Products in Appliances & Electronics: Resins, Binders & Matrix Mater...

Biresin® CR144 is a three component, anhydride cured, low viscosity epoxy resin system suitable for the production of high performance fi bre reinforced composites.

Biresin® CR201 is a three component, anhydride cured, low viscosity epoxy resin system suitable for the production of high performance fi bre reinforced composites with outstanding heat resistance.

LFT-G® PA6-NA-LGF20 is a Nylon 6 (Polyamide 6 Polymer Matri with Long glass fiber type with 20% fiber Content in Natural color, and and custom colors.

Havel Composites CZ sro Epoxy resin LH 330 is suitable for curing at room temperature. Suitable hardener: H330, mixing ratio: 100:40 weight, or 100:50 volume. Gel time at 25°C is 70min. Heat resistance: 50°C. Designed for the production of coatings and surface finish of various parts. It is possible to engrain it by pigment pastes for epoxides.

SWANCOR 2555 is a high Tg hot-melt epoxy resin. The formula does not contain Diuron and volatile ingredients. It has the characteristics of light weight, excellent mechanical strength, heat resistance and corrosion resistance.

LFT-G® LFT-PA6-NANG03 is a Nylon 6 (Polyamide 6 Polymer Matri with Long glass fiber type with 30% fiber Content in Natural color, and and custom colors.

Polydyne® 7030 - low viscosity, high reactivity for RTM light by vacuum process. It is generally used in composites applicatons.

SolverPI Profile 2800 is suitable for molding all kinds of bearing, sleeve, gear box, mold, electronic components, with the characteristics of high temperature resistance, good toughness, flame retardant, can partially replace USA DuPont Vespel brand product.