Products in Ready-to-Use Products: Electrical Components

ELASTOSIL® RT 745 S" A/B" is a pourable, two-part silicone rubber that can be thermally cured. It is an addition-curing type, making it suitable for various applications. Some notable industries where it finds use are automotive, electronics, and measurement and control. Specifically, it is employed in potting and encapsulation processes, ensuring the protection and stability of sensitive components and systems.

ELASTOSIL® N 2076 is a flowable, one-part silicone rubber for coating and encapsulation applications. When exposed to air moisture, it cures at room temperature to yield a permanently flexible silicone rubber with good heat resistance and excellent flame retardant properties. Fully vulcanized ELASTOSIL® N 2076 shows long-term stability against weathering, moisture, and UV radiation. The silicone elastomer may continuously be exposed to constantly changing climatic conditions, UV radiation, and temperatures as high as 180°C (356°F) without damage.

WACKER SilGel® 612 EH A/B is a two-part, pourable, addition-curing RTV-2 silicone rubber. It is a modified version of WACKER SilGel® 612, offering increased hardness and reactivity. With a 1:1 mixing ratio, this product ensures a convenient and precise blending process. It exhibits rapid curing properties and retains a low hardness.

SEMICOSIL® 987 GR is a one-part, ready-to-use, thermally curable silicone elastomer that exhibits non-slump properties. It is primarily used as a sealing adhesive. The silicone is thixotropic in nature, allowing for easy application and shaping. It offers high flexibility, making it suitable for low-stress adhesive bonding, such as in molded-in-place gasket (FIPG) applications. Additionally, SEMICOSIL® 987 GR provides primerless adhesion to a wide range of substrates.

ELASTOSIL® RT 722 RB A/B is a thixotropic, two-component silicone sealing adhesive that cures to an elastomer through thermal curing. It is specifically designed for various sealing applications. This product is well-suited for use as a sealing adhesive for electronic control units, as well as for FIPG (formed-in-place gasket) applications in plastic and metal housings. It can also be used as a dam material for dam-and-fill applications and for sealing and gasketing of housings.

WACKER SilGel® 613 is a pourable, addition-curing, RTV-2 silicone rubber that undergoes vulcanization at room temperature, resulting in a highly flexible silicone gel. This product offers inherent tack and possesses excellent mechanical damping properties. Furthermore, when used in conjunction with ELASTOSIL® CAT UV, WACKER SilGel® 613 exhibits rapid UV curing at room temperature while maintaining a long pot life.

WACKER SilGel® 612 A/B is a low-viscosity, pourable, addition-curing RTV-2 silicone rubber. This product undergoes vulcanization at room temperature, resulting in the formation of a highly flexible and very soft silicone gel. It boasts a rapid heat curing process, allowing for efficient production times. With its remarkably low hardness, WACKER SilGel® 612 A/B provides the desired silicone gel consistency. Additionally, this silicone rubber offers a crystal-clear appearance.

SEMICOSIL® 986/1K is a thermally curable, one-part silicone rubber known for its non-slump properties. It is a ready-to-use system, requiring no additional mixing. The silicone rubber is thixotropic in nature and exhibits a translucent appearance. SEMICOSIL® 986/1K possesses medium hardness and high flexibility, making it suitable as a low-stress adhesive. It offers primerless adhesion to various substrates. Furthermore, this silicone rubber undergoes rapid heat curing and features ultraviolet fluorescence properties.

SEMICOSIL® 911 A/B is a pourable, two-part silicone rubber that cures to a soft silicone gel through addition-curing. It has a 1:1 mixing ratio and demonstrates thixotropic behavior. This product offers rapid heat curing and forms a soft gel during vulcanization. SEMICOSIL® 911 A/B has a low volatile and uncured polymer content. It maintains almost constant properties within a wide temperature range, from -40 °C to +180 °C. Additionally, it boasts a low ion content.

