Search
the marketplace
through 230,000 Chemicals and Raw Ingredients
through 8,000+ Supplier owned storefronts
Knowde for Suppliers
Segments
Nutraceuticals & Supplements
undefined
View All
HI&I Cleaning & Formulating
Chemical Manufacturing
Pharmaceuticals
Pulp & Paper
Oil & Gas
Agriculture & Feed
Case & Construction
Formulated Adhesives & Coatings
Food & Nutrition
Personal Care
Mining
Cosmetic Ingredients
Food Ingredients
Most popular categories
CASE Ingredients
Plastics
Pharmaceuticals & Nutraceuticals
Knowde for Suppliers
Knowde
Electrical & Electronics
Packaging & Assembly
Products in Packaging & Assembly
1,946 Products found in Packaging & Assembly
Browse
Applications
Show All 4 Categories
Filters
Suppliers
Product Families
Functions
Chemical Family
Features
Products
Brands
Suppliers
Formulations
Documents
Relevance
Cosmic Plastics
Farboset® 2720
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Resistor, Capacitors, Resistor Network, Encapsulant
Farboset® 2720 is a mineral-filled epoxy molding compound known for its rapid curing, exceptional moldability, and remarkable resistance to thermal shock and moisture. This compound is tailored to offer enhanced protection against moisture ingress and boasts a high glass transition temperature, making it an ideal choice for ensuring reliability in performance. Its primary purpose is to encapsulate a wide variety of electronic devices, including tantalum and ceramic capacitors, resistors, and resistor networks, providing them with a robust shield against environmental factors and mechanical stress.
Cosmic Plastics
Farboset® 1707-2
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Power Transformers, Bushings, Coils, Encapsulant
Farboset® 1707-2 is a mineral and glass-filled, anhydride epoxy molding compound that is engineered for the encapsulation of various electrical and electronic components. It is specifically formulated to provide high thermal shock resistance, making it ideal for protecting components that may be subjected to rapid temperature changes or other harsh environmental conditions. This compound helps ensure the reliability and durability of encapsulated components.
Cosmic Plastics
Cosmic Epoxy EH61
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
DAP D72/6120F
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1820.0 - 1820.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.
Cosmic Plastics
Farboset® 2461
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Capacitors, Resistor Network, Resistor, Encapsulant, Inductor Coil
Volume Resistivity:
22000000000000.0 - 22000000000000.0 Ohm-m
Flexural Strength:
85.436 - 85.436 MPa
Farboset® 2461 is a mineral-filled novolac epoxy molding compound that offers fast cure rates, excellent moldability, and superior thermal shock and moisture resistance. It has been formulated to achieve a high glass transition temperature, making it suitable for applications requiring optimal reliability performance, even in very thin sections. Farboset® 2461 is designed for encapsulating a wide range of electronic devices, including capacitors, resistors, resistor networks, and inductor coils, ensuring their protection and reliability in various operating conditions.
Cosmic Plastics
Cosmic Epoxy EH31
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH31 is an iron-filled epoxy molding compound available in a granular form with a black color. This material is designed for EMI/RFI shielding applications. It can be used for compression or transfer molding to create core rods and encapsulate surface mount and axial leaded inductors. Using this single molded compound can streamline the manufacturing process and eliminate the need for labor-intensive over/under molding.
Cosmic Plastics
Cosmic Epoxy EH40
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.
Cosmic Plastics
Cosmic Epoxy EH21
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH21 is an iron-filled epoxy molding compound provided in a black granular form. It is well-suited for applications requiring EMI (Electromagnetic Interference) and RFI (Radio-Frequency Interference) shielding. This material can be molded through compression or transfer molding processes to create core rods or to encapsulate surface mount and axial leaded inductors. It offers the advantage of simplifying the molding process by eliminating the need for labor-intensive over/under molding.
Cosmic Plastics
Cosmic Epoxy E4920AC
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920AC is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it suitable for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Farboset® 9020
Ready-to-Use Product Type:
Powder Coating
Application Area:
Capacitors, Coils, Resistors
Compatible Substrates & Surfaces:
Ceramic
Features:
Excellent Moisture Resistance
Application Method:
Spray, Beugler Wheel, Fluid Bed Coating
Chemical Family:
Epoxy & Epoxy Derivatives
Farboset® 9020 is a nonanhydride epoxy powder coating known for its excellent moisture resistance. It is specifically designed for encapsulating components such as ceramic and film capacitors, coils, thermistors, and resistors. This coating helps protect these components from moisture and environmental factors, ensuring their performance and reliability. Farboset® 9020 can be applied using various methods, including fluidized bed, wheel coaters, and electrostatic spray techniques.
