Products in Appliances & Electronics: Resins, Binders & Matrix Mater...

SILRES® K is a solution of a condensation-curing methyl silicone resin in toluene. The product can be used as a binder or as an impregnation agent for porous materials. Besides, SILRES® K is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® K has a very low carbon content and thus yields a high ash content when pyrolized. Composites made of SILRES® K show long-term stability against weathering, moisture, and UV light. They can therefore be continuously exposed to constantly changing climatic conditions, UV radiation, and temperatures significantly higher than 300 °C (572 °F). SILRES® K also provides water repellency and excellent electrical insulation properties to the respective composite materials.

SILRES® H62 C is a liquid, solvent-free, one-part heat-curing phenyl silicone resin formulation. The product is ideal for impregnating the electrical coils of motors and generators. Besides, SILRES® H62 C can be used to provide hydrophobic properties to porous materials and as a binder for composites made of fibrous fillers, cloths, and woven or non-woven reinforcing materials. The formulation is ready-to-use and crosslinks under heat. While curing, SILRES® H62 C does not release chemical byproducts, so curing shrinkage is barely noticeable. The product also thermosets in thick layers, even when in contact with air. Fully cured SILRES® H62 C has excellent electrical insulation properties and outstanding long-term heat resistance. Additionally, it shows high stability against weathering, moisture, and UV light and can therefore be continuously exposed to constantly changing climatic conditions or UV radiation.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SILRES® H 44 is a powdered, condensation-curing phenyl silicone resin with excellent solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Due to its compatibility with organic resins, SILRES® H 44 can also be used to modify or partly replace phenolic resins in the respective compounds. Compared to other silicone resins, SILRES® H 44 cures relatively quickly at elevated temperatures. It is therefore particularly suitable for fully automated production lines.

SILRES® MK Powder is a condensation-curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Additionally, SILRES® MK Powder is the ideal product for making tack-free prepregs with excellent storage stability. When fully cured, SILRES MK POWDER has the lowest carbon content among all WACKER silicone resins, resulting in a high ash content when pyrolized. Composites made of SILRES® MK Powder exhibit long-term stability against weathering, moisture, and UV light. They can be continuously exposed to changing climatic conditions, UV radiation, and temperatures exceeding 300 °C (572 °F). Furthermore, SILRES® MK Powder provides water repellency and excellent electrical insulation properties to the composite materials.

SILRES® MK Flakes is a condensation-curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Besides, SILRES® MK Flakes is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® MK Flakes has the lowest carbon content of all WACKER silicone resins and thus yields a very high ash content when pyrolized. Composites made of SILRES® MK Flakes show long-term stability against weathering, moisture, and UV light. They can therefore be continuously exposed to constantly changing climatic conditions, UV radiation, and temperatures significantly higher than 300 °C (572 °F). SILRES® MK Flakes also provides water repellency and excellent electrical insulation properties to the respective composite materials.

Akulon® Ultraflow K-FG6 is a high-performance polyamide 6 and polyamide 66 material trusted by customers globally in automotive, electronics, electrical, furniture, and packaging applications. It excels in molded parts, offering a superb blend of design ease and processing efficiency, delivering outstanding mechanical properties across diverse conditions and a wide temperature range. In extrusion, it establishes industry-leading standards, boasting exceptional strength, resilience, and ease of processing. Injection molding is the preferred processing technology, and notable features include 30% glass reinforcement and high flow characteristics.

EcoPaXX® Q-DWX6 is a long aliphatic polyamide with excellent mechanical and flow performance, suitable for food contact and drinking water applications. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It has good surface properties and meets the requirements for drinking water contact grade. It is also 30% glass-reinforced and meets the standards for food contact quality.

EcoPaXX® Q-HG10 is a long aliphatic polyamide with excellent chemical and hydrolysis resistance. It is suitable for thermal management applications and other structural parts. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It is heat stabilized and contains 50% glass reinforcement.

Akulon® K224-PG6 is a polyamide 6 (PA 6) resin used in composite materials and plastics. It offers features like impact modification, lightweight properties, and a UL flame rating. It finds applications in consumer goods (appliances and electronics), automotive and transportation (exterior, interior, and safety systems), and more.

