Products in Industrial & Assembly Adhesives: Enamel

Dianhydrides & Imides BISDA (4,4-bisphenol A dianhydride, dianhydrides of BPA) are flakes that can serve as a comonomer in polyimide synthesis or as an anhydride curing agent in epoxy applications. When utilized as an epoxy curative, it can enhance thermal performance compared to monoanhydrides and aromatic amine curing agents. Its application areas include electronics encapsulation, composites, and adhesives. Dianhydrides & Imides BISDA-derived polyimide varnishes, coatings, adhesives, films, and wire enamels offer desired solubility and stability in organic solvents even after complete imidization, heat resistance, flexibility/softness, dimensional stability, and adhesion properties for the ever-increasing design complexity of electronic devices. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Sunspheres™ 200 Nm are optically clear, solid fused amorphous microspheres designed for use in a wide variety of coatings, inks, adhesives, powder coatings, and thermoplastics, including UV curable compositions. These sub-micron sized spheres can be used to improve physical and mechanical properties including reduced shrinkage, improved adhesion, impact resistance, and enhanced surface qualities such as hardness, mar and scratch resistance. The average particle size is 200 nanometers and range in size from about 50 nm to 500 nm.

POLYTONE™ AP 108 is a heat reactive alkyl phenolic resin formulated for use in the manufacture of contact adhesives / cements based on polychloroprene or other elastomers.

Golden Cashew Nut Shell Liquid Resin0459 is a transparent viscous resin with golden color film. It is highly suitable for the surface coating application, where outstanding film properties and very high resistance to water and chemicals are required. Therefore, CNSL Resin is used commonly as a paint raw material due to its high water and chemical resistant property.

POLYTONE™ AP 109 is a heat reactive alkyl phenolic resin formulated for use in the manufacture of contact adhesives / cements based on polychloroprene or other elastomers.

POLYTONE™ AP 111 is a heat reactive alkyl Phenolic resin formulated for use in Neoprene rubber adhesives. It imparts low initial viscosity and viscosity stability to adhesives of this type.

POLYTONE™ AP 110 is a heat reactive alkyl phenolic resin formulated for use in the manufacture of contact adhesives / cements based on polychloroprene or other elastomers.

POLYTONE™ AP 112 is a heat reactive alkyl phenolic resin formulated for use in Neoprene rubber adhesives. It imparts low initial viscosity and viscosity stability to adhesives of this type.

Golden Cashew Nut Shell Liquid Resin0051 is a transparent viscous resin with golden color film. It is highly suitable for the surface coating application, where outstanding film properties and very high resistance to water and chemicals are required. Therefore, CNSL Resin is used commonly as a paint raw material due to its high water and chemical resistant property.

POLYTONE™ AP 114 is a heat reactive alkyl Phenolic resin formulated for use in Neoprene rubber adhesives. It imparts low initial viscosity and viscosity stability to adhesives of this type

Golden Cashew Nut Shell Liquid Resin0357 is a transparent viscous resin with golden color film. It is highly suitable for the surface coating application, where outstanding film properties and very high resistance to water and chemicals are required. Therefore, CNSL Resin is used commonly as a paint raw material due to its high water and chemical resistant property.