Georgia-Pacific Chemicals

GP® BRSD-2112 coating/adhesive resin is a liquid heat-reactive phenolic-based resin solution.

GP® BKS-2600 heat-reactive phenolic resin solution in ethanol is formulated to provide chemical resistance for protective coatings for rigid metallic substrates.

GP® CK-2400 coating resin is a novolac resin modifier for alkyd and epoxy air dry coatings designed to improve water resistance, hardness, leveling, gloss and intercoat adhesion.

Curaphen 22-506 is characterized by high reactivity and contains approximately 3.5% accelerator. It can be modified with conventional additives and is fully compatible with other phenolic hardeners within this range, enabling the formulation of specific custom process requirements.

GP® BKR-2620 coating resin is a solid, heat-reactive, modified phenolic resin. It can be used with a wide selection of solvents and is compatible with plasticizers and polyvinyl butyral resins. Films made with unplasticized GP BKR-2620 resin have greater flexibility than those made with other unmodified phenolic resin baking solutions.

GP® 4003 is a second-generation waterborne phenolic resin developed by Georgia-Pacific Chemicals. It is an opaque, white liquid dispersion that incorporates a non-ionic protective colloid. GP 4003 is a heat reactive resin that is intended to replace solvent-based phenolic resins where low Volatile Organic Compound (VOC) emissions are desired. Compound (VOC) emissions are desired.

GP® CK-2103 resin is a novolac resin modifier for alkyd and epoxy air dry coatings designed to improve water resistance, hardness, gloss and adhesion. Coatings made with GP CK-2103 resin dry faster than those made with GP CK-2432 resin and will darken on drying.

GP® BKUA-2370 resin dispersion is in a solvent of water and butyl Cellosolve® (ethylene glycol monobutyl ether). It is an effective crosslinker for adhesion of latex and phenoxy polymers and is formulated to improve chemical resistance.

Curaphen 40-830 B55 by Georgia-Pacific Chemicals is commonly used as Coating Resin for a variety of applications. It is a Phenol based, Low Phenolic Monomer and Low free Formaldehyde