ForTii® Ace MX53 is a polyphthalamide (PPA) with unique fatigue performance and chemical resistance. Its high aromatic content and high Tg lead to excellent part stiffness and low creep, even at temperatures up to 150 °C. Moisture uptake occurs slowly, with minimal impact on dimensions. ForTii® Ace MX53 is processed using injection molding technology and is heat stabilized. It is 50% glass-reinforced and suitable for automotive applications.

Akulon® K224-PG8 is a polyamide 6 (PA 6) resin utilized in composite materials and plastics, featuring impact modification and lightweight properties. It is applied in various sectors, including consumer goods (appliances and electronics, furniture), automotive, and transportation (chassis, brakes, exterior, interior, safety systems, seating).

Akulon® K224-G6 is a polyamide 6 (PA 6) resin known for being lightweight and UL flame-rated. They find applications in various markets, including automotive and transportation, consumer goods, healthcare, and pharma, as well as industrial applications. This product is processed through injection molding.

Akulon® K224-LPG6U is a polyamide 6 (PA 6) material often reinforced with glass fibers to enhance its mechanical properties. This reinforced material exhibits good UV stability and impact resistance and is lightweight. It finds applications across various markets, including automotive and transportation, consumer goods, and industrial sectors. The addition of glass fibers improves its overall performance and durability in these applications.

Akulon® K224-HGM35 is a polyamide 6 (PA 6) resin that is heat stabilized and lightweight, which makes it ideal for use in various industries such as automotive and transportation, consumer goods, and electrical and electronics. They are typically processed using injection molding techniques.

ForTii® Ace MX52 is a polyphthalamide (PPA) with unique fatigue performance and chemical resistance. Its high aromatic content and high Tg lead to excellent part stiffness and low creep, even at temperatures up to 150 °C. Moisture uptake occurs slowly, with minimal impact on dimensions. ForTii® Ace MX52 is processed using injection molding technology and is heat stabilized. It is 40% glass-reinforced and suitable for automotive applications.

Akulon® Ultraflow K-FG0 is a high-performance polyamide 6 and polyamide 66 material used worldwide in automotive, electronics, electrical, furniture, and packaging applications. It excels in molded parts, providing a fine balance between design ease and processing efficiency while delivering remarkable mechanical properties across a broad temperature range and various conditions. In extrusion, it sets industry standards with its exceptional strength, resilience, and ease of processing. Ideal for injection molding, its notable features include 50% glass reinforcement and high flow capabilities.

Akulon® K224-TG9 is a polyamide 6 (PA 6) resin, a member of the polyamide chemical family. It can be reinforced with glass fibers and incorporate glass fiber fillers during its processing, primarily utilizing the injection molding method. This product is used in various markets, including automotive, transportation, and consumer goods, where it finds a wide range of applications.

Akulon® K224-PG3 is a polyamide 6 (PA 6) resin material used in composite materials and plastics. It features impact modification, lightweight properties, and a UL flame rating. It finds applications in automotive, transportation, and consumer goods. This is typically processed using injection molding techniques.

Akulon® K224-G6U is a polyamide 6 (PA 6) resin known for its lightweight properties and finds applications in various industries, including consumer goods, particularly appliances and electronics, as well as in the automotive and transportation sectors, for both exterior and interior components.

EcoPaXX® Q-DWX10 is a long aliphatic polyamide with excellent mechanical and flow performance, specifically designed for food contact and drinking water applications. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It has good surface properties and meets the requirements for drinking water contact quality as well as food contact quality.

Akulon® SafeConnect SC22 is a high-performance material that combines the properties of polyamide 6 and polyamide 66. This material is widely used by customers in various industries, including automotive, electronics, electrical, furniture, and packaging. Whether used in molded parts or extrusion, Akulon® SafeConnect SC22 offers an excellent balance between ease of design and processing while delivering exceptional mechanical properties across a broad temperature range and in diverse conditions.

espol™ 26.00 is a non-accelerated orthophthalic polyester resin that rapidly wets out reinforcements. It is formulated as a pultrusion grade, providing fast line speeds for products requiring high temperature exposure and a good finish. It can be used with all types of glass fibers, such as chopped strand mat, woven roving, and multi-axials. Typical applications include channels, angles, ladders, and special panels for appliances.

espol™ 27.01 is a non-accelerated orthophthalic polyester resin that rapidly wets out reinforcements. It is specially formulated for use in the dough molding impregnation (DMC) process and is highly reactive. It is suitable for products that require good end-product manufacturing efficiency and finish. It is designed for hot mold processes such as SMC and DMC with good catalyzed stability.