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Packaging & Assembly
Products in Packaging & Assembly: General Purpose
21 Products found in Packaging & Assembly
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Cosmic Plastics Inc.
DAP D72/6120F
Polymer Name:
Diallyl Phthalate
Processing Methods:
Transfer Molding, Injection Molding, Compression Molding
End Uses:
Insulators, Encapsulant, Terminal Blocks, Cases, Switches, Cups
Density:
1820.0 - 1820.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.
Cosmic Plastics Inc.
Farboset® 1180
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.
Cosmic Plastics Inc.
DAP 306.0
Polymer Name:
Diallyl Phthalate
End Uses:
Encapsulant, Terminal Blocks, Cases, Switches, Cups, Insulators
Density:
1520.0 - 1520.0 kg/m³
Tensile Strength:
24.804000000000002 - 34.45 MPa
DAP 306 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon and supplied in flake form. It is suitable for a variety of applications, including switches, terminals, insulators, cups, cases, and other components that require strength as well as chemical and moisture resistance. It can also be used for the encapsulation of electrical and electronic components.
Cosmic Plastics Inc.
DAP D33/6120
Polymer Name:
Diallyl Phthalate
Processing Methods:
Transfer Molding, Injection Molding, Compression Molding
End Uses:
Insulators, Encapsulant, Terminal Blocks, Cases, Switches, Cups
Density:
1720.0 - 1720.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.
Cosmic Plastics Inc.
DAP K43/6260
Polymer Name:
Diallyl Phthalate
Processing Methods:
Transfer Molding, Injection Molding, Compression Molding
End Uses:
Insulators, Housings, Encapsulant, Terminal Blocks, Cases, Switches, Cups
Density:
1800.0 - 1800.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP K43/6260 is a versatile diallyl iso-phthalate molding compound that is filled with minerals and supplied in granular form. This compound is designed for ease of use and versatility. It pours easily, can be preformed, and molds readily using standard compression, transfer, or injection equipment. What sets K43/6260 apart is its exceptional heat resistance, high arc resistance, and ease of molding around inserts. These features make it an ideal choice for applications that demand high-temperature performance and electrical insulation properties, while still allowing for straightforward processing and customization.
Taita Chemical
Taita Chemical EPS-301
Polymer Name:
Expanded Polystyrene (EPS)
EPS-301 is used in Packing materials of protecting articles from breakage, Thermal insulations Construction materials, Arts and crafts materials, Fish-box & helmet inner mat etc.
Crosslink Technology Inc.
Crosslink Technologies CLR1946
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Potting, Casting
End Uses:
Electrical/Electronic Applications, Electrical Components, General Purpose, Encapsulant
Volume Resistivity:
2000000000000.0 - 2000000000000.0 Ohm-m
CLR1946 is a two component, room temperature cure semi-flexible epoxy system. the system was developed for potting/casting of electrical and electronic components. its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment.
Crosslink Technology Inc.
Crosslink Technologies XRD1018
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Potting, Casting
End Uses:
Electrical/Electronic Applications, Electrical Components, General Purpose, Encapsulant
Volume Resistivity:
2000000000000.0 - 2000000000000.0 Ohm-m
XRD1018 is a two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets ul94-v0 in house flammability testing.
Nizhnekamskneftekhim
Nizhnekamskneftekhim ABS plastic 0445Е
Polymer Name:
Acrylonitrile Butadiene Styrene (ABS)
Processing Methods:
Coextrusion, Extrusion
Melt Flow Index:
2.5 - 5.5 g/10 min
Nizhnekamskneftekhim ABS Plastic 0445Е is an extruded grade of general purpose with a good rigidity-hardness balance. It is used for production of sheets with high quality surface (co-extruded or not and with high extrusion ratio), applicable for refrigerators, sanitary, packaging, automobile parts, consumer goods and furniture (profiles). It is produced self-colored only, free of additives and dye.
Ebalta Kunststoff Gmbh
Ebalta Kunststoff Gmbh Silastic RTV 3120
Applications:
Semiconductor Manufacturing, Other Devices & Assemblies, Other Packaging & Assembly Applications
Product Families:
Silicone Elastomers, Specialty Elastomers
Chemical Family:
Silicones
Polymer Name:
Silicone Elastomer
End Uses:
Semiconductor Applications, Encapsulant, General Purpose
SILASTIC™ RTV-3120 are pourable rubber bases that become firm, flexible silicone rubber when cured. There is a choice of three catalysts to select from in order to tailor your working times and cure rates.
Momentive Performance Materials
Silopren™ LSR 2665
Tear Strength:
50.0 - 50.0 kN/m
Silopren™ LSR 2665 by Momentive Performance Materials is comprised of Silicone Elastomer. It is commonly used as Molding Resin for a variety of applications in Aerospace, Automotive and Aviation. It is available in Liquid form.
Taita Chemical
Taita Chemical EPS-321
Polymer Name:
Expanded Polystyrene (EPS)
EPS-321 is used in Packing materials of protecting articles from breakage & Thermal insulations etc.
Crosslink Technology Inc.
Crosslink Technologies CLH6500
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Potting, Casting
End Uses:
Electrical/Electronic Applications, Electrical Components, General Purpose, Encapsulant
Volume Resistivity:
2000000000000.0 - 2000000000000.0 Ohm-m
CLH6500 is a two component, room temperature cure semi-flexible epoxy system. the system was developed for potting/casting of electrical and electronic components. its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment.
