Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Ready-to-Use Product Features
- Product Features
Industry Recognition
- RoHS Compliant
Performance Attributes
- CAF resistant
- Lead-free assembly compatible
- 0.8 mm pitch capable
- 6x 260°C reflow capable
- 6x 288°C solder float capable
Processing Advantages
- FR-4 process compatible
- Via filling capability
- Multiple lamination cycles
Product Attributes
- High Density Interconnect
- High Speed Digital
- High Thermal Reliability
Applications & Uses
- Markets
- Applications
- Composites End Use
- Typical Market Applications
- Networking and Communications
- Aerospace and Defense
- Computing, Storage and Peripherels
- Medical, Industrial and Instrumentation
Properties
- Flame Rating
- Typical Properties
Value Units Test Method / Conditions Arc Resistance 137.0 Seconds IPC-TM-650 Comparative Tracking Index (CTI) 2 (250-399) Volts UL 746A ASTM D3638 Decomposition Temperature (Td) by TGA (5% weight loss) 360.0 °C IPC-TM-650 Dielectric Breakdown min. 50 kV IPC-TM-650 Dk, Loss Tangent(1 GHz) 0.0091 - IPC-TM-650 Dk, Loss Tangent(10 GHz) 0.0095 - IPC-TM-650 Dk, Loss Tangent(100 MHz) 0.0072 - IPC-TM-650 Dk, Loss Tangent(2 GHz) 0.0092 - IPC-TM-650 Dk, Loss Tangent(5 GHz) 0.0098 - IPC-TM-650 Dk, Permittivity(1 GHz) 3.69 - IPC-TM-650 Dk, Permittivity(10 GHz) 3.65 - IPC-TM-650 Dk, Permittivity(100 MHz) 3.72 - IPC-TM-650 Dk, Permittivity(2 GHz) 3.68 - IPC-TM-650 Dk, Permittivity(5 GHz) 3.64 - IPC-TM-650 Electric Strength (Laminate & laminated prepreg) 70 (1741) kV/mm (V/mil) IPC-TM-650 Flammability (Laminate & laminated prepreg) V-0 Rating UL 94 Flexural Strength Cross direction 58.0 ksi IPC-TM-650 Flexural Strength Length direction 72.5 ksi IPC-TM-650 Glass Transition Temperature (Tg) by DSC 190.0 °C IPC-TM-650 Moisture Absorption 0.061 % IPC-TM-650 Peel Strength (Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]) 1.14 (6.5) N/mm (lb/inch) IPC-TM-650 Peel Strength After process solutions (Standard profile copper) 0.90 (5.1) N/mm (lb/inch) IPC-TM-650 Peel Strength After thermal stress (Standard profile copper) 0.96 (5.5) N/mm (lb/inch) IPC-TM-650 Poisson's Ratio Cross direction 0.133 - ASTM D3039 Poisson's Ratio Length direction 0.137 - ASTM D3039 Relative Thermal Index (RTI) 130.0 °C UL 796 Surface Resistivity (After moisture resistance) 2.6 x 10^6 MΩ IPC-TM-650 Surface Resistivity (At elevated temperature) 2.1 x 10^8 MΩ IPC-TM-650 Tensile Strength Cross direction 38.7 ksi ASTM D3039 Tensile Strength Length direction 54.5 ksi ASTM D3039 Thermal Conductivity 0.4 W/m·K ASTM E1952 Thermal Stress Etched [10 sec, 288ºC (550.4ºF)] Pass - IPC-TM-650 Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)] Pass - IPC-TM-650 Time to Delaminate by T260 (Copper removed) 60.0 Minutes IPC-TM-650 Time to Delaminate by T288 (Copper removed) min. 30 Minutes IPC-TM-650 Volume Resistivity (After moisture resistance) 4.4 x 10^7 MΩ-cm IPC-TM-650 Volume Resistivity (At elevated temperature) 9.4 x 10^7 MΩ-cm IPC-TM-650 X/Y-Axis CTE Pre-Tg 16.0 ppm/°C IPC-TM-650 Young's Modulus Cross direction 3315.0 ksi ASTM D790-15e2 Young's Modulus Length direction 3695.0 ksi ASTM D790-15e2 Z-Axis CTE 50 to 260°C, (Total Expansion) 2.8 % IPC-TM-650 Z-Axis CTE Post-Tg 230.0 ppm/°C IPC-TM-650 Z-Axis CTE Pre-Tg 55.0 ppm/°C IPC-TM-650
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Product Availability
Standard Material Offering: Laminate
- Available in full size sheet or panel form
Copper Foil Type
- RTF (Reverse Treat Foil)
Copper Weight
- ½ to 2 oz (18 to 70 µm) available
- Heavier copper available
- Thinner copper foil available
Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
Glass Fabric Availability
- E-glass
- Square weave glass
- Mechanically spread glass