Cosmic Plastics
DAP 306.0
Polymer Name:
Diallyl Phthalate
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1520.0 - 1520.0 kg/m³
Tensile Strength:
24.804000000000002 - 34.45 MPa
DAP 306 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon and supplied in flake form. It is suitable for a variety of applications, including switches, terminals, insulators, cups, cases, and other components that require strength as well as chemical and moisture resistance. It can also be used for the encapsulation of electrical and electronic components.
Cosmic Plastics
Farboset® 1708
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Coils
Farboset® 1708 is a specialized epoxy molding compound that combines mineral and short glass fillers, making it well-suited for the encapsulation of coils and other electrical and electronic components. It offers excellent moldability, which is important for achieving precise shapes during the encapsulation process. One of its standout features is its extreme resistance to thermal shock, meaning it can withstand rapid changes in temperature without cracking or degrading.
Cosmic Plastics
Cosmic Epoxy EH71
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
Farboset® 2460
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Capacitors, Resistor Network, Resistor, Coils, Encapsulant
Volume Resistivity:
18000000000000.0 - 18000000000000.0 Ohm-m
Flexural Strength:
1372.0 - 1372.0 MPa
Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.
Cosmic Plastics
Farboset® 1180
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.
Cosmic Plastics
DAP D33/6120
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1720.0 - 1720.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.
Cosmic Plastics
Cosmic Epoxy E4920AT
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920AT is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and comes in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Farboset® 9544
Chemical Family:
Epoxy & Epoxy Derivatives
Ready-to-Use Product Type:
Encapsulant, Powder Coating
Application Area:
Resistors
Application Method:
Beugler Wheel, Fluid Bed Coating
Farboset® 9544 is designed for coating a variety of electronic components, including resistor networks, hybrid circuits, varistors, and ceramic capacitors. Its resistance to cracking during thermal cycling is a valuable feature for maintaining the integrity of these components when subjected to temperature variations. Additionally, it can be applied using wheel and fluid bed equipment, providing flexibility in the coating process.
Cosmic Plastics
Cosmic Epoxy E4920CD
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920CD is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, offered as granules, preforms, or powders, and is available in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Farboset® 9025
Chemical Family:
Epoxy & Epoxy Derivatives
Ready-to-Use Product Type:
Encapsulant, Powder Coating
Application Area:
Resistors
Application Method:
Beugler Wheel, Fluid Bed Coating
Farboset® 9025 is a nonanhydride epoxy powder coating that is specifically formulated for use as an encapsulant for electronic components. One of its key characteristics is its excellent resistance to cracking during thermal cycling, which makes it ideal for applications where electronic components are subjected to temperature variations. This epoxy powder coating is designed for coating various electronic components, including resistor networks, hybrid circuits, varistors, and ceramic capacitors.
Cosmic Plastics
Cosmic Epoxy E4920
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Diodes, Inductor, Rectifier, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4920 is a mineral-filled epoxy molding compound available either in granular form or preformed in various sizes and weights. It features excellent moisture resistance, thermal cycling stability, and remarkable moldability. Furthermore, parts molded from this material do not support fungus growth, and it is specifically designed for the encapsulation of passive devices, including capacitors, inductors, diodes, and rectifiers.
Cosmic Plastics
Farboset® 9081
Ready-to-Use Product Type:
Powder Coating
Application Area:
Resistors
Features:
Thermal Cracking Resistance, Low Temperature Performance
Application Method:
Spray, Beugler Wheel, Fluid Bed Coating
Chemical Family:
Epoxy & Epoxy Derivatives
Farboset® 9081 is a nonanhydride epoxy powder coating specifically formulated for low-temperature applications, making it suitable for heat-sensitive electronic components. It is ideal for encapsulating film and ceramic capacitors that require processing at low temperatures. This compound can be applied using various techniques such as fluidized bed coating, wheel coaters, or electrostatic spray methods.
Cosmic Plastics
Farboset® 2510
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Capacitors
Farboset® 2510 is a mineral-filled, novolac epoxy molding compound known for its fast cure rates at low temperatures, excellent laser markability, and good moldability. This compound is specially formulated for encapsulating surface mount ceramic and tantalum capacitors, as well as other applications that demand quick cycle times. Its unique properties and rapid curing make it well-suited for applications where fast production and efficient marking are essential.
Cosmic Plastics
Cosmic Epoxy E4940P
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Optical Fiber Connector, Resistor Network
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4940P is a mineral-filled, glass-reinforced epoxy molding compound supplied in granular form. It is specifically designed for high-volume encapsulation applications, particularly for resistor networks and fiber-optic connectors. This compound offers high quality, reliability, and good moldability for such applications.
Cosmic Plastics
Cosmic Epoxy E4930R
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Transistor, Resistor, Optocoupler, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.
STIRRI® USA
HYDRACOAT
Product Type:
Clearcoat, Conformal Coating
Features:
Electrically Non Conductive, Moisture Resistant, Water Resistant, Humidity Resistant, Good Adhesion, Good Weather Fastness, Fast Drying
Application Area:
Medical Applications, Flexible Circuits, Defense, Naval Application, Automotive Applications, LEDs, Printed Circuit Boards
Compatible Substrates & Surfaces:
Metal, Plastics, Ceramic, Glass
Application Method:
Spray, Brush, Dip Coating
HYDRACOAT is the go-to conformal coating for electronics. With top-notch resistance to humidity, moisture, and weather, it offers lasting protection in any setting. Non-conductive and adhesive, it works seamlessly on plastics, glass, ceramic, and metal. Plus, it's non-flammable and water-resistant, making it perfect for defense, automotive, LED, medical, naval, and printed circuit board applications.
Cosmic Plastics
Farboset® 2270
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Resistor, Capacitors, Encapsulant
Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.
Cosmic Plastics
DAP D44/6160
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Housings, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1740.0 - 1740.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP D44/6160 is a mineral-filled, special-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It can be easily molded using compression, transfer, or injection equipment and can be readily preformed. It surpasses all mineral compounds available today in terms of mechanical and electrical properties. It boasts extremely low water absorption, high dielectric strength, and a low dissipation factor, along with high tensile strength, exceptional arc resistance, and excellent resistance to high temperatures.
Cosmic Plastics
Farboset® 2220
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Bushings, Encapsulant, Insulators
Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.
Cosmic Plastics
Cosmic Epoxy EH81
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
Farboset® 2500
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Capacitors
Farboset® 2500 is a mineral-filled, flame-retardant, novolac epoxy molding compound that offers fast cure rates at low temperatures, laser markability, and good moldability. This compound is formulated for encapsulating surface mount ceramic and tantalum capacitors, along with other applications that require quick cycle times. Its flame-retardant properties make it suitable for applications where fire safety is a concern, while its rapid curing and ability to be laser marked enhance its utility in modern production processes.
Cosmic Plastics
Cosmic Epoxy EH51
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH51 is an iron-filled epoxy molding compound available in a black granular form. It is designed for EMI/RFI shielding applications and can be used in compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the labor-intensive over/under molding.
Cosmic Plastics
Cosmic Epoxy E4920D
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Diodes, Inductor, Rectifier, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4920D is a mineral-filled epoxy molding compound that is available in either granular form or as preformed shapes in various sizes and weights. This compound is commonly used for molding applications and offers good versatility in manufacturing processes.
Cosmic Plastics
Cosmic Epoxy E4920VS
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920VS is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy E4940S
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Optical Fiber Connector, Resistor Network
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4940S is a mineral-filled epoxy molding compound supplied in granular form. It offers excellent dimensional stability, improved thermal cycling properties, and exceptional moisture resistance. This product is specifically designed for high-volume encapsulation of resistor networks and fiber-optic connectors that demand high quality, reliability, and excellent moldability.
Cosmic Plastics
Farboset® 5000
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Power Transformers, Coils, Switches, Encapsulant, Solenoid Coil
Farboset® 5000 is a novolac epoxy molding compound that contains mineral and glass fillers. It is specifically designed for applications where fast curing, high hot strength, and low abrasion resistance are essential. This compound is well-suited for the encapsulation of solenoid coils and similar applications where electrical and thermal performance are critical.
Show
36
of 1,946 results
Go to page
1
2
3
4
5
6
7
8
9
10