Sumitomo Bakelite Company

About Us

Among the various plastics, phenolic resin has the oldest history. It was developed by Dr. Leo H. Baekeland, an American of Belgian ancestry, in 1907 and he named that synthetic resin "Bakelite". In 1911, Sankyo Company (currently Daiichi Sankyo Co., Ltd.)

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Durez™ 00118 banner

Polymer Name:Phenol Formaldehyde (PF), Phenolic Compound
Processing Methods:Transfer Molding, Injection Molding, Compression Molding
End Uses:Electrical/Electronic Applications, General Purpose, Automotive Applications
Density:1400.0 - 1400.0 kg/m³
Tensile Strength:48.0 - 48.0 MPa

Durez™ 00118 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used Durez™ 00118 is certified as UL Flame Rated. It is available in Granules form.

Durez™ 29502 B banner

Durez™ 29502 B

Polymer Name:Phenol Formaldehyde (PF), Phenolic Compound
Processing Methods:Compression Molding
End Uses:Automotive Applications
Density:2100.0 - 2100.0 kg/m³
Tensile Strength:65.0 - 65.0 MPa

Durez™ 29502 B by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used It is available in Granules form.

Epiall® 1908B-1 banner

Epiall® 1908B-1

Polymer Name:Ethylene Propylene Copolymer
Processing Methods:Resin Transfer Molding, Injection Molding, Compression Molding
Density:1980.0 - 1980.0 kg/m³
Flexural Modulus:15900.0 - 15900.0 MPa

Epiall® 1908B-1 by Sumitomo Bakelite Company is comprised of Ethylene Propylene Copolymer. It is commonly used Epiall® 1908B-1 is certified as UL Flame Rated. It is available in Granules form.

Epiall® 1960B-1 banner

Epiall® 1960B-1

Polymer Name:Ethylene Propylene Copolymer
Processing Methods:Compression Molding, Resin Transfer Molding
Density:1760.0 - 1760.0 kg/m³
Flexural Modulus:12400.0 - 12400.0 MPa

Epiall® 1960B-1 by Sumitomo Bakelite Company is comprised of Ethylene Propylene Copolymer. It is commonly used It is available in Granules form.

Durez™ SUMIKON PM-9640 banner

Durez™ SUMIKON PM-9640

Polymer Name:Phenol Formaldehyde (PF), Phenolic Compound
Processing Methods:Transfer Molding, Injection Molding
End Uses:Automotive Applications
Density:1780.0 - 1780.0 kg/m³
Tensile Strength:138.0 - 138.0 MPa

Durez™ SUMIKON PM-9640 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used Durez™ SUMIKON PM-9640 is certified as UL Flame Rated. It is available in Granules form.

Sumikon® PM-9750 banner

Sumikon® PM-9750

Functions:Molding Compound
Processing Methods:Transfer Molding, Injection Molding

Sumikon® PM-9750 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used Sumikon® PM-9750 is certified as UL Flame Rated.

Epiall® 1908-1 banner

Epiall® 1908-1

Polymer Name:Ethylene Propylene Copolymer
Processing Methods:Resin Transfer Molding, Injection Molding, Compression Molding
Density:1920.0 - 1920.0 kg/m³
Flexural Modulus:15100.0 - 15100.0 MPa

Epiall® 1908-1 by Sumitomo Bakelite Company is comprised of Ethylene Propylene Copolymer. It is commonly used Epiall® 1908-1 is certified as UL Flame Rated. It is available in Granules form.

Durez™ 31735 banner

Polymer Name:Phenol Formaldehyde (PF), Phenolic Compound
Processing Methods:Transfer Molding, Compression Molding
End Uses:Automotive Applications
Density:1430.0 - 1430.0 kg/m³
Tensile Strength:52.0 - 52.0 MPa

Durez™ 31735 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used It is available in Granules form.

Durez™ 32633 banner

Polymer Name:Phenol Formaldehyde (PF), Phenolic Compound
Processing Methods:Transfer Molding, Injection Molding, Compression Molding
End Uses:Electrical/Electronic Applications, Automotive Applications
Density:1780.0 - 1780.0 kg/m³
Tensile Strength:138.0 - 138.0 MPa

Durez™ 32633 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used Durez™ 32633 is certified as UL Flame Rated. It is available in Granules form.

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Applications:Semiconductor Manufacturing, Other Devices & Assemblies, Other Packaging & Assembly Applications, Devices & Assemblies, Packaging & Assembly, Parts & Components
Product Families:EP Rubbers (EPDM), Thermoset Elastomers
Chemical Family:Polyolefins, Ethylene-Propylene Copolymers (EPR)
Polymer Name:Ethylene Propylene Copolymer
End Uses:Semiconductor Applications, Encapsulant

Applications:Rail & Mass Transit

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