Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Ready-to-Use Product Features
- Product Features
Industry Recognition
- UL File Number: E41625
- RoHS Compliant
Performance Attributes
- CAF resistant
Processing Advantages
- FR-4 process compatible
Product Attributes
- High Thermal Reliability
Applications & Uses
- Markets
- Applications
- Composites End Use
- Typical Market Applications
- Automative and Transportation
Properties
- Flame Rating
- Typical Properties
Value Units Test Method / Conditions Arc Resistance 120.0 Seconds IPC-TM-650 Comparative Tracking Index (CTI) 3 (175-249) Volts UL 746A ASTM D3638 Decomposition Temperature (Td) by TGA (5% weight loss) 330.0 °C IPC-TM-650 Dielectric Breakdown min. 50 kV IPC-TM-650 Dk, Loss Tangent(100 MHz) 0.02 - IPC-TM-650 Dk, Loss Tangent(500 MHz) 0.022 - IPC-TM-650 Dk, Permittivity(100 MHz) 4.0 - IPC-TM-650 Dk, Permittivity(500 MHz) 3.9 - IPC-TM-650 Electric Strength (Laminate & laminated prepreg) 48 (1100) kV/mm (V/mil) IPC-TM-650 Flammability (Laminate & laminated prepreg) V-0 Rating UL 94 Flexural Strength Cross direction 66.6 ksi IPC-TM-650 Flexural Strength Length direction 82.0 ksi IPC-TM-650 Glass Transition Temperature (Tg) by DSC 150.0 °C IPC-TM-650 Moisture Absorption 0.18 % IPC-TM-650 Peel Strength (Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]) 1.05 (6.0) N/mm (lb/inch) IPC-TM-650 Peel Strength [125ºC (257ºF) (Standard profile copper)] 1.25 (8.0) N/mm (lb/inch) IPC-TM-650 Peel Strength After process solutions (Standard profile copper) 1.45 (9.0) N/mm (lb/inch) IPC-TM-650 Peel Strength After thermal stress (Standard profile copper) 1.45 (9.0) N/mm (lb/inch) IPC-TM-650 Poisson's Ratio Cross direction 0.151 - ASTM D3039 Poisson's Ratio Length direction 0.183 - ASTM D3039 Relative Thermal Index (RTI) 130.0 °C UL 796 Surface Resistivity (At elevated temperature) 5.4 x 10^6 MΩ IPC-TM-650 Surface Resistivity (C-96/35/90) 3.0 x 10^6 MΩ IPC-TM-650 Tensile Strength Cross direction 41.7 ksi ASTM D3039 Tensile Strength Length direction 51.2 ksi ASTM D3039 Thermal Conductivity 0.36 W/m·K ASTM E1952 Thermal Stress Etched [10 sec, 288ºC (550.4ºF)] Pass - IPC-TM-650 Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)] Pass - IPC-TM-650 Time to Delaminate by T260 (Copper removed) min. 60 Minutes IPC-TM-650 Time to Delaminate by T288 (Copper removed) min. 10 Minutes IPC-TM-650 Volume Resistivity (At elevated temperature) 7.0 x 10^8 MΩ-cm IPC-TM-650 Volume Resistivity (C-96/35/90) 4.0 x 10^8 MΩ-cm IPC-TM-650 X/Y-Axis CTE Pre-Tg 13.0 ppm/°C IPC-TM-650 Young's Modulus Cross direction 3328.0 ksi ASTM D790-15e2 Young's Modulus Length direction 3663.0 ksi ASTM D790-15e2 Z-Axis CTE 50 to 260°C, (Total Expansion) 3.3 % IPC-TM-650 Z-Axis CTE Post-Tg 250.0 ppm/°C IPC-TM-650 Z-Axis CTE Pre-Tg 50.0 ppm/°C IPC-TM-650
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Product Availability
Standard Material Offering: Laminate
- 2 to 93 mil (0.05 to 2.4 mm)
- Available in full size sheet or panel form
Copper Foil Type
- HTE Grade 3
- RTF (Reverse Treat Foil)
Copper Weight
- ½ to 2 oz (18 to 70 µm) available
- Heavier copper available
- Thinner copper foil available
Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
Glass Fabric Availability
- E-glass
- Square weave glass