Products in Consumer Goods: Epoxy & Epoxy Derivatives

SETWORX™ 60 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties.

122-07-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 122- 07-F include, but are not limited to, die attach bonding, circuit board fabrication, advanced material composites, sealing, and high performance coatings. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils.Features Excellent Thermal Conductivity Easy Liner Release Excellent Chemical Resistance Low Ionics

EG7658 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (ie., alumina to aluminum, silicon to copper). The high thermal conductivity and flexibility make it excellent for bonding high-powered, large area die and components. EG7658 can be reworked using temperatures higher than the cure temperature from 80-150°C to soften the bond line. Use a tool adequate to break the bond and remove. Clean any residue with a solvent which will not damage the parts.

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

EPOXIBOND™ EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary under fill or flipchip die attach.

GP® CL-7004 phenolic resin from Georgia-Pacific Chemicals is a thermoplastic novolac. It is used as a crosslinking resin for epoxy and polyester resins. Its low phenol content, convenient softening point, and melt viscosity are conducive for use in powder coatings.

EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

EPOXIBOND™ EB-119SP is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

ME8412 is a silver filled, solvent free, electrically and thermally conductive paste. It is designed for automated, online, die attach processing. It is thixotropic and will not sag on vertical surfaces. Designed to meet the hybrid adhesive specification, Mil Std 883; Method 5011.4 in terms of ionic impurities, ME8412 exhibits low outgassing at 125C and passes NASA outgassing requirements.

SetWORX™ 1510 is a fast setting, toughened epoxy adhesive designed for industrial grade applications. This epoxy system has 1:1 mixing ratio by volume & cure fast at room temperature. When cured it is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. The cured adhesive exhibits high impact resistance and exceptional bond strength. It can be used for bonding glass, metals, woods and some plastics.

ME7655-RC is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. ME7655-RC can be cured at 150°C for 30 minutes without creating voids. It can be readily reworked at 80-100°C.

Loxon, the “work horse” of the appliance industry, is a blend of high-tech polymers specifically synthesized and produced for metal decorating applications. Loxon has been developed to meet new appliance specifications. It has superior resistance to laundry group detergents and new generation spot removers. Loxon has passed virtually all other chemical resistance tests called for in the appliance industry.

TC8750 is a silver-filled, B-staged epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. Its low Tg imposes minimum thermal stress on bonded parts during thermal cycling or shock testing. It has excellent thermal conductivity and can be used for most applications at temperatures from -65 to 150°C. It is reworkable at 80-150°C. Customers must test the adhesive for their specific applications to confirm its suitability. TC8750 is designed to meet the hybrid adhesive specification MIL-STD-883; Method 5011. It exhibits low outgassing at 125°C and passes NASA Outgassing requirements.

FLASHBOND™ UV-3700F is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-3700F cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass. This filled system is excellent for when low viscosity systems are not ideal. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400- 415nm).

SetWORX 90 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications. SetWORX 90 is BPA-Free and non-hazardous for shipping.

Deco-Chem’s Baking Size Coats are a one-part clear epoxy-based solution. They have been developed to meet new appliance specifications and have superior resistance to laundry group detergents and new generation spot removers. Baking Size Coats have passed virtually all other chemical resistance tests in the appliance industry.

EG8020 is a two-part, silver filled, room temperature curable adhesive upon mixing. This paste has good bond strength and is both electrically and thermally conductive. The easy mix ratio of 1:1 by weight or volume and ambient curable with long pot-life enable the adhesive to be used for small volume field and larger volume production applications.

Epoxon is a two component epoxy screen ink formulated specifically for general purpose use on a variety of surfaces. EPO has passed the rigid requirements of the automotive group such as chemical resistance, hardness, flexibility, abrasion resistance and consistency of color.

Loxon, the “work horse” of the appliance industry, is a blend of high-tech polymers specifically synthesized and produced for metal decorating applications. Loxon has been developed to meet new appliance specifications. It has superior resistance to laundry group detergents and new generation spot removers. