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Potting Compounds
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509 Products found in Potting Compounds
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Cosmic Plastics
Cosmic Epoxy E4920CD
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920CD is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, offered as granules, preforms, or powders, and is available in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy E4920
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Diodes, Inductor, Rectifier, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4920 is a mineral-filled epoxy molding compound available either in granular form or preformed in various sizes and weights. It features excellent moisture resistance, thermal cycling stability, and remarkable moldability. Furthermore, parts molded from this material do not support fungus growth, and it is specifically designed for the encapsulation of passive devices, including capacitors, inductors, diodes, and rectifiers.
Cosmic Plastics
Farboset® 2510
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Capacitors
Farboset® 2510 is a mineral-filled, novolac epoxy molding compound known for its fast cure rates at low temperatures, excellent laser markability, and good moldability. This compound is specially formulated for encapsulating surface mount ceramic and tantalum capacitors, as well as other applications that demand quick cycle times. Its unique properties and rapid curing make it well-suited for applications where fast production and efficient marking are essential.
Cosmic Plastics
Cosmic Epoxy E4940P
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Optical Fiber Connector, Resistor Network
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4940P is a mineral-filled, glass-reinforced epoxy molding compound supplied in granular form. It is specifically designed for high-volume encapsulation applications, particularly for resistor networks and fiber-optic connectors. This compound offers high quality, reliability, and good moldability for such applications.
Cosmic Plastics
Cosmic Epoxy E4930R
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Transistor, Resistor, Optocoupler, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.
Cosmic Plastics
Farboset® 2270
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Resistor, Capacitors, Encapsulant
Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.
Cosmic Plastics
DAP D44/6160
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Housings, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1740.0 - 1740.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP D44/6160 is a mineral-filled, special-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It can be easily molded using compression, transfer, or injection equipment and can be readily preformed. It surpasses all mineral compounds available today in terms of mechanical and electrical properties. It boasts extremely low water absorption, high dielectric strength, and a low dissipation factor, along with high tensile strength, exceptional arc resistance, and excellent resistance to high temperatures.
Cosmic Plastics
Farboset® 2220
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Bushings, Encapsulant, Insulators
Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.
Cosmic Plastics
Cosmic Epoxy EH81
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
Farboset® 2500
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Capacitors
Farboset® 2500 is a mineral-filled, flame-retardant, novolac epoxy molding compound that offers fast cure rates at low temperatures, laser markability, and good moldability. This compound is formulated for encapsulating surface mount ceramic and tantalum capacitors, along with other applications that require quick cycle times. Its flame-retardant properties make it suitable for applications where fire safety is a concern, while its rapid curing and ability to be laser marked enhance its utility in modern production processes.
Cosmic Plastics
Cosmic Epoxy EH51
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH51 is an iron-filled epoxy molding compound available in a black granular form. It is designed for EMI/RFI shielding applications and can be used in compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the labor-intensive over/under molding.
Cosmic Plastics
Cosmic Epoxy E4920D
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Diodes, Inductor, Rectifier, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4920D is a mineral-filled epoxy molding compound that is available in either granular form or as preformed shapes in various sizes and weights. This compound is commonly used for molding applications and offers good versatility in manufacturing processes.
Cosmic Plastics
Cosmic Epoxy E4920VS
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920VS is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy E4940S
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Optical Fiber Connector, Resistor Network
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4940S is a mineral-filled epoxy molding compound supplied in granular form. It offers excellent dimensional stability, improved thermal cycling properties, and exceptional moisture resistance. This product is specifically designed for high-volume encapsulation of resistor networks and fiber-optic connectors that demand high quality, reliability, and excellent moldability.
Cosmic Plastics
Farboset® 5000
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Power Transformers, Coils, Switches, Encapsulant, Solenoid Coil
Farboset® 5000 is a novolac epoxy molding compound that contains mineral and glass fillers. It is specifically designed for applications where fast curing, high hot strength, and low abrasion resistance are essential. This compound is well-suited for the encapsulation of solenoid coils and similar applications where electrical and thermal performance are critical.
Cosmic Plastics
DAP K43/6260
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Housings, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1800.0 - 1800.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP K43/6260 is a versatile diallyl iso-phthalate molding compound that is filled with minerals and supplied in granular form. This compound is designed for ease of use and versatility. It pours easily, can be preformed, and molds readily using standard compression, transfer, or injection equipment. What sets K43/6260 apart is its exceptional heat resistance, high arc resistance, and ease of molding around inserts. These features make it an ideal choice for applications that demand high-temperature performance and electrical insulation properties, while still allowing for straightforward processing and customization.
