Valtron

Valtron® SP2200 is a Alkaline blend of anionic and nonionic surfactants and solvent for complete contamination removal.

Valtron® SP2260 is a Noncaustic detergent containing surfactants for effective removal of hydrocarbons and particles.

Valtron® SP2700-KB is a Acidic detergent with a unique surfactant system.

Valtron® DP188 is a Alkaline blend of surfactants that provide a hydrophilic-lipophilic balance when removing difficult contamination.

Valtron® DP153 is a High-purity alkaline detergent that has low surface tension properties.

Valtron® DP154 is a Neutral pH detergent with a blend of cationic and nonionic surfactants for cleaning materials sensitive to acids and alkalis.

Valtron® DP211 is a Non-foaming high-purity alkaline detergent with a unique blend of amphoteric surfactants.

Valtron® DP97031 is a Neutral pH detergent that contains no anions.

Valtron® MD6000 is a High-purity alkaline detergent.

Valtron® MD6100 is a High-purity acidic detergent with a unique blend of surfactants.

VALTRON® TriAct™ DF dicing fluid series are formulated with nonionic surfactants, disinfecting actives and other functional ingredients for application in the semiconductor wafer dicing process. They eliminate silicon dust particles effectively, disinfect production system pipelines, provide easy rinse with low and fast collapsing foam profile, help to stop microbial growth activity in concentrate or low dilution, prevents corrosion, and reduces and neutralizes static charges. In addition to cleaning, VALTRON® TriAct™ DF series lubricate the dicing blades, which lowers friction and surface tension dramatically at dilution rate up to 1:4000, and acts as a coolant, which reduces heat that causes cracks in the silicon wafer.

VALTRON® TriAct™ DF dicing fluid series are formulated with nonionic surfactants, disinfecting actives and other functional ingredients for application in the semiconductor wafer dicing process. They eliminate silicon dust particles effectively, disinfect production system pipelines, provide easy rinse with low and fast collapsing foam profile, help to stop microbial growth activity in concentrate or low dilution, prevents corrosion, and reduces and neutralizes static charges. In addition to cleaning, VALTRON® TriAct™ DF series lubricate the dicing blades, which lowers friction and surface tension dramatically at dilution rate up to 1:4000, and acts as a coolant, which reduces heat that causes cracks in the silicon wafer.

VALTRON® TriAct™ DF dicing fluid series are formulated with nonionic surfactants, disinfecting actives and other functional ingredients for application in the semiconductor wafer dicing process. They eliminate silicon dust particles effectively, disinfect production system pipelines, provide easy rinse with low and fast collapsing foam profile, help to stop microbial growth activity in concentrate or low dilution, prevents corrosion, and reduces and neutralizes static charges. In addition to cleaning, VALTRON® TriAct™ DF series lubricate the dicing blades, which lowers friction and surface tension dramatically at dilution rate up to 1:4000, and acts as a coolant, which reduces heat that causes cracks in the silicon wafer.

VALTRON® TriAct™ DF dicing fluid series are formulated with nonionic surfactants, disinfecting actives and other functional ingredients for application in the semiconductor wafer dicing process. They eliminate silicon dust particles effectively, disinfect production system pipelines, provide easy rinse with low and fast collapsing foam profile, help to stop microbial growth activity in concentrate or low dilution, prevents corrosion, and reduces and neutralizes static charges. In addition to cleaning, VALTRON® TriAct™ DF series lubricate the dicing blades, which lowers friction and surface tension dramatically at dilution rate up to 1:4000, and acts as a coolant, which reduces heat that causes cracks in the silicon wafer.

VALTRON® TriAct™ DF dicing fluid series are formulated with nonionic surfactants, disinfecting actives and other functional ingredients for application in the semiconductor wafer dicing process. They eliminate silicon dust particles effectively, disinfect production system pipelines, provide easy rinse with low and fast collapsing foam profile, help to stop microbial growth activity in concentrate or low dilution, prevents corrosion, and reduces and neutralizes static charges. In addition to cleaning, VALTRON® TriAct™ DF series lubricate the dicing blades, which lowers friction and surface tension dramatically at dilution rate up to 1:4000, and acts as a coolant, which reduces heat that causes cracks in the silicon wafer.

VALTRON® TriAct™ DF dicing fluid series are formulated with nonionic surfactants, disinfecting actives and other functional ingredients for application in the semiconductor wafer dicing process. They eliminate silicon dust particles effectively, disinfect production system pipelines, provide easy rinse with low and fast collapsing foam profile, help to stop microbial growth activity in concentrate or low dilution, prevents corrosion, and reduces and neutralizes static charges. In addition to cleaning, VALTRON® TriAct™ DF series lubricate the dicing blades, which lowers friction and surface tension dramatically at dilution rate up to 1:4000, and acts as a coolant, which reduces heat that causes cracks in the silicon wafer.

Valtron® AD1238A-AD3848BR Epoxy System is a temporary adhesive system for monocrystalline and multicrystalline ingots for the wafer slicing, fast-curing and high bond strength. Applicable for automatic dispensing systems.

Valtron® AD1238A-AD3853B Epoxy System is a temporary adhesive system for monocrystalline and multicrystalline ingots for wafer slicing. Longer working time than AD1238-A / AD3848-B.

Valtron® AD1339A-AD3939B Epoxy System is a general temporary adhesive system which offers a unique solution for adhering semiconductor and photovoltaic ingots to mounting fixtures and slicing beams.

Valtron® AD1339A-AD3905B Epoxy System is a general temporary adhesive system for mounting monocrystalline and multicrystalline ingots for the photovoltaic and semiconductor wafer slicing process. Longer working time than AD1339-A / AD3939-B. Applicable for automatic dispensing systems.

Valtron® AD5038A-AD5038B Epoxy System is a low viscosity, temporary adhesive system ideal for slicing applications where polyethylene glycol (PEG), PEG/water and water coolant is used as a slicing vehicle or a coolant. It has good water resistance.

Valtron® AD1846A-AD1851B Epoxy System is a temporary adhesive system for mounting monocrystalline and multicrystalline ingots for the photovoltaic and LED wafer slicing process. It has good water resistance. Applicable for diamond wire saw with selected debonding solutions.