Nylene
Nylene® 401
Polymer Name:
Polyamide 6 (PA 6)
Processing Methods:
Injection Molding
Flexural Modulus:
2690.0 - 2690.0 MPa
Nylene General purpose un-reinforced nylon 6 injection molding resin. High flow characteristics at minimal processing temperatures Suitable for applications in both thin and heavy sections that require typical nylon characteristics and easy molding
Crosslink Technology Inc.
Crosslink Technologies CLI4161
Polymer Name:
Polyurethane (unspecified)
Processing Methods:
Potting, Casting
End Uses:
Electrical/Electronic Applications, Coil Insulation, Electrical Components, General Purpose, Encapsulant
Density:
1400.0 - 1400.0 kg/m³
Tensile Strength:
15.158 - 15.158 MPa
CLI4161 is a solventless, low viscosity, two component, polyurethane casting system, specifically designed for casting transformers, coils and electronic components. This product is especially suitable for encapsulating low and middle voltage power and instrument transformers where cushioning of the core is not practical. The cured product has excellent thermal shock resistance.
Nizh Yug (Nizhnekamskneftekhim)
Nizh Yug (Nizhnekamskneftekhim) GENERAL PURPOSE POLYSTYRENE GRADE 535
Polymer Name:
Polystyrene (unspecified)
Processing Methods:
Extrusion
Melt Flow Index:
2.5 - 4.5 g/10 min
GENERAL PURPOSE POLYSTYRENE GRADE 535 is used to manufacture light diffusers, office accessories,electronics packaging.
Euro Extrusions
Euro Extrusions LDPE
Density:
910.0 - 940.0 kg/m³
Euro Extrusions LDPE is the low density version of Polyethylene. It has less hardness, stiffness and strength compared to HDPE, but more ductile. This plastic has an optimal density, hard wearing construct and long functional life. Its opacity means only thin foils can be transparent. LDPE is widely used for manufacturing various containers, dispensing bottles, wash bottles, tubing, and various molded laboratory equipment. Its most common use is in plastic bags.
Crosslink Technology Inc.
Crosslink Technologies CLP7469
Polymer Name:
Polyurethane (unspecified)
Processing Methods:
Potting, Casting
End Uses:
Electrical/Electronic Applications, Coil Insulation, Electrical Components, General Purpose, Encapsulant
Density:
1400.0 - 1400.0 kg/m³
Tensile Strength:
15.158 - 15.158 MPa
CLP7469 is a solventless, low viscosity, two component, polyurethane casting system, specifically designed for casting transformers, coils and electronic components. This product is especially suitable for encapsulating low and middle voltage power and instrument transformers where cushioning of the core is not practical. The cured product has excellent thermal shock resistance.
Lindau Chemicals
Lindoxy 190
Polymer Name:
Epoxy Resins & Compounds
Chemical Family:
Epoxy & Epoxy Derivatives
Synonyms:
(3,4-Epoxycyclohexane)methyl 3,4-epoxycyclohexylcarboxylate, (3,4-Epoxycyclohexane)methyl 3′,4′-epoxycyclohexyl-carboxylate, (3,4-Epoxycyclohexyl)methyl 3,4-epoxycyclohexylcarboxylate, (3′,4′-Epoxycyclohexane)methyl 3,4-epoxycyclohexanecarboxylate, (3′,4′-Epoxycyclohexylmethyl) 3,4-epoxycyclohexanecarboxylate, 3,4-Epoxycyclohexanecarboxylic acid (3,4-epoxycyclohexylmethyl) ester, 3,4-Epoxycyclohexanecarboxylic acid (3′,4′-epoxycyclohexyl)methyl ester, 3,4-Epoxycyclohexanemethyl 3,4-epoxycyclohexanecarboxylate, 3,4-Epoxycyclohexenylmethyl 3′,4′-epoxycyclohexenecarboxylate, 3,4-Epoxycyclohexylmethyl 3′,4′-epoxycyclohexanecarboxylate, 3,4-Epoxycyclohexylmethyl 3′,4′-epoxycyclohexylcarboxylate, 7-Oxabicyclo[4.1.0]hept-3-yl-methyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate, 7-Oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate
Lindoxy 190 is a general-purpose cycloaliphatic epoxy resin with a low viscosity. It has been found to be useful for potting and composite applications, which require good electrical resistance properties, good weatherability, and high glass transition temperatures.
Crosslink Technology Inc.
Crosslink Technologies XHD1019
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Potting, Casting
End Uses:
Electrical/Electronic Applications, Electrical Components, General Purpose, Encapsulant
Volume Resistivity:
2000000000000.0 - 2000000000000.0 Ohm-m
XHD1019 is a two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets ul94-v0 in house flammability testing.
Nylene
Nylene® 401D
Polymer Name:
Polyamide 6 (PA 6)
Processing Methods:
Injection Molding, Extrusion
Nylene Specially formulated nylon 6 molding resin possessing outstanding flow characteristics Ideally suited for applications requiring high flow properties and resistance to cracking Optimum processing conditions should provide a melt temperature of 450 - 470°F at nozzle