SEMICOSIL® 9242 is a pourable, thermally curable, addition-curing one-part silicone rubber that cures to a very soft silicone gel. This product is ready-to-use, requiring no additional mixing. It exhibits thixotropic behavior, meaning it becomes shear-thinning during application. SEMICOSIL® 9242 offers rapid heat curing, allowing for efficient processing. Upon vulcanization, it forms a soft gel. With low levels of volatiles, uncured polymers, and ions, this silicone rubber ensures high purity. Additionally, SEMICOSIL® 9242 has the additional feature of ultraviolet fluorescence.

POWERSIL® Shine is a ready-to-use, one-component silicone-in-water emulsion. It is designed for cleaning electrical equipment and improving its surface hydrophobicity, which enhances its electrical insulating performance. The product comes in a convenient pump spray bottle, making it easy to apply. POWERSIL® Shine exhibits good cleaning behavior, does not contain solvents or abrasives, and is safe to use.

SEMICOSIL® 961 TC A/B is a shear-thinning, easy-dispensing, non-slump, two-part silicone rubber that cures at room temperature. It transforms into a soft and tacky rubber with excellent thermal conductivity. Specifically designed as an interface material, SEMICOSIL® 961 TC A/B is ideal for heat sink applications in the electronics industry.

SEMICOSIL® 949 UV A/B is a pourable, addition-curing, two-part silicone rubber with low viscosity. This product cures extremely fast when exposed to UV light, resulting in a soft silicone elastomer. SEMICOSIL® 949 UV A has a mixing ratio of 10:1 for its two parts and exhibits low viscosity, making it easy to handle and process. It offers the advantage of extremely fast curing at room temperature after UV activation. The cured elastomer has low hardness (Shore 00). Additionally, SEMICOSIL® 949 UV A contains a UV tracer, providing process control options during application.

CHT Group SilSo Bond 14000 is a non-corrosive, neutral-cure, 1-part, RTV (Room Temperature Vulcanizing) silicone adhesive sealant. It is one in a range of alkoxy cure products that are solvent-free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature to form a tough rubber when in contact with atmospheric moisture. This product will not corrode copper or its alloys and is suitable for use with electronic components.

Staticide® 8608 PL40 Premium Penetrating Lubricant is an aggressive degreaser and lubricant with peak performance. It penetrates deeply to displace moisture and inhibit corrosion on electronic and electrical components. In addition to being suitable for loosening frozen moving parts such as hinges, joints, and solenoids, this dynamic universal degreaser offers long-lasting protection against metal oxidation. The lubricating properties of this restorative formula will reduce friction between mechanical parts, making it ideal for returning unusable metal parts to functionality. This product is even safe to spray around plastics.

EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.

EB-126HT is two components, clear epoxy system. This long work life, low viscosity resin system is designed for the bonding, coating, sealing, and impregnation of electrical and structural components. The cured system has excellent electrical and physical properties above 250°C with outstanding high temperature stability. It also provides excellent moisture, chemical, and corrosion resistance as well as resistance to thermal and mechanical shock.

124-19 is a two part, room temperature curing, anisotropic conductive epoxy adhesive. The system is designed for making electrical and mechanical attachments on electrical components and devices. Unlike typical room temperature curing systems, this product always results in excellent anisotropic conductivity and is less sensitive to handling and ambient conditions. Complimentary B components allow for customization of end properties. Use B2713 for more flexibility and lower stress; use the standard B component for high strength requirements.Features Room temperature curing High bond strength Increased flexibility

127-48D is a matte finish, flexible, electrically insulating ink and coating suitable for application by screen printing, dipping, and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, polycarbonate, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing. Some applications for 127-48D include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, and membrane switches. 127-48D is a thermosetting version of 124- 18T.Features Solvent resistant washable dielectric ink ideal for fabrics

119-10 is a pad printable, electrically conductive, medical grade ink, and coating, suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 119-10 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments for surface mounted devices, and anode coatings for tantalum capacitors as well as medical electrode applications. 119-10 is a pad-printable version of 108-38.Features Electrode ink

128-32-25 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-25 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-25 is optimized for a 0.001” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

124-22C is a pre catalyzed, solvent-resistant, anisotropic conductive ink, coating and adhesive. This product features excellent adhesion to Kapton, Mylar, glass, polycarbonate and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. It is also very resistant to scratching and creasing. Applications for 124-22C include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of surface mounted devices. This product is useful in application where shorts between closely spaced contacts is a concern.Features Solvent resistant, low temperature curing epoxy adhesive

124-19 is a two part, room temperature curing, anisotropic conductive epoxy adhesive. The system is designed for making electrical and mechanical attachments on electrical components and devices. Unlike typical room temperature curing systems, this product always results in excellent anisotropic conductivity and is less sensitive to handling and ambient conditions. Complimentary B components allow for customization of end properties. Use B2713 for more flexibility and lower stress; use the standard B component for high strength requirements.Features Room temperature curing High bond strength

126-37 is a screen-printable, B-Stageable, anisotropic conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 126-37 is an anisotropic conductive version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance

102-32NFC is a flexible electrically conductive silicone adhesive. 102-32NFC features the highest degree of thermal and mechanical reliability over any other conductive adhesive technology and provides no failures during thermal cycling, heat aging, shocking or vibration due to the reliability from the elasticity of the product. Some applications for 102-32NFC include, but are not limited to, elastomeric conductive bridging and bonding, conductive bonding of low surface energy materials, conductive via filling and electrical attachments for stress sensitive devices. 102-32NFC is one of the few conductive adhesives that can bond to silicone substrates and surfaces. 102-32NFC is a non-flammable version of 102-32.Features High temperature Flexible silicone adhesive Non-flammable.

110-04 is a carbon-based electrically conductive ink and coating suitable for application by flexographic and rotogravure printing methods. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for110-04 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, resistance heaters, polymer thick film circuitry, membrane switches, electrical attachments and static elimination.Features Solvent based resistive ink

904-64 is a two-component, thermally conductive, red, high performance room temperature addition curing siliconeFeaturesTwo component, easy air release and low shrinkage addition cured silicone potting compound

126-22 is a pre-catalyzed, solvent-resistant, anisotropic conductive adhesive. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern.Features Solvent resistant epoxy adhesive Ideal for LED bonding

122-01(P) is a single component, electrically insulating, solvent strippable, polyimide based, ink and coating suitable for application by screen-printing, dipping and syringe dispensing. This product is designed for use on electrical and electronic components where high temperature stability is required. The low CTE and high flexibility allow for good adhesion and low stress when exposed to high temperatures. 122-01(P) is a flexible version of CMI 122-01.Features Polyimide dielectric High flexibility

115-02 is a silver/ silver chloride, based electrically conductive ink and coating suitable for application by flexographic and rotogravure printing methods. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 115-02 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments, medical electrodes and static elimination. 115-02 is a silver / silver chloride version of 114-50.Features Electrode ink for ECG electrodes

The 811-64 System is a two component, high performance, room temperature curing, highly filled potting / encapsulating compound. 811-64 is the carbon filled version of 812-48.FeaturesTwo component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage.

121-23 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 121-23 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product is useful in application where shorts between closely spaced contacts are a concern. This system features excellent thermal stability.Features B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate

128-17A/B is a two-part, room temperature curing, silver-filled fast curing adhesive. This system is designed for making electrical and mechanical attachments on electrical components and devices and features a very quick setup time allowing for rapid processing and repair in a variety of applications. 128-17A/B features a volumetric 3-to-2 mix ratio, allowing it to be easily handled by most mixing equipment.Features Fast curing, room temperature curing conductive adhesive

128-19 is a screen-printable, B-stageable, one-part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 128-19 is designed to exhibit minimal flow during bonding. This product provides bonds of dissimilar materials and has has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 128-19 is an electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance laminating adhesive

128-32-50 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-50 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-50 is optimized for a 0.002” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance B-stageable epoxy adhesive, ideal for 50µm bond line

128-32FP is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32FP include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. 128-32FP is especially useful in applications where shorts between closely spaced contacts is a concern and it features a finer pitch than traditional anisotropic conductive materials. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32FP is able to be used with pad sizes as small as 70 μm and spaces as fine as 30 μm.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability