Products in Adhesives & Sealants: Binder & Resin

DEHESIVE® 902 AMA® is a solvent-free, addition-curing silicone fluid formulated for release applications on paper and filmic substrates. It is an integral component of a multicomponent release coating used in the production of paper and filmic release liners. These liners are widely utilized in the manufacturing of single- and double-sided industrial laminates.

DEHESIVE® 929 is a solvent-free, addition-curing silicone fluid designed for release applications. This product has good curing properties, very good flow properties and coverage, an extremely stable release, excellent bath life, and excellent long-term anchorage to a wide variety of substrates.

DEHESIVE® 944 is a solvent-based, addition-crosslinkable silicone recommended for use as a release coating. It offers excellent release stability, medium release at low peel speeds, excellent bath life, and excellent anchorage to a wide variety of substrates. It can be used for coating polyester films (PET), papers, and PE-laminated papers.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3700B is UV curable urethane acrylate oligomer with high elongation and soft rubbery elasticity. It is relatively low viscosity despite its high molecular weight. EB and Thermal cure systems are also applicable. Features Soft elastic type, High elongation High molecular weight but relatively low viscosity Non-solvent (100% hardening ingredient) For UV adhesion with monomers Non-yellowing Applications Adhesive: UV/ EB/ Thermal-curable adhesive for electronics device, optical use and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3300B is UV curable urethane acrylate oligomer with excellent soft-elasticity, and very high elongation. It also shows good mechanical properties even at low temperature. EB and Thermal cure systems are also applicable. Features Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Good mechanical properties at low temperature Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UT-7792 is a bio-based urethane acrylate oligomer. (Development product) Its biomass degree is 71% while its mechanical properties are the same as a non-biomass grade UV-3300B, with higher elongation and very soft rubbery elasticity suitable for using UV-curable adhesives for electronics devices. Features Bio-based Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3520TH is an aliphatic urethane acrylate oligomer with soft elasticity, good toughness and high elongation. It shows unique mechanical properties with various reactive diluents. Features Soft-Elastic type, Good toughness, High elongation Diluted in Tetrahydrofurfuryl Acrylate (THFA) (oligomer/ THFA = 70/30 wt%) Non-solvent (100% hardening ingredient) Unique mechanical properties with various reactive diluents Applications UV/ EB/ Thermal-curable adhesive UV adhesive for electric device use 3D printer, and Inkjet *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Rovene 6502 is a high solids, acrylic emulsion designed for formulation of PSA and packaging adhesives It can be used neat or blended with a variety of polymer emulsions, dispersed tackifiers, and fillers to yield performance characteristics that meet specific requirements. Rovene 6502 may also have application in vinyl flooring adhesives due to its plasticizer migration resistance.

Dry Cell Battery Sealant

Dry Cell Battery Sealant

Dry Cell Battery Sealant

Dry Cell Battery Sealant

Dry Cell Battery Sealant

Guangxi Zhongchang Resin RPF100W series resin series are made from modified rosin with special process. Provide excellent dissolvability in low carbon alcohol, light color aging resistance and light resistance.Widely used in alcohol soluble and water soluble precoated adhesive, pressure-sensitive adhesive, plastic printing ink and electronic flux.

UNI-REZ 2672 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2672 hot melt polyamide adhesive has excellent green strength, chemical resistance and adhesion to PVC.

UNI-REZ 2632 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2632 hot melt polyamide adhesive has excellent low temperature flexibility and adhesion to various plastic substrates. The low viscosity and moderate softening point allows for lower application temperatures when used with temperature sensitive substrates.

UNI-REZ 2671 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2671 hot melt polyamide adhesive has excellent green strength, chemical resistance and adhesion to PVC.

Epilox A 17-01 is a colorless, low-molecular-weight bisphenol A epoxy resin.

UNI-REZ 2215 polyamide resin is an alcohol soluble type resin that is used for flexographic printing. It has balanced properties making it a good choice for general purpose flexographic surface printing.

UNI-REZ 2294 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2294 has a moderate softening point and low viscosity which allows for a lower application temperature and fast set.

Guangxi Zhongchang Resin RPF90W series resin series are made from modified rosin with special process. Provide excellent dissolvability in low carbon alcohol, light color aging resistance and light resistance.Widely used in alcohol soluble and water soluble precoated adhesive, pressure-sensitive adhesive, plastic printing ink and electronic flux.

UNI-REZ 2940 polyamide resin is a co-solvent type resin which is soluble in alcohols, but typically requires mixtures of aliphatic hydrocarbons and alcohols for gel stability. UNI-REZ 2940 polyamide resin provides fast solvent release and good grease resistance in flexographic / gravure inks for plastic substrates and is especially effective as an overprint lacquer.

UNI-REZ 147 polyamide resin is an alcohol soluble / co-solvent type resin offering low temperature gel resistance and good compatibility with modifying resins. UNI-REZ 147 polyamide resin offers better blocking and gloss properties than other modified co-solvent types. It has good solvent compatibility, alcohol reducibility and compatibility to nitrocellulose.

Guangxi Zhongchang Resin RPF100 series resin series are made from modified rosin with special process. Provide excellent dissolvability in low carbon alcohol, light color aging resistance and light resistance.Widely used in alcohol soluble and water soluble precoated adhesive, pressure-sensitive adhesive, plastic printing ink and electronic flux.

Epilox A 19-03 is a medium viscosity bisphenol A epoxy resin which may crystallize on storage.

Guangxi Zhongchang Resin RPF100B series resin series are made from modified rosin with special process. Provide excellent dissolvability in low carbon alcohol, light color aging resistance and light resistance.Widely used in alcohol soluble and water soluble precoated adhesive, pressure-sensitive adhesive, plastic printing ink and electronic flux.

LESTAC DCPD100 is pale yellow granular or flake thermoplastic resin obtained from mainly thermo polymerizing unsaturated DCPD derived from the process of thermal cracking of naphtha. The major usages are Adhesive such as pressure-sensitive adhesive, hot-melt adhesive, Coating, Paint, Printing Ink, Rubber Compound and Tire. This grade also can be use as water repellent agent, concrete curing agent and binder for asphalt.