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Products
HENZE BORON NITRIDE PRODUCTS Brand
10 Products
found on HENZE BORON NITRIDE PRODUCTS
HeBoFill® BL-PC 060
Functions:
Filler
Chemical Family:
Boron-based Compounds, Calcium Salts
Particle Size:
6.0 - 6.0 microns
HeBoFill® BL-PC 060 is a technical recycling quality which is produced during the machining of sintered boron nitride components. Composition and particle size distribution are adjusted by means of targeted processing. Due to the raw materials used, this powder also contains admixtures of valuable refractory zirconium and silicon compounds. Boron nitride is resistant up to 900°C in air and up to 2000°C under vacuum/inert conditions.
HeBoFill® BL-SP 040
Chemical Family:
Boron-based Compounds
Functions:
Filler
Synonyms:
Elbor
HeBoFill® BL-SP 040 is a Boron Nitride powder exhibiting a defined platelet structure and high purity. Virtually no formation of agglomerates. As a filler and additive it improves the temperature resistance and the thermal conductivity.
HeBoFill® CL-ADM 020
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Excellent Lubricity, Free Flowing, Oxidation Resistant, High Temperature Resistance, High Degree of Crystallinity, Electrically Insulating, Good Thermal Conductivity, High Purity, Excellent Flowability, Low Wear, Low Density, Low Viscosity
Synonyms:
Elbor
HeBoFill® CL-ADM 020 is a Boron Nitride powder with a high level of purity, high crystallinity and excellent free flowing characteristics. It is particularly suitable for use as filler and additive in polymer materials to improve their thermal conductivity.
HeBoFill® CL-SP 045
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Electrically Insulating, Good Thermal Conductivity, High Loading Absorption Capability, High Purity, Low Wear, Low Density, Low Viscosity
Synonyms:
Elbor
HeBoFill® CL-SP 045 is a pure Boron Nitride powder with a coarse grain size distribution. Its average particle size is 45 μm. The extremely low specific surface area allows high filler loadings with a minimum viscosity increase. It is particularly suitable as a filler in polymers, allowing the thermal conductivity to be increased without affecting the electrically insulating properties.
HeBoFill® extrusion
Chemical Family:
Boron-based Compounds
Functions:
Release Agent, Solid Lubricant
Features:
Free Flowing, Good Lubrication, Long Service Life, Good Release Properties
Synonyms:
Elbor
HeBoFill ® extrusion is the latest Boron Nitride powder from Henze, developed specifically for the Aluminium extrusion sector. HeBoFill® extrusion exhibits excellent lubricating and release properties, high purity and good flow characteristics and pourability. It effectively prevents the adhesion of Aluminium to the press dummy block as well as other critical working surfaces during extrusion. HeBoFill ® extrusion is easy to use and offers process cleanliness through an efficient electrostatic spraying process which ensures economy, and results in a uniform, consistent coating. Both component service life and process security of the Aluminium extrusion process are increased.
HeBoFill® LL-SP 050
Chemical Family:
Boron-based Compounds
Functions:
High Temperature Additive, Filler
Labeling Claims:
Agglomerate-free
Synonyms:
Elbor
HeBoFill® LL-SP 050 is a Boron Nitride powder with good crystallinity and a narrow grain size distribution. Its fine particle size and low agglomerate content makes it suitable for a wide variety of applications.
HeBoFill® LL-SP 120
Functions:
High Temperature Additive, Filler, Pigment
Chemical Family:
Boron-based Compounds, Calcium Salts
HeBoFill® LL-SP 120 is a Boron Nitride powder of high purity. Its high crystallinity results in excellent lubrication. The powder is also characterised by a narrow grain size distribution. The high crystallinity results in a relatively low specific surface area. This property enables a low increase in viscosity at high filler loadings.
HeBoFill® CL-SP 009
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Electrically Insulating, Good Thermal Conductivity, Low Wear, Low Viscosity, High Degree of Crystallinity
Synonyms:
Elbor
HeBoFill® CL-SP 009 is a pure boron nitride powder with high crystallinity and an average particle size of 9 μm. Due to the pronounced platelet structure and the low specific surface area, this powder is very well suited as a filler and additive for plastics, as well as for a wide range of other applications.
HeBoFill® CL-SP 015
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Electrically Insulating, Good Thermal Conductivity, Low Wear, Low Viscosity, Flame Retardant, High Degree of Crystallinity
Synonyms:
Elbor
HeBoFill® CL-SP 015 is a very pure boron nitride powder with an average particle size of 15 μm. This boron nitride grade has a low specific surface area combined with high crystallinity. This quality is particularly suitable as a filler and additive in polymers to increase the thermal conductivity without affecting the electrically insulating properties.
HeBoFill® CL-SP 035
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Excellent Lubricity, Low Hardness, Excellent Filling Properties, Electrically Insulating, Non Abrasive, Good Thermal Conductivity, High Loading Absorption Capability, High Purity, Low Wear, Low Density, Low Viscosity
Synonyms:
Elbor
HeBoFill® CL-SP 035* is a high-purity boron nitride powder with a very distinct crystal structure and single crystallites in the range of 35 pm. It is further characterized by its low density and intrinsic high thermal conductivity. Since large crystallites conduct heat much faster, it is predestined for use as a filler and additive in plastics. Thereby, their thermal conductivity is significantly increased, while simultaneously maintaining good electrical insulation.