Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Fillers Included
- Plastics & Elastomers Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Benefits
- Cost effective
- Non-abrasive
- Minimal effect on color.
- Eliminates secondary shielding process.
- Features
- No secondary process.
- Used in any plastic molding application.
- Can be colored (but not suitable for bright colors such as yellow, white etc).
- Provides shielding of 50dB attenuation.
- Overview
- ECP 16E Stainless Steel Fiber Masterbatch
Applications & Uses
- Markets
- Applications
- Compatible Polymers & Resins
- Plastics & Elastomers End Uses
Properties
- Physical Form
- Physical Properties
Value Units Test Method / Conditions Charpy Impact Strength (Notched) 7.1 KJ/m² - Charpy Impact Strength (Unnotched) 15.9 KJ/m² - Deflection Temperature (Under Load at 0.45 MPa) 78 °C - Deflection Temperature (Under Load at 1.81 Mpa) 65 °C - Elongation 3.5 % - Flexural Modulus 2.19 GPa - Flexural Strength 58 MPa - Izod Impact Strength 55.1 J/m - Specific Gravity 1.35 g/cm² - Tensile Modulus 2.36 GPa - Tensile Strength 32.3 MPa -
Technical Details & Test Data
- Material Specification
- A masterbatch pellet
- Stainless steel fiber AIS1304, bonded with polymer specific binder
- In pellet form, 5mm chopped length
- Shielding Data
Shielding effectiveness measured using shielded room test MIL-STD 285 - 3mm thick plaque. 1% volume steel fiber.
- Binders
Other binders are available - ECP 12E using Emulsion based ethylene acrylic acid sinc ionomer binder, 25% by weight for use with Styremic Thermoplastics, PS, SAN, ABS, also PPO and PPE Alloys, Polypropylene/Polyolefines. ECP 20E with a polycarbonate binder 40% by weight, for use with polycarbonate, polysulphone, PES, PET, PEJ, PBT.
The masterbatch is added at very low levels ensuring minimal effect on color, mouldability and other base polymer properties by 1% by volume.
The use of this system allows shielded articles to be produced in one process without additional equipment, labor or secondary processing and provides cost effective solution to EMI shielding problems.