Products in Adhesives & Sealants: Epoxy & Epoxy Derivatives

Epojet is two-component, super-fluid epoxy resin for injections and anchorings.

Kukdo Chemical KD-4014 Epoxy Resins are bisphenol-A type half-capped epoxy resin, and designed for applications of high performance powder coating, especially FBE(Fusion Bonded Epoxy coating). The most advantage of these products is that residual bisphenol-A content is the less than one percent by weight. Also, these products have excellent performance of block resistance, chemical resistance and mechanical properties.

PHOTOMER® 3319 is a low viscosity di functional aliphatic epoxy acrylate which exhibit of excellent reactivity and chemical resistance.

TC-1614 A/B is an unfilled, low viscosity epoxy resin system.It is designed to seal porous to semi-porous substrates developing remarkable strength.TC-1614 A/B also has exceptional adhesive characteristics and is capable of high temperatures.

RIKARESIN BPO-20E is used in the fields of adhesives, paints and electricity to improve toughness, flexibility and adhesion. Liquid epoxy resin with bisphenol A skeleton. Since it has excellent impregnation properties, it is also used for FRP molding and casting. Improves heat cycle property, thermal shock resistance and shock resistance.

K-Bond Quick Set Knife Grade is a premium quality epoxy adhesive that has been engineered to have the best possible ratio of working time to curing speed. Uses include bonding, laminating, installation of pieces and repairs.

EA 501 used in fast setting applications. Bonds wide variety of substrates like metals, Ceramics, woods and concrete.

Super SAP® CCR/CCS is a clear, UV-stabilized epoxy system designed specifically for casting, potting, and embedding applications. Low color and low viscosity allow for bubble-free, crystal-clear castings ideal for art and hobby applications. This Super Sap® Formulation features two hardener speeds: slow (CCS) for high-build casting epoxy applications and fast (CCF) for quick, small project fast casting epoxy applications such as resin jewelry and more.

KemaPox HF 022 is aliphatic amine curing agent-triethylenetetramine.

Razeen® LR 2783 is a low viscosity epoxy resin based on Bisphenol A\F modified with aliphatic glycidyl ether.

Atom Adhesives Fabric-Bond1 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where fast curing is required.

Super SAP® CLR/CLS is our flagship, high-performance, clear-coating epoxy system. A Super Sap® Formulation, the CLR system is a water-clear, UV-stabilized epoxy system for laminations and coatings that require a low-color, low-yellowing epoxy such as high-colorwork applications. This system features a quick air-release and world-class UV resistance package. CLR works with multiple hardeners to match your working parameters. It has an ideal viscosity for a wide range of applications that use hand layup techniques with fast, room-temperature cures.

EC-861 is a phenyl acetate epoxy curative. When cured with an epoxy, the resulting thermoset displays a high level of toughness and flexibility. The monomer is hydrophobic by nature and results in more hydrophobic thermosets. The low viscosity (which can result in lower viscosity in final products) makes it an ideal monomer to formulate in epoxy resin systems. The phenyl acetate end group, unlike phenolics, does not interfere with free-radical cure in hybrid adhesive systems.

Araldite® GY 6010 is a general purpose unmodified epoxy resin based on Bisphenol A with medium viscosity.

Oxy-Bond™ 1105 Two-Component Epoxy Adhesive has high performance, medium viscosity, 5 minute fixture adhesive.

Atom Adhesives Metal-Bond (Rigid Staking Compound Epoxy Adhesive) is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. Metal-Bond contains a thixotropic agent which impedes thinning out of the material during heat cure when properly mixed and cured.

Sicomin SR 8500 / SD 860x is a laminating epoxy systems developed by Sicomin and adapted for the production of high performance composites. It is Germanischer Llyod's certified, this multi-purpose epoxy system is recommended for the construction of large components.

ThreeBond Europe SAS TB3380B has been developed for bonding electrical and electronic parts, which require low outgas. A 2-component epoxy type electroconductive adhesive, it may be cured at room temperature, although curing at an elevated temperature reduces the amount of outgas further.

K-Bond Quick Set Flowing is a premium quality epoxy adhesive that has been engineered to have the best possible ratio of working time to curing speed. Uses include bonding, laminating, installation of pieces and repairs.

Atom Adhesives Wood-Bond (Rigid Staking Compound Epoxy Adhesive) is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. Wood-Bond contains a thixotropic agent which impedes thinning out of the material during heat cure when properly mixed and cured.

Anchor Seal SY6009T* Black is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It is used in low health hazard, thermal conducting switches.

Triune Chemicals and Materials LE-828LV is less crystallize resin which can be widely used in all applications like Coatings, Adhesive, Casting, Composite, Civil Engineering and Electric and electronics fields..

DURAL 452 LV is a two-component, 100% solids, moisture insensitive, high strength epoxy adhesive and binder for numerous applications. This high modulus, low viscosity epoxy resin is the perfect solution for general bonding applications and for injecting cracks in concrete and a variety of other substrates.

TC-1604 A/B is a filled, easy to apply, laminating epoxy resin for variety of fabricating applications. Designed to be used with heavier weight fiberglass cloth (typically 8-10 oz.tooling fabric),TC-1604 can produce thick laminates without excess draining of the resin. Being a very stable system with low shrinkage.

Fielco Adhesives FCO 9509 is a multipurpose, high cohesive strength, two-part structural epoxy adhesive which provides superior adhesion to metals and plastics.

Razeen® LR 2282 is a general purpose unmodified epoxy resin based on Bisphenol F with medium viscosity.

CHS-EPOXY 455 is a Solvent–free epoxy system with high chemical resistance. Solvent–free epoxy system, accelerated, excellent mechanical properties. Special solvent–free epoxy system, low temperature, wet condition, very fast hardening. Epoxy resin modified with a non-phthalate, non-reactive plasticizer.

Prolink PLR 23 ProLink Pacific Resin is a high performance, durable system with excellent resistance to yellowing caused by UV degradation. This system can be used as a substitute for any standard epoxy system. The system will cure at ambient temperature, but for use in thin films, allow the mixed system to sit until approximately 90°F before being spread thin. Curing at elevated temperatures or allowing long post-cures could also be used to achieve adequate working time.

EA 560 used in long open time with high shear and peel strengths. Electrically Insulating. Suitable for bonding ceramics, metals and wood.

CHS-EPOXY 590 Is BPF type.

EA 555 is applicable in reparing, metal and concrete. Can be sanded. Resistance to water and other slvents.

Photomer® 3016 LT is a non-volatile, 100% bisphenol A type difunctional epoxy acrylate oligomer. The product is designed for use in UV/EB curing applications and exhibits fast cure speed, good solvent resistance and high gloss. It is characterized by its low irritancy and versatility.

MPD Industries UVP 0600 99 is a difunctional Bisphenol A epoxy acrylate. This product is characterized by its light color and high reactivity.It is mainly contributed by the epoxy resin backbone consisting of Bisphenol A and epichlorohydrin reaction product. The two acrylic groups contribute the excellent UV and EB curing properties.

Click Bond CB93 - CB300 Epoxy Adhesive Kit provides all materials necessary to mix and apply 4.0g of CB300 epoxy adhesive. Ideal for small jobs or repairs or for installation of 3-4 Click Bond adhesive-bonded fasteners.

Epilox F 16-01 is a colorless, low-molecular-weight bisphenol F epoxy resin.