Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Ready-to-Use Product Features
- Product Features
Industry Recognition
- UL File Number: E41625
- RoHS Compliant
Performance Attributes
- CAF resistant
- Low moisture absorption
- 0.8 mm pitch capable
- 6x 260°C reflow capable
- 6x 288°C solder float capable
Processing Advantages
- Multiple lamination cycles
- HDI technology compatible
Product Attributes
- High Density Interconnect
- High Speed Digital
- High Thermal Reliability
Applications & Uses
- Markets
- Applications
- Composites End Use
Properties
- Flame Rating
- Typical Properties
Value Units Test Method / Conditions Arc Resistance 125.0 Seconds IPC-TM-650 Comparative Tracking Index (CTI) 3.0 Volts ASTM D3638 Decomposition Temperature (Td) by TGA (5% weight loss) 360.0 °C IPC-TM-650 Dielectric Breakdown 60.0 kV IPC-TM-650 Dk, Loss Tangent(10 GHz) 0.0021 - IPC-TM-650 Dk, Loss Tangent(2 GHz) 0.0021 - IPC-TM-650 Dk, Loss Tangent(5 GHz) 0.0021 - IPC-TM-650 Dk, Permittivity(10 GHz) 3.02 - IPC-TM-650 Dk, Permittivity(2 GHz) 3.04 - IPC-TM-650 Dk, Permittivity(5 GHz) 3.02 - IPC-TM-650 Electric Strength (Laminate & laminated prepreg) 60 (1500) kV/mm (V/mil) IPC-TM-650 Flammability (Laminate & laminated prepreg) V-0 Rating UL 94 Flexural Strength Cross direction 41.0 ksi IPC-TM-650 Flexural Strength Length direction 44.0 ksi IPC-TM-650 Glass Transition Temperature by DMA 220.0 °C IPC-TM-650 Glass Transition Temperature by DSC 200.0 °C IPC-TM-650 Glass Transition Temperature by TMA 180.0 °C IPC-TM-650 Moisture Absorption 0.1 % IPC-TM-650 Peel Strength After thermal stress (Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]) 0.79 (4.5) N/mm (lb/inch) IPC-TM-650 Peel Strength After thermal stress (Standard profile copper) 0.96 (5.5) N/mm (lb/inch) IPC-TM-650 Poisson's Ratio Cross direction 0.156 - ASTM D3039 Poisson's Ratio Length direction 0.165 - ASTM D3039 Relative Thermal Index (RTI) 130.0 °C UL 796 Surface Resistivity (C-96/35/90) 1.33 x 10^5 MΩ IPC-TM-650 Taylor's Modulus Cross direction 2197.0 ksi ASTM D790-15e2 Taylor's Modulus Length direction 2264.0 ksi ASTM D790-15e2 Tensile Strength Cross direction 25.0 ksi ASTM D3039 Tensile Strength Length direction 30.0 ksi ASTM D3039 Thermal Conductivity 0.42 W/m·K ASTM E1952 Thermal Stress Etched [10 sec, 288ºC (550.4ºF)] Pass - IPC-TM-650 Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)] Pass - IPC-TM-650 Time to Delaminate by T260 (Copper removed) min. 60 Minutes IPC-TM-650 Time to Delaminate by T288 (Copper removed) min. 60 Minutes IPC-TM-650 Time to Delaminate by T300 (Copper removed) min. 20 Minutes IPC-TM-650 Volume Resistivity (C-96/35/90) 1.33 x 10^7 MΩ-cm IPC-TM-650 X/Y-Axis CTE Pre-Tg 15.0 ppm/°C IPC-TM-650 Young's Modulus Cross direction 2417.0 ksi ASTM D790-15e2 Young's Modulus Length direction 2551.0 ksi ASTM D790-15e2 Z-Axis CTE 50 to 260°C, (Total Expansion) 2.5 % IPC-TM-650 Z-Axis CTE Post-Tg 250.0 ppm/°C IPC-TM-650 Z-Axis CTE Pre-Tg 45.0 ppm/°C IPC-TM-650
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Product Availability
Standard Material Offering: Laminate
- 2 to 18 mil (0.05 to 0.46 mm)
Copper Foil Type
- HVLP (VLP2) ≤2.5 micron Rz JIS, 1 oz and below is standard
- RTF (Reverse Treat Foil)
Copper Weight
- ½, 1 oz (18 and 35 µm) available
- Thinner copper foil available
Standard Material Offering: Prepreg
- Moisture barrier packaging
Glass Fabric Availability
- Low Dk Glass -Asahi Japan, Asahi Tawian, TGI Taiwan
- Square weave glass
- Mechanically spread glass