Valtron® AD1238A-AD3853B Epoxy System

Valtron® AD1238A-AD3853B Epoxy System is a temporary adhesive system for monocrystalline and multicrystalline ingots for wafer slicing. Longer working time than AD1238-A / AD3848-B.

Brand: Valtron (48 products)

Product Type: 2K (2 component) Adhesive

Application Area: Photovolatics

Chemical Family: Epoxy & Epoxy Derivatives

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Features & Benefits

Applications & Uses

Markets
Applications
Application Area
Application
  • Increased gel time version of AD1238-A /AD3848-BR system

Properties

Color
Component A
ValueUnitsTest Method / Conditions
Viscosity (25°C)70000cps-
Specific Gravity1.21--
Mixing Ratio (By Weight)1--
Component B
ValueUnitsTest Method / Conditions
Viscosity (25°C)23000cps-
Specific Gravity1.31--
Mixing Ratio (By Weight)1--
Mixed System Properties
ValueUnitsTest Method / Conditions
Gel Time¹15minutes-
Cure Time²4hrs-
Working Time⁴10minutes-
Hardness84Shore D-
Bond Strength⁵ (4 hrs)min. 2,000psi-
Bond Strength⁵ (8 hrs)min. 2,500psi-
Glass Transition Temperature³35°C-
Slurry CompatibilityPEG--
Note

¹Gel Time condition 100 g @ 77ºF (25ºC). Setup time, solidification time.
²Cure Time conditions @ 77ºF (25ºC) Time needed prior to ingot slicing, recommended as starting point.
³Glass Transition Temperature using DSC Method
⁴Working Time, 50g @ 77ºF (25ºC), recommended maximum time.
⁵Typical minimum value only applicable to Valtech test method, not as specification, not to compare to other test methods.

Technical Details & Test Data

Demounting
Epoxy System Debonding Solution Temperature(°C) Time Required
AD1238-A
AD3853-B
Water 90 max. 20
Acetic Acid min. 30 max. 30
Citric Acid (>10% by wt.) min. 50 max. 30
VALTRON® DP164 (>12% by vol.) min. 50 max. 30
VALTRON® SP2500 min. 75 max. 20