerequisite. The cured elastomer can be repaired. The component parts have relatively low viscosities and are readily mixed, either by hand or machine.

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

904-64 is a two-component, thermally conductive, red, high performance room temperature addition curing siliconeFeaturesTwo component, easy air release and low shrinkage addition cured silicone potting compound

High Thermal Conductivity Epoxy, Encapsulating & Potting Compound 834HTC is a 2-part, black, rigid, flameretardant thermal epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This epoxy resin is designed for applications where thermal management and selfextinguishing are critical. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black Flexible Epoxy, Encapsulating & Potting Compound 834FX is a 2-part, flame-retardant, thermally conductive, fexible epoxy resin that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It is good in low temperature and arctic environments, and in applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.

High Temperature Epoxy, Encapsulating & Potting Compound 832HT is a general purpose, rigid, black, 2-part high temperature epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is useful when extreme physical strength and chemical resistance are required. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

834B potting and encapsulating compound is a black, flame retardant, thermally conductive two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where thermal management and self-extinguishing are critical. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals. This epoxy has a convenient 2:1 volume mix ratio, making it compatible with most dispensing equipment. 834B can be cured at room temperature or higher.

Black 1:1 Epoxy, Encapsulating & Potting Compound 832HD is a black, rigid, 2-part epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832HD can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Translucent Epoxy, Encapsulating & Potting Compound 832C is a rigid, amber clear epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, it can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black Epoxy, Encapsulating & Potting Compound 832B is a general purpose, rigid, 2-part black epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832B can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

High Temperature Rigid Urethane 8820 is a black, tough, high temperature, two-part polyurethane potting compound. It has a low mixed viscosity and properties similar to epoxy compounds, but with exceptional low temperature stability. As well, it adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. 8820 offers exceptional physical protection, a high continuous operating temperature, and superior protection from acids, bases, and many organic solvents.

One-part Epoxy Potting Compound 9510 is a black, rigid, one-part epoxy potting compound. It is a heat cure epoxy that provides unlimited working time at room temperature and does not require frozen storage. Our 1-part epoxy resin provides exceptional chemical resistance against a wide variety of mild to harsh chemicals, including toluene, acetone and ethyl acetate. It also provides excellent electrical insulation and protects against static discharge, vibration, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

UV-8311 is a low viscosity, fast curing, light curing epoxy adhesive that offers excellent strenth wetting properties. UV-8311 cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass.This product requires direct light exposure during cure. UV-8311 can cure fully in under 10 seconds using optimal cure conditions. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths

UV-8403 is a low viscosity, light curing epoxy adhesive that bonds well to a wide variety of substrates including engineered plastics such as UltemTM, LexanTM, and ABS. This product exhibits good surface wetting and adhesion to glass and many plastics. UV-8403 cures to a clear polymer when properly cured. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of UVA light (310-365nm).

LEECAST 38-191 is a proprietary two-part epoxy adhesive and encapsulating compound. It has been used extensively for potting lead wires in UL-listed commercial gasoline pumps. LEECAST 38-191 has exceptional chemical resistance, especially in respect to gasoline, various gasoline alcohol additives, and other aggressive organic solvents. It also features fast room temperature cure and excellent adhesion to a variety of wire coatings and other substrates. It is formulated with enough thixotropy to inhibit sag on vertical surfaces and self-leveling when applied in a bead on horizontal surfaces.

EC-1190 is an epoxy encapsulating system with a very low density for use in the aerospace and medical industries. EC-1190 is low viscosity and can cure at room temperature when used with catalyst EH-21. EC-1190 has excellent chemical resistance and a low coefficient of thermal expansion (CTE).

APPLI-TEC 5336 Epoxy is a black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. 5336 is supplied in frozen syringes.

Anchor Seal SY3002 Amber Clear is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It is good / stable shelf life, low viscosity, unfilled, heat and chemical resistant.

PAKCOOL® TPC-230 is 1:1 two-component liquid electronic potting material that can be solidified at room temperature or at elevated temperatures change. In addition to the characteristics of high thermal conductivity, this product also has a thermal expansion rate low and high insulation characteristics, which eliminates electrons more effectively. Destruction of components due to changes in operating temperature.

