Products in Other Devices & Assemblies: Resin

MultiTech MultiFunctional L is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparency LED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs MultiTech MultiFunctional L is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Aegis® PIR-H35ZI resin from AdvanSix contains 100% post-industrial recycled (PIR) raw materials while providing the same top performance and processability as Aegis® H35ZI, its standard, non-recycled counterpart.Aegis® PIR-H35ZI resin is an unfilled, low viscosity, non-lubricated nylon 6 injection molding homopolymer exhibiting excellent melt flow properties for filling thin sections and reduced cycle times. Aegis® PIR-H35ZI homopolymer exhibits good strength, stiffness and toughness as well as excellent heat, chemical and abrasion resistance.

Aegis® H8202NLB is an unfilled, low/medium viscosity, non-lubricated nylon 6 injection molding homopolymer exhibiting excellent melt fluidity for filling thin sections. It exhibits good strength, stiffness and toughness as well as excellent heat, chemical and abrasion resistance.

Aegis® H35ZI is an unfilled, low viscosity, non-lubricated nylon 6 injection molding homopolymer exhibiting excellent melt flow properties for filling thin sections and reduced cycle times. It exhibits good strength, stiffness and toughness as well as excellent heat, chemical and abrasion resistance.

Aegis® H8202NL resin is a 2.6 RV, unfilled, low/medium viscosity, non-lubricated, nylon 6 homopolymer. It combines good strength, stiffness and toughness with excellent heat, chemical and abrasion resistance.

Aegis® PIR-H8202NLB resin from AdvanSix contains 100% post-industrial recycled (PIR) raw materials while providing the same top performance and processability as Aegis® H8202NLB, its standard, non-recycled counterpart.Aegis® PIR-H8202NLB resin is an unfilled, low/medium viscosity, non-lubricated, nylon 6 homopolymer. It exhibits good strength, stiffness, and toughness as well as excellent heat, chemical and abrasion resistance.

Akulon® Ultraflow XG-FKGS6 is a high-performance polyamide 6 and polyamide 66 material trusted worldwide for applications in automotive, electronics, electrical, furniture, and packaging. In molded parts, it delivers an impressive blend of design simplicity and processing ease, along with exceptional mechanical properties across a wide temperature range and diverse conditions. For extrusion, it sets industry benchmarks, featuring remarkable strength, resilience, and ease of processing. This product boasts special features including 30% glass reinforcement, flame retardancy (halogen-free), and being best suited for injection molding.

ForTii® F11 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It provides an excellent balance of flow, toughness, and stiffness, enabling the production of thin walls or complex geometries in electronics and electrical applications. The material is VDE (Verband der Elektrotechnik) approved for all colors, has a high RTI electrical rating of 140 °C at 0.75 mm, and a CTI rating of 800 V, ensuring thermal and electrical performance. It is phosphorous-free and VDE-certified. The processing technology for this product is injection molding.

Akulon® SG-KGS6 is a high-performance material that combines the properties of polyamide 6 and polyamide 66. It is widely used in various industries, including automotive, electronics, electrical, furniture, and packaging. Whether applied in molded parts or extrusion processes, Akulon® SG-KGS6 stands out for its exceptional combination of design flexibility, easy processing, and outstanding mechanical properties. It performs well over a wide temperature range and under diverse conditions.

ForTii® F12 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It exhibits an excellent balance of stiffness and toughness, making it suitable for high-mechanical load applications such as power connectors or electric vehicle (EV) parts. With a high RTI electrical rating of 140 °C at 0.75 mm and JEDEC (Joint Electron Device Engineering Council) Level 2 performance, it allows for surface mount technology (SMT) processes without deformation and with a low risk of blistering. The processing technology for this product is injection molding, and it is phosphorous-free.

ADEKA™ EP-4000, identified by the polymer name epoxy resins and compounds, finds application in engineered and electrical/electronic applications. Noted for its material features of good adhesion and flexibility, this product is specifically tailored for processing methods such as casting in plastics and elastomers. ADEKA™ EP-4000 stands as a reliable choice in industries where superior adhesion, flexibility, and versatile processing methods are essential.

ADEKA™ EP-4300E, a premier epoxy resin and compound polymer, stands out for its technological prowess in plastics. Engineered with materials featuring low viscosity, it caters to the intricate demands of electrical and electronic applications. Its excellence extends to processing methods, particularly casting, making it the top choice for industries seeking superior performance and reliability.

