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Packaging & Assembly
Products in Packaging & Assembly: Adhesion Promoter
13 Products found in Packaging & Assembly
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MultiTech MultiFunctional L
Polymer Name:
Epoxy Resins & Compounds
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins, Bisphenol A Type Epoxy
Functions:
Adhesion Promoter, Resins, Binders & Matrix Materials, Resin, Binder & Resin, Coupling Agent, Adhesion Promoter
Compatible Substrates & Surfaces:
Metal, Fibers & Fabrics, Aluminum, Plastics, Ceramic, Glass, Concrete, Steel
MultiTech MultiFunctional L is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparency LED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs MultiTech MultiFunctional L is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group
Mitsubishi Chemical Group Corporation
jER™ YX7400N
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Coupling Agent, Impact Modifier, Binder & Resin, Adhesion Promoter, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
End Uses:
Conformal Coating, Semiconductor Applications
Features:
Good Elasticity, Reduced Wear, Excellent Elasticity, High Impact Resistance, Improved Flexibility, Excellent Resilience, Abrasion Resistance, Improved Dimensional Stability, Impact Resistance, Good Mechanical Properties
jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL980
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials, Coupling Agent, Resin
Chemical Family:
Bisphenol Epoxy Resins, Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Concrete, Aluminum, Fibers & Fabrics, Plastics, Ceramic, Metal, Glass
Features:
Chemical Resistance, Improved Flexibility, Excellent Electrical Insulation, Electrically Insulating, Low Chlorine Content, Abrasion Resistance, Chemical Resistant, Good Electrical Properties, Water Resistant, Reduced Wear, Heat Resistance, Flame Retardant, Improved Dimensional Stability, Good Mechanical Properties, Water Resistance
jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX7105
Polymer Name:
Epoxy Resins & Compounds
Functions:
Impact Modifier, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8040
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Labeling Claims:
High Purity
jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ Epoxy YX7110
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Impact Modifier, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 4250
Polymer Name:
Epoxy Resins & Compounds
Functions:
Impact Modifier, Plasticizer, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 1750
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
Labeling Claims:
High Purity
jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 1256
Polymer Name:
Epoxy Resins & Compounds
Functions:
Impact Modifier, Plasticizer, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL983U
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials, Resin
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy, Bisphenol Epoxy Resins
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Concrete, Aluminum, Fibers & Fabrics, Metal, Plastics, Glass, Ceramic
Features:
Good Elastic Recovery, Excellent Electrical Insulation, Low Chlorine Content, Abrasion Resistance, Improved Dimensional Stability, Electrically Insulating, Good Electrical Properties, Good Elastic Recovery, Improved Flexibility, Water Resistant, Reduced Wear, Heat Resistance, Good Mechanical Properties, Chemical Resistant, Low Viscosity, Water Resistance, Chemical Resistance
jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8000D
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:
Radiation Curable Coating, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Fibers & Fabrics, Concrete, Aluminum, Metal, Plastics, Glass, Ceramic
Features:
Transparency, Fast Cure, Radiation Curable, UV Curable, Low Chlorine Content, Faster Cure Time, LED-curable, Excellent Adhesion
jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX4000
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
AB Specialty Silicones
Andisil® 78 Silane
Chemical Family:
Silanes, Silicones, Epoxy & Epoxy Derivatives
Functions:
Adhesion Promoter, Coupling Agent
Compatible Polymers & Resins:
Polycarbonates (PC), Polyamides, Epoxies (EP), Phenolic Resins, Polyesters, Acrylics, Nitrile Butadiene Rubber (NBR), Polyurethanes (PU), Polysulfide Rubber
Synonyms:
(3-Glycidyloxy)propyldiethoxymethylsilane, [3-(Glycidyloxy)propyl]methyldiethoxysilane, 2-[[3-(Diethoxymethylsilyl)propoxy]methyl]oxirane, 3-(Glycidoxy)propyldiethoxymethylsilane, 3-(Glycidoxypropyl)methyldiethoxysilane, 3-(Methyldiethoxysilyl)propyl glycidyl ether, 3-GPMDES, Diethoxy-3-glycidoxypropylmethylsilane, Diethoxy[3-(glycidyloxy)propyl]methylsilane, NSC 252159, γ-Glycidoxypropylmethyldiethoxsilane, γ-Glycidoxypropylmethyldiethoxysilane, γ-Glycidyloxypropylmethyldiethoxysilane
Epoxy functional silane used used to improve dry and wet strength in cured composites reinforced with glass fiber rovings. Silanes are used in a variety of industrial applications. Organofunctional Silanes have an organic functional end group and an alkoxy functional end group which allow the silane to act as a bridge between organic materials and inorganic substrates. The organic functional group is matched to the resin system while the alkoxy group provides the reactive site for crosslinking. These materials are useful as adhesion promoters, crosslinking agents, surface modifiers and hydrophobizing agents.