PAKCOOL® TPC-213-08-DM is a high thermal conductivity Energy efficient 1:1 two-component liquid electronic potting material, available at room temperature or with added cures at temperature.

Cast-Coat Inc. CC3-300 is a high viscosity, alumina filled casting resin offering high thermal conductivity, high heat distortion, excellent electrical insulation, low coefficient of thermal expansion and extremely low shrinkage during cure. It will withstand the most rugged tests of temperature, chemical attack and voltage shock, and is easier to fabricate than metals or ceramics at a lower cost. Supplied as a pourable resin, it cures to a rigid, opaque plastic at room temperature or with heat. The thermal coefficient of expansion is closely matched to aluminum. CC3-300 has excellent adhesion to a wide variety of materials, i.e., metal, plastic, glass, ceramic. To reduce viscosity, warm the resin between 100°F to 150°F prior to adding the hardener.

PAKCOOL® TPC-213 is 1:1 two-component liquid electronic potting material, which can be solidified at room temperature or heated change. In addition to high thermal conductivity, this product also has a low thermal expansion rate and high insulation characteristics, so as to more effectively eliminate electronic components destructive effects due to changes in operating temperature.

PAKCOOL® TPC-219 is 1:1 two-component liquid electronic potting material, available at room temperature or warmed under curing. In addition to the characteristics of high thermal conductivity, this product also has thermal low expansion rate and high insulation characteristics, so as to be more effective eliminate the destructive effect of electronic components due to changes in operating temperature.

A clear amber, 100% solids, room temperature curing epoxy system with a convenient 1:1 mix ratio by volume. 1010-CA810 is great for electrical potting and encapsulating, industrial surface coating, wood surface coat and seal coat. This product cures to a hard, shiny, high gloss finish that is free from “amine blushing” under all humidity conditions.

PAKCOOL® TPC-200 is a 1:1 two-component liquid electronic transparent potting material. It can be cured at room temperature or heated.

ALFA GR-194 FDA is an opaque white heat sink, food grade grease compound. ALFA GR-194 FDA is grease like silicone material, heavily filled with efficient heat conductive zinc oxide and a binding agent, this combination promotes high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation. ALFA GR-194 FDA is applied in many industrial applications.

Alfa TG-106 is a silicone base gray heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat sink seal, this facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall efficiency and performance of the device. TG-106 is grease like silicone material, heavily filled with efficient heat conductive Aluminum oxide and a binding agent, this combination promotes high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation.

PAKCOOL® TPC-213-08-AT is 1:1 two-component liquid electronic potting material that can be cured at room temperature or at elevated temperatures. In addition to high thermal conductivity, this product also has high temperature resistance and insulation properties advanced features.

Nuceq R9-2039/HD-1095 M1 system is a 100% solid epoxy system that cures at room temperature.

ALFA ULTRATHERM 500 is grease like silicone compound, filled with synthetic diamond and binding agent, this formulation promotes high thermal conductivity, low bleed, low thermal resistance, and function as heat transfer media. ALFA ULTRATHERM 500 is resistant to ozone and ultraviolet degradation and has good chemical stability, has low surface tension that enables it to wet most surfaces, which can lower the thermal contact resistance between the substrate and the material.

Anchor Seal SY3259DFR* Red is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It is low cost and does not Room cure.

Jeil Chemical Corporation EPO – 0599 is extremely resistant to abrasion and chemical attack and it is recommended for the protection of concrete surfaces in contact with aggressive environment like acids, oils, alkalies, etc. Therefore, it is developed and formulated for Accessory coating materials. It is once mixed and applied thinly by using a roller or hand work(handicraft). By the virtue of many properties such as excellent adhesive to substrates, chemical resistance, outstanding resistance against abrasion and excellent durability, good workability, and long pot life, It is wildly used for accessory coating materials for handicraft and electrical transparent potting, etc.

ALFA GR-104 is an opaque white heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat sink seal, this facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall efficiency and performance of the device. GR104 is grease like silicone material, heavily filled with efficient heat conductive zinc oxide and a binding agent, this combination promotes high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation.