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Products in Battery & Electronic Materials: Silicones
5 Products found in Battery & Electronic Materials
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IAM B
Chemical Family:
Silicones
Applicable Processes:
Semiconductor Manufacturing
Features:
Low Chloride Content, Low Metal Content
Synonyms:
Bis(trimethylsilyl)ether, Bis(trimethylsilyl)oxide, Oxybis(trimethylsilane)
IAM B is Hexamethyldisiloxane of high purity.
Wacker Chemie AG
ELASTOSIL® LR 6200 A/B
Chemical Family:
Silicones
Functions:
Binder & Resin
Product Type:
Solventless & High Solids Coating, 2K (2 component) Coating
Compatible Substrates & Surfaces:
Nylon, Textiles
ELASTOSIL® LR 6200 A/B is a liquid silicone rubber (LSR) that is solvent-free and free-flowing. It utilizes additive curing and consists of two components. This grade is specifically designed for textile coatings. ELASTOSIL® LR 6200 A/B has a very low viscosity, allowing for good penetration into the substrate and a dry surface touch. It is particularly well suited for textile coating applications that require enhanced flame retardancy.
Wacker Chemie AG
SEMICOSIL® HMDSO-EL
Chemical Family:
Silicones
Applicable Processes:
Semiconductor Manufacturing
Features:
Low Metal Content, Low Chloride Content
Synonyms:
Bis(trimethylsilyl)ether, Bis(trimethylsilyl)oxide, Oxybis(trimethylsilane)
SEMICOSIL® HMDSO-EL is a high-purity hexamethyldisiloxane (HMDSO) known for its exceptional purity, low metal content, and low chloride content. This product has been specifically developed to cater to the needs of the semiconductor industry. It finds applications in various processes such as chemical vapor deposition (CVD) and spin-on dielectrics (SOD).
Wacker Chemie AG
SEMICOSIL® HMN-EL
Functions:
Adhesion Promoter, Silylating Agent
Chemical Family:
Silicones
Applicable Processes:
Chemical Amplification, Semiconductor Manufacturing, Photolithography
Features:
Low Metal Content, Low Chloride Content
Synonyms:
Bis(trimethylsilyl)ether, Bis(trimethylsilyl)oxide, Oxybis(trimethylsilane)
SEMICOSIL® HMN-EL is a high-purity hexamethyldisilazane specifically developed for use in photoresists for semiconductor manufacturing. It serves as an adhesion promoter and silylating agent in processes like chemical amplification. This product is characterized by its high purity, low metal content, low chloride content, and low residue on evaporation, ensuring optimal performance in semiconductor applications.
Wacker Chemie AG
DEHESIVE® PSA 630 T
Chemical Family:
Silicones
Product Type:
Pressure Sensitive Adhesive, Solventborne Adhesive
Compatible Substrates & Surfaces:
Polyimide, Polyamide
DEHESIVE® PSA 630 T is a solvent-based silicone pressure-sensitive adhesive intended particularly for coating films but also other substrates. It can be used for coating several film substrates, such as polyester, polyamide, polyimide, and other substrates, for the manufacture of different silicone pressure-sensitive adhesive tapes and other articles.