Products in Adhesives & Sealants: Epoxy & Epoxy Derivatives

Farboset® 9146 is a nonanhydride epoxy powder coating with a dielectric grade, making it suitable for applications where superior electrical and moisture resistance is required. This compound is designed for encapsulating various electronic components, including hybrids, mica capacitors, and other semiconductor-grade devices that demand high purity and optimal moisture performance. Its excellent adhesion characteristics make it an ideal choice for chip on board applications.

Farboset® 9544 is designed for coating a variety of electronic components, including resistor networks, hybrid circuits, varistors, and ceramic capacitors. Its resistance to cracking during thermal cycling is a valuable feature for maintaining the integrity of these components when subjected to temperature variations. Additionally, it can be applied using wheel and fluid bed equipment, providing flexibility in the coating process.

Farboset® 9025 is a nonanhydride epoxy powder coating that is specifically formulated for use as an encapsulant for electronic components. One of its key characteristics is its excellent resistance to cracking during thermal cycling, which makes it ideal for applications where electronic components are subjected to temperature variations. This epoxy powder coating is designed for coating various electronic components, including resistor networks, hybrid circuits, varistors, and ceramic capacitors.

ARCOR® Arcthane is a high elongation, elastomeric hybridized epoxy/urethane compound. This versatile product is specifically designed for expansion joint sealing and crack repair applications, offering excellent compatibility with epoxy coatings. The urethane component imparts toughness and flexibility, allowing for resilience in demanding conditions. Meanwhile, the epoxy aspect enhances water and chemical resistance, as well as shelf stability. ARCOR® Arcthane's unique formulation eliminates the moisture sensitivity and toxicity commonly associated with traditional urethanes, thanks to its epoxy reactivity. With its light paste consistency, this product can be easily applied using a squeegee or caulk gun, with the added benefit of being able to achieve thicknesses of up to 500 mils without slumping. Choose ARCOR® Arcthane for its outstanding sealing and repair capabilities, compatibility with epoxy coatings, and the enhanced properties of both epoxy and urethane components, ensuring durable and reliable performance in expansion joint and crack repair applications. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® 2213 Stick is a convenient, solvent-free, two-component epoxy paste packaged in an easy-to-use stick form, combining both the Activator and Base components. With a simple cut or twist, a desired amount can be easily extracted and kneaded using gloved fingers. This rapid-curing epoxy is particularly well-suited for emergency repairs, allowing for quick fixes when time is of the essence. ARCOR® 2213 exhibits corrosion resistance and is reinforced with steel for excellent wear resistance. It can be further modified to meet specific requirements as it can be sanded, drilled, tapped, filed, and machined. Furthermore, it is compatible with epoxy, urethane, or acrylic paints, offering versatility in the choice of final finishes. Choose ARCOR® 2213 Stick for its convenience, durability, and efficiency in handling emergency repairs with excellent wear resistance and a wide range of applicability. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

Farboset® 9251 is a nonanhydride epoxy powder coating designed for applications where fast cure and thermal resistance are essential. This compound is particularly suitable for encapsulating motor iron applications and is recommended for various applications, including meter coils, busways, stators, rotors, and armature insulation. It provides the required thermal resistance and fast curing for these applications.

ARCOR® 25551 Quick-Set is a solvent-free, two-component epoxy adhesive that is moisture insensitive. Designed for emergency repairs or bonding applications, it is suitable for use on metals, glass, concrete, or wood surfaces. With its quick-setting formula, ARCOR® 25551 Quick-Set sets in just 5 minutes and can be put into service within 1 hour, regardless of the ambient temperature. This adhesive exhibits good resistance to a wide variety of chemical environments and offers heat resistance up to 450ºF. Its easy-to-use 1:1 mix ratio simplifies the application process, and it can be applied overhead or vertically. For convenient use, ARCOR® 25551 Quick-Set is packaged in two tubes containing resin and hardener. To achieve optimal results, simply squeeze equal portions onto a nonporous surface and thoroughly mix them together. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.

