Products

Cleanroom® LP Acetic Acid is used in mixed acid etchants and in SEZ etchants. Acetic acid is used in place of water to help keep nitric acid from dissociating, which makes for a more oxidizing solutions.

KMG Chemicals 1,2-Ethylenediamine 40% is used in anistropic silicon etchants to preferentially etch one silicon lattice, namely <100> and <110> over <111> crystalline orientation.

Cleanroom® LP Ethylene Glycol 50% is a high purity process chemical for semiconductor rinse applications and in a high purity cooling system.

Cleanroom® MB Hexamethyldisilazane (HMDS) is an adhesion promoter between photoresist and the silicon wafer.

Cleanroom® LP Acetone can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover.

Cleanroom® MB Hydrofluoric Acid 49% is a critical chemistry in semiconductor processing. It is used to solubilize many oxides, particularly silicon dioxide, the most widely used insulator on semiconductor devices.

Cleanroom® MB Hydrochloric Acid 37% is a key ingredient to remove surface metallic ions by forming soluble metal chlorides. In semiconductor processing, the presence of metallic impurities on the wafer can lead to early dielectric breakdown.

Cleanroom® LP MEK is a strong solvent that is typically used as a negative photoresist remover.

Cleanroom® LP Isopropanol 4% is used as a cleaning agent and disinfectant. It is used as a general cleaning agent for computer screens, laptops, other electronic devices and general fab manufacturing equipment found in cleanrooms. IPA can also remove minor oily residues from surfaces.

KMG Chemicals Cyclohexanone is used as a solvent for photoresist, an edge bead remover, and a general solvent for organic polymers resists.