EM Sullivan
Cardolite® NX - 9201LP
Chemical Family:
Polyester Diols, Polyols, Cashew Nut Shell Liquid (CNSL) Polyols
Hydroxyl Value:
65.0 - 80.0 mg KOH/g
Cardolite® NX - 9201LP is a polyester diol based on cashew nutshell liquid technology.
EM Sullivan
Cardolite® NC - 513
Chemical Family:
Ethoxylates, Epoxy & Epoxy Derivatives
Labeling Claims:
Solvent-free
Cardolite® NC - 513 is a monofunctional reactive epoxy diluent used to increase flexibility, impact resistance, water resistance, and flexural strength. It has low viscosity and volatility, making it ideal for formulating solvent-free adhesives. It exhibits good water resistance and reacts completely into the epoxy network, enhancing bond strength.
EM Sullivan
Cardolite® NX - 9203LP
Chemical Family:
Polyester Diols, Polyols, Cashew Nut Shell Liquid (CNSL) Polyols
Hydroxyl Value:
90.0 - 125.0 mg KOH/g
Cardolite® NX - 9203LP is a polyester diol based on cashew nutshell liquid technology.
Cosmic Plastics
Farboset® 1190
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Coils, Switches, Encapsulant, Power Transformers
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
137.788 - 137.788 MPa
Farboset® 1190 is a fast-curing epoxy molding compound that is mineral and glass-filled, and it contains improved strength properties. It is specially designed for encapsulating a variety of electrical and electronic components, such as coils, transformers, switches, and more. Farboset® 1190 is known for its excellent thermal shock resistance and superior resistance to cracking, making it a reliable choice for these applications.
Cosmic Plastics
Cosmic Epoxy E4920H
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920H is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
EpoxySet Inc.
URACAST™ UC-2356
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2356 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
EPOXIBOND™ EB-430-1HT
Chemical Family:
Epoxy & Epoxy Derivatives
Ready to Use Product Type:
Encapsulant
Application Areas:
Power Transformers, Semiconductors, Integrated Circuits, Electrical Components
EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.
EpoxySet Inc.
URACAST™ UC-2524
Ready to Use Product Type:
2K (2 component) Adhesive, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2524 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
URACAST™ UC-2350
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2350 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
EpoxySet Inc. UB-50
Ready to Use Product Type:
Encapsulant, Potting Compound, 2K (2 component) Adhesive
Compatible Substrates & Surfaces:
Metal, Plastics, Ceramic
Chemical Family:
Urethanes
UB-50 is a clear, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent bond to metals, ceramics, and many plastics used in medical industry such as acrylic, polycarbonate, PVC etc. They also have excellent water resistance, and are exceptionally resistant to thermal shock. They can be used as an adhesive or for potting, casting and encapsulating applications.
EpoxySet Inc.
URACAST™ UXP-052107-1
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UXP-052107-1 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release.
EpoxySet Inc.
EPOXICAST™ EC-1850FT/EH-10E
Ready to Use Product Type:
Potting Compound, Encapsulant
Application Areas:
Oscillators, Power Transformers, Amplifiers
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
EpoxySet Inc.
EPOXICAST™ 1006M-4
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.
EpoxySet Inc.
URACAST™ UC-2521
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2521 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
EpoxySet Inc. EC-1012M/EH-20M
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
EpoxySet Inc.
EPOXICAST™ EC-1015
Ready to Use Product Type:
Potting Compound, Encapsulant
Application Areas:
Power Transformers, Oscillators, Semiconductors, Amplifiers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
EpoxySet Inc.
EpoxySet Inc. EC-1012MFR-HT
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
EpoxySet Inc.
EPOXICAST™ EC-1006
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.
EpoxySet Inc.
EPOXICAST™ EC-1009
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
Creative Materials Inc.
Creative Materials 102-12A/B
Ready to Use Product Type:
Epoxy Sealant, Potting Compound, 2K (2 component) Sealant
Cure Method:
Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
102-12 is a black, two component thermally conductive epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12 is an improved, crack-resistant version of F947. Use with standard Part B for room temperature cure.FeaturesThermal cycle resistantBlack, epoxy compound.Room temperature cureImproved crack resistanceHigh thermal conductivity
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