Products in Other Packaging & Assembly Applications: Resin

MultiTech MultiFunctional L is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparency LED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs MultiTech MultiFunctional L is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

ADVANCENE™ EM-4925-AAH HDPE Resin is specifically designed for use in either intermittent or continuous blow molding equipment to produce containers up to 30 liters in size - applications that require the combination of outstanding environmental stress crack resistance (ESCR) and high impact strength.

ADVANCENE™ EE-1802-BSB is a part of a Butene LLDPE series designed for the Blown & Cast film process, offering high gloss and excellent draw down. Films made from ADVANCENE™ EE-1802-BSB resin have very good tensile and toughness properties.

MU-209A Its functions are flexible, low stress, stress release, and shock absorption.

The MU-120B performs the following functions: flexibility, low stress, heat resistance, stress release, and shock absorption.

Advancene™ EM-4810-AAH HDPE Resin is a polymer with broad molecular weight distribution and high molecular weight. This product provides an excellent combination of extrudability and parison stability which contribute to uniform wall thickness in large parts.

Polychim Industrie (Beaulieu International Group) HA31XTF Polypropylene Homopolymer is a nucleated homopolymer with good antistatic properties.

EPS-321N used in thermal insulation, Construction materials, Lightweight fill materials and Packing for electronic appliance etc.

Polychim Industrie (Beaulieu International Group) HJ40XI Polypropylene Homopolymer is a nucleated homopolymer with good antistatic properties.

Kaofu Chemical HPS-800 is used for making of containers, toys, appliance parts, electronic packing material.

EPS-301 is used in Packing materials of protecting articles from breakage, Thermal insulations Construction materials, Arts and crafts materials, Fish-box & helmet inner mat etc.

ADVANCENE™ EE-1802-AAB is a part of a Butene LLDPE series designed for the Blown & Cast film process, offering high gloss and excellent draw down. Films made from ADVANCENE™ EE-1802-AAB resin have very good tensile and toughness properties.

MU-107A It has the following properties: flexibility, low stress, moisture resistance, stress release, and shock absorption.

ESD L2130-JC belongs to ESD Polyethylene Series with Anti-static, High mechanical strength, Static dissipative and Good toughness.

Moplen HP500D is a High molecular weight polypropylene homopolymer resin

Takaroku Shoji TRF-PP-TY9 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.

Nizhnekamskneftekhim ABS Plastic 0445Е is an extruded grade of general purpose with a good rigidity-hardness balance. It is used for production of sheets with high quality surface (co-extruded or not and with high extrusion ratio), applicable for refrigerators, sanitary, packaging, automobile parts, consumer goods and furniture (profiles). It is produced self-colored only, free of additives and dye.

Takaroku Shoji TRF-1026X-14A-18 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.

Takaroku Shoji TRF-PS02-2 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.

EVATHENE® UE3330 is an ethylene-vinyl acetate copolymer resin (EVA) for use in extrusion equipment designed to process photovoltaic (solar cell) applications.UE3330 also can be used in shoe sole foaming with high rebound property.

GuangDong ShunDe LuHua Photoelectric New Material Industrial LH-PP169 is suitable for extruding conductive hollow boards, turnover boxes, electronic packaging products, widely used in the electronic packaging industry.

TECACOMP PP ID gray 4242 is a Polypropylene Compound (PP Compound) polymer. It can be processed using injection molding.

Takaroku Shoji TRF-AK-72-4 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.