Products in Electrical & Electronics: Polyimides (PI)

Comco PLAVIS S has best physical properties at high temperatures, with a continuous operating temperature of 350°C. Modification: non-filled.

37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.

Arlon 85HP’s unique blend of pure polyimide resin and micro-fi ne proprietary fi llers results in superior performance for demanding applications. Compared to conventional polyimide systems, 85HP has a lower Z-axis expansion and twice the thermal conductivity. 85HP reduces resin cracking and wicking in designs with high density plated through holes and vias. 85HP prepreg has resin fl ow characteristics and pressed thickness matching standard polyimides.

Vist Composite SK2VR400-3 is a high temperature polyimide film. It is widely used in the composite industry in the processing of thermoplastics, as well as for insulation in electrical appliances that are used in special conditions. The use of polyimide film in the electronics industry means reducing the volume and weight of electrical appliances while maintaining the same performance or increasing power without increasing their size. It can also extend the life of electrical appliances and improve their reliability.

Novastrat® 905 Polyimide has High temperature polyimide with essentially zero coefficient of thermal expansion Novastrat® 905 is a high temperature polyimide film with essentially zero coefficient of thermal expansion (CTE). Because of this unique property, Novastrat® 905 has been successfully used in demanding optics, satellite and industrial applications that are exposed to severe temperature fluctuations. Novastrat® 905 is the recommended grade for applications that require essentially zero CTE and stable properties across a wide range of operating temperatures. Novastrat® 905 is available as a film in sheet form, or liquid resin for spray or flow casting operations. As a liquid, it bonds well to metals and metal oxides, and is supplied with and without a variety of internal adhesion promoters.

Champion Tape S1406 masks printed circuit boards during the wave solder or solder dip process.

Conductive Black CP1™ Polyimide Lower RF loss than other black and conductive black polyimides NeXolve’s Conductive Black CP1™ Polyimide is filled with carbon nanoparticles to produce a conductive black polyimide material with lower RF loss than other black and conductive black polyimides. Conductive Black CP1™ Polyimide exhibits very high optical density (>4) and light blocking. It is useful in applications requiring static dissipation, as it exhibits ESD-level surface resistivity. Conductive Black CP1™ Polyimide also exhibits high emissivity, surpassing 0.80 at 1 mil thickness. This material can be sprayed and cast into a variety of shapes using low-temperature curing (< 100 °C) for solvent removal. Conductive Black CP1™ Polyimide is available as a liquid casting resin or film product.

Comco PLAVIS ESD is Electrostatically dissipative and has high thermal resistance, superior mechanical properties and surface resistivity 10²-10³. Modification: electrostatic dissipative.

35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.

Comco PLAVIS N has best physical properties, maximum electrical and thermal insulation, low outgassing, superior radiation resistance. Modification: non–filled.

Comco PLAVIS C has electrical conductivity, high thermal resistance, superior mechanical properties and surface resistivity 10²-10³. Modification: conductive.