ADEKA™ EP-4100G, a variant of epoxy resins and compounds, stands out with its general-purpose material features. Specifically designed for plastics and elastomers processed using casting methods, this polymer finds versatile applications. Its end uses span across electrical and electronic applications and general-purpose industrial scenarios, making ADEKA™ EP-4100G a reliable choice for various manufacturing needs.

ADEKA™ EP-7001, an epoxy resin and compound polymer, is a cutting-edge solution in the realm of plastics technology. Tailored for casting methods, it exhibits remarkable features like good adhesion and flexibility. Positioned for excellence, ADEKA™ EP-7001 finds its applications in the automotive and transportation and electrical and electronics markets, meeting the demands of electrical and electronic applications and engineering applications with precision.

ADEKA™ EP-4400, a distinguished epoxy resin and compound polymer, excels at catering to the specialized needs of electrical, electronic, and engineered applications. Engineered for casting, its material features, including its amorphous nature and good adhesion, make it an optimal choice for industries requiring reliability and top-notch performance.

UL 94 V0, 30 % glass fiber, PBDE & PBDF free, excellent mechanical properties and good electrical features.

UL 94 V0, 45% mixed mineral filled and glass fiber, PBDE - PBDF free, excellent dimensional stability, excellent electrical properties CTI >

UL 94 V0 at 1,6 mm, copolymer, halogen free, excellent electrical properties, RoHS.

High heat resistance ABS plating grade. Benefits: Enhanced heat resistance; Better dimensional under heat; Excellent balance of heat resistance, impact strength and flowability. Typical Applications: Decorative interior parts, Profiles, Radiator grille, Tailgate handles. Chemical Composition: Acrylonitrile-butadiene-styrene (ABS) copolymer modified with poly(styrene-co-maleimide) (SMI).

Very high heat resistance ABS. ISO shortname: ISO 2580-1 ABS 2-M, MG, 115-08-09-20. Benefits: Increased flow; Super low emission grade; Very high vicat softening point ABS grade suitable for interior and exterior applications; Lower mold deposits in injection molding processing applications; Better dimensional under heat. Chemical Composition: Acrylonitrile-butadiene-styrene (ABS) copolymer modified with poly(styrene-co-maleimide) (SMI).

PC/ABS blend, injection molding grade with excellent mechanical properties balance up to -40ºC. Vicat B120 = 120ºC. Major Benefits: High flow; Very high impact up to -40ºC; Low emission grade; UV stabilized grade; Good stability even with high humidity conditions; Low shrinkage; Good paintability; Thin-walled parts. Typical Applications: Radiator grille, Pillars, Instrument panel parts, Seating parts, Center console trim, Door components, Small household, Electrical switches, distribution boards, power sets. Chemical composition: Thermoplastic polymer blend based on polycarbonate (PC) and acrylonitrile-butadienestyrene (ABS).

UL 94 V0, 30% mixed mineral filled and glass fiber, PBDE - PBDF free, good electrical and thermal features.

High heat resistance ABS. Benefits: Increased flow; Good process ability behavior; Super low emission grade; Lower mold deposits in injection molding processing applications; Better dimensional under heat. Chemical Composition: Acrylonitrile-butadiene-styrene (ABS) copolymer modified with poly(styrene-co-maleimide) (SMI).

UL 94 V0, halogen and red phosphorus free, excellent mechanical properties and electrical features.

UL 94 V0 at 0,8 mm, PBDE & PBDF free, excellent mechanical properties and good electrical features, GWFI 960/1-2 GWIT 775/1-2.

Increased chemical resistance compared to P2H-AT, contains antistatic additive. Major Benefits: Chemical resistance; High gloss; Medium impact. Typical Applications: Telephones, Electronic boards, housings, Refrigerator door handles.

GLAMIDE® T-656E is a Polyamide 66 (Nylon 66) product. It is available in North America.Characteristics include: Flame Rated Wear Resistant

Vamp Tech Vampamid™ HT 4026 V0 40% glass fiber reiforced, low water absorption, good mechanicals properties, good electrical features, high chemical resistance and excellent operating temperature, UL 94 V0 at 0.8 mm, GWFI 960/1-2

Standard impact strength, easy flowing, high gloss, contains antistatic additive. Benefits: High flow; Gloss with antistatic additive. Typical Applications: Washing machine panel, Kitchen & Coffee Machines, Electrical switches, Distribution boards, Power sets, Cosmetic Compact.

UL 94 V2, PBDE & PBDF free, good mechanical properties and good electrical features, GWFI 850/1-2 GWIT 775/1-2.