Products in Potting Compounds

Portaflame® SG10 LV-02 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.

Portaflame® SG 100 LV is produced from carefully selected synthetic aluminum hydroxide (ATH). This range of Portaflame® SG -LV are "low viscosity" optimized grades with exceptional low oil absorption values, giving the formulator the opportunity to achieve higher loading levels in different polymer systems. It is used in aluminum sandwich panels to make them flame retardant.

IMSIL® A-10 is a microcrystalline silica filler that is produced from an inert, naturally occurring alpha quartz with a unique grape-like morphology. Easily wetted and dispersed in either solvent or water-based systems, IMSIL® is selected for its excellent tint retention, durability over prolonged exposure, and resistance to dirt and weathering.

Portaflame® SG 100 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.

IMSIL® A-8 is a microcrystalline silica filler that is produced from an inert, naturally occurring alpha quartz with a unique grape-like morphology. Easily wetted and dispersed in either solvent or water-based systems, IMSIL® is selected for its excellent tint retention, durability over prolonged exposure, and resistance to dirt and weathering.

Portaflame® SG 10 LV is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation. Portaflame® SG 10 LV is a "low viscosity" optimized grade with an exceptional low oil absorption value, giving the formulator the opportunity to achieve higher loading levels.

Portaflame® SG 30 LV is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG 30 LV is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation. Portaflame® SG 30 LV is a "low viscosity" optimized grade with an exceptional low oil absorption value, giving the formulator the opportunity to achieve higher loading levels. Portaflame® SG 30 LV makes formulations that are flame retardant.

Portaflame® SG 50 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.

Boratherm™ SG200 E is produced from carefully selected synthetic aluminum hydroxide (ATH). Boratherm™ SG-E grades are used in various applications because of their high thermal conductivity, flame retardancy, smoke suppression, and low viscosity. Combining these grades with finer products (ATH or Al2O3-based) makes it possible to obtain a high packing density, resulting in excellent thermal conductivity. Boratherm™ SG is perfectly suited for formulations needing good flowability. It is specially designed to offer an ultra-low surface area and large particle sizes.

Boratherm™ SG150 E is produced from carefully selected synthetic aluminum hydroxide (ATH). Boratherm™ SG-E grades are used in various applications because of their high thermal conductivity, flame retardancy, smoke suppression, and low viscosity. Combining these grades with finer products (ATH or Al2O3-based) makes it possible to obtain a high packing density, resulting in excellent thermal conductivity. Boratherm™ SG is perfectly suited for formulations needing good flowability. It is specially designed to offer an ultra-low surface area and large particle sizes.

Portaflame® SG 40 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.

Portaflame® SG 10 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.

Portaflame® SG 25 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.

Portaflame® SG 20 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.

Portaflame® SG 35 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.

Boratherm™ SG 200LVS is a blended product produced from carefully selected synthetic aluminum hydroxide (ATH). This product is used in applications where heat-dissipation and fire-retardancy are critical properties, e.g., in thermal interface materials (including electronic vehicle battery heat management), casting resins for power transformers, and potting and encapsulating materials in electric and electronic applications. The particle size distribution of the Boratherm™ SG 200LVS is already optimized, so blends with other finer or coarser aluminum-containing grades are no longer needed to obtain the optimum packing density, resulting in the right balance between flow and thermal conductivity.

Crestabond® M1-04SL Structural Adhesive is a toughened, two-component 10:1 acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts.

Cosmic Epoxy E4920FC is a mineral-filled epoxy molding compound available either in granular form or preformed in a variety of sizes and weights. It offers excellent moisture resistance, thermal cycling stability, and outstanding moldability. Parts molded from this material also resist fungus growth and are designed for the encapsulation of passive devices such as capacitors, inductors, diodes, and rectifiers.

Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Farboset® 2720 is a mineral-filled epoxy molding compound known for its rapid curing, exceptional moldability, and remarkable resistance to thermal shock and moisture. This compound is tailored to offer enhanced protection against moisture ingress and boasts a high glass transition temperature, making it an ideal choice for ensuring reliability in performance. Its primary purpose is to encapsulate a wide variety of electronic devices, including tantalum and ceramic capacitors, resistors, and resistor networks, providing them with a robust shield against environmental factors and mechanical stress.

Farboset® 1707-2 is a mineral and glass-filled, anhydride epoxy molding compound that is engineered for the encapsulation of various electrical and electronic components. It is specifically formulated to provide high thermal shock resistance, making it ideal for protecting components that may be subjected to rapid temperature changes or other harsh environmental conditions. This compound helps ensure the reliability and durability of encapsulated components.

Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.

DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.

Farboset® 2461 is a mineral-filled novolac epoxy molding compound that offers fast cure rates, excellent moldability, and superior thermal shock and moisture resistance. It has been formulated to achieve a high glass transition temperature, making it suitable for applications requiring optimal reliability performance, even in very thin sections. Farboset® 2461 is designed for encapsulating a wide range of electronic devices, including capacitors, resistors, resistor networks, and inductor coils, ensuring their protection and reliability in various operating conditions.

Cosmic Epoxy EH31 is an iron-filled epoxy molding compound available in a granular form with a black color. This material is designed for EMI/RFI shielding applications. It can be used for compression or transfer molding to create core rods and encapsulate surface mount and axial leaded inductors. Using this single molded compound can streamline the manufacturing process and eliminate the need for labor-intensive over/under molding.

Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.

Cosmic Epoxy EH21 is an iron-filled epoxy molding compound provided in a black granular form. It is well-suited for applications requiring EMI (Electromagnetic Interference) and RFI (Radio-Frequency Interference) shielding. This material can be molded through compression or transfer molding processes to create core rods or to encapsulate surface mount and axial leaded inductors. It offers the advantage of simplifying the molding process by eliminating the need for labor-intensive over/under molding.

Cosmic Epoxy E4920AC is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it suitable for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

DAP 306 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon and supplied in flake form. It is suitable for a variety of applications, including switches, terminals, insulators, cups, cases, and other components that require strength as well as chemical and moisture resistance. It can also be used for the encapsulation of electrical and electronic components.

Farboset® 1708 is a specialized epoxy molding compound that combines mineral and short glass fillers, making it well-suited for the encapsulation of coils and other electrical and electronic components. It offers excellent moldability, which is important for achieving precise shapes during the encapsulation process. One of its standout features is its extreme resistance to thermal shock, meaning it can withstand rapid changes in temperature without cracking or degrading.

Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.

Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.

Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.

DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.

Cosmic Epoxy E4920AT is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and comes in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.