EB-316M is a semi-rigid, high strength structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance medical grade epoxy adhesive passes 500 thermal cycles from -50°C to 150°C. EB-316M is excellent for cryogenic temperature applications.

EB-316TC-2 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.

FLASHBOND™ UV-6502CL is a low viscosity, high clarity, light curing epoxy adhesive that offers excellent strength wetting properties. UV-6502CL cures to a clear polymer and maintains clarity at elevated temperatures. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths (315-365nm).

EB-316TM is a thixotropic version of EB-316M, a high strength, semi-rigid epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance medical grade epoxy adhesive passes 500 thermal cycles from - 50°C to 150°C. EB-316M is excellent for cryogenic temperature applications.

EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EB-142HT-1 is unfilled, low viscosity, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates.

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

EB-126HT is two components, clear epoxy system. This long work life, low viscosity resin system is designed for the bonding, coating, sealing, and impregnation of electrical and structural components. The cured system has excellent electrical and physical properties above 250°C with outstanding high temperature stability. It also provides excellent moisture, chemical, and corrosion resistance as well as resistance to thermal and mechanical shock.

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

127-03 is a screen-printable, B-Stageable, thermally conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 127-03 is designed to exhibit minimal flow during bonding. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment, and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and flexibility in the B-Staged form and is optimal for absorbing stress when bonding mismatched CTE substrates. 127-03 is a thermally conductive, electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Highly thermally conductive epoxy adhesive B-Stageable

126-08 is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing and high performance coatings.Features Extremely high thermally conductive epoxy adhesive

102-12 is a black, two component thermally conductive epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12 is an improved, crack-resistant version of F947. Use with standard Part B for room temperature cure.FeaturesThermal cycle resistantBlack, epoxy compound.Room temperature cureImproved crack resistanceHigh thermal conductivity

121-23 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 121-23 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product is useful in application where shorts between closely spaced contacts are a concern. This system features excellent thermal stability.Features B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

The 805-19C is a one-component, high performance, silver filled room temperature curable epoxy adhesive.Features One component room temperature curing

125-35C is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, precatalyzed, epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-35C is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. This is an electrically insulating, thermally conductive version of 124-08C.Features Highly thermally conductive epoxy adhesive

128-32FP is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32FP include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. 128-32FP is especially useful in applications where shorts between closely spaced contacts is a concern and it features a finer pitch than traditional anisotropic conductive materials. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32FP is able to be used with pad sizes as small as 70 μm and spaces as fine as 30 μm.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

128-19 is a screen-printable, B-stageable, one-part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 128-19 is designed to exhibit minimal flow during bonding. This product provides bonds of dissimilar materials and has has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 128-19 is an electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance laminating adhesive

128-32-50 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-50 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-50 is optimized for a 0.002” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance B-stageable epoxy adhesive, ideal for 50µm bond line

108-50MG is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50MG features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50MG can also be used as an adhesive for bonding stress sensitive substrates when low ionics or low hydrolyzable chloride is required. 108- 50MG is a microelectronics grade version of 108-50.Features Microelectronics grade Low stress Moderate thermally conductive adhesive/potting compound

127-45 is a die attach adhesive engineered for high reliability performance and high efficiency production. This product is a syringe dispensable, anisotropic conductive, one component, 100% solids epoxy adhesive and features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 127-45 is an anisotropic conductive version of Electraset™ 620.Features Die attach adhesive

123-34 is a pad-printable, B-Stageable, one part epoxy coating and adhesive, suitable for application by pad printing, dipping and syringe dispensing. This system has been pre-catalyzed with CMI 119-44 to allow for low temperature cure. This product features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. 123-34 is a pre-catalyzed version of 122- 48.Features B-Stageable Epoxy Adhesive

126-37 is a screen-printable, B-Stageable, anisotropic conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 126-37 is an anisotropic conductive version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance

109-12 is a one component, highly thermally conductive, low stress, low shrink potting compound and adhesive. 109-12 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring class "F+" service temperature rating. 109-12 is a more thermally conductive version of 108-50.Features Low stress High thermally conductive adhesive/potting compound