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Isola FR402

Isola FR402 formulation is designed to enhance throughput and accuracy of laser based Automated Optical Inspection (AOI) equipment. FR402 offers superior resistance to chemical and thermal degradation.

Functions: Laminate

Reinforcement Material: Glass Fibers

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Epoxy & Epoxy Derivatives
Reinforcement Material
Glass Fibers
Composite Materials Functions
Laminate
Technologies
Composite Materials
Product Families
Composite Materials — Prepregs & Molding Compounds
Laminates

Features & Benefits

Materials Features
Chemical Resistant,
Excellent Performance,
Exceptional UV Resistance,
Good Thermal Stability
Product Features

Industry Recognition

  • UL File Number: E41625
  • RoHS Compliant

Processing Advantages

  • FR-4 process compatible
  • UV blocking and AOI fluorescence

Product Attributes

  • Legacy

Properties

Flame Rating
UL 94 V0
Typical Properties
ValueUnitsTest Method / Conditions
Arc Resistance120.0SecondsIPC-TM-650
Comparative Tracking Index (CTI)3 (175-249)VoltsASTM D3638
Decomposition Temperature (Td) by TGA (5% weight loss)315.0°CIPC-TM-650
Dielectric Breakdownmin. 50kVIPC-TM-650
Dk, Loss Tangent(100 MHz)0.016-IPC-TM-650
Dk, Loss Tangent(500 MHz)0.015-IPC-TM-650
Dk, Permittivity(1 GHz)4.25-IPC-TM-650
Dk, Permittivity(100 MHz)4.6-IPC-TM-650
Dk, Permittivity(500 MHz)4.27-IPC-TM-650
Electric Strength (Laminate & laminated prepreg)29 (1100)kV/mm (V/mil)IPC-TM-650
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Flexural Strength Cross direction62.3ksiIPC-TM-650
Flexural Strength Length direction92.0ksiIPC-TM-650
Glass Transition Temperature (Tg) by DSC140.0°CIPC-TM-650
Moisture Absorption0.3%IPC-TM-650
Peel Strength (Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil])1.05 (8.0)N/mm (lb/inch)IPC-TM-650
Peel Strength [125ºC (257ºF) (Standard profile copper)]1.25 (8.0)N/mm (lb/inch)IPC-TM-650
Peel Strength After process solutions (Standard profile copper)1.45 (9.0)N/mm (lb/inch)IPC-TM-650
Peel Strength After thermal stress (Standard profile copper)1.45 (9.0)N/mm (lb/inch)IPC-TM-650
Relative Thermal Index (RTI)130.0°CUL 796
Surface Resistivity (At elevated temperature)6 x 10^6MΩIPC-TM-650
Surface Resistivity (C-96/35/90)3.0 x 10^6MΩIPC-TM-650
Tensile Strength Cross direction43.2ksiASTM D3039
Tensile Strength Length direction60.0ksiASTM D3039
Thermal Conductivity0.36W/m·KASTM E1952
Thermal Stress Etched [10 sec, 288ºC (550.4ºF)]Pass-IPC-TM-650
Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)]Pass-IPC-TM-650
Time to Delaminate by T260 (Copper removed)30.0MinutesIPC-TM-650
Time to Delaminate by T288 (Copper removed)min. 5MinutesIPC-TM-650
Volume Resistivity (At elevated temperature)7.0 x 10^7MΩ-cmIPC-TM-650
Volume Resistivity (C-96/35/90)4.0 x 10^8MΩ-cmIPC-TM-650
X/Y-Axis CTE Pre-Tg15.0ppm/°CIPC-TM-650
Young's Modulus Cross direction3000.0ksiASTM D790-15e2
Young's Modulus Length direction3500.0ksiASTM D790-15e2
Z-Axis CTE 50 to 260°C, (Total Expansion)4.2%IPC-TM-650
Z-Axis CTE Post-Tg250.0ppm/°CIPC-TM-650
Z-Axis CTE Pre-Tg50.0ppm/°CIPC-TM-650

Regulatory & Compliance

Certifications & Compliance
RoHS Compliant,
UL 94

Packaging & Availability

Product Availability

Standard Material Offering: Laminate

  • 2 to 125 mil (0.05 to 3.2 mm)
  • Available in full size sheet or panel form

Copper Foil Type

  • HTE Grade 3
  • RTF (Reverse Treat Foil)

Copper Weight

  • ½ to 2 oz (18 to 70 µm) available
  • Heavier copper available
  • Thinner copper foil available

Standard Material Offering: Prepreg

  • Roll or panel form
  • Tooling of prepreg panels

Glass Fabric Availability

  • E-glass
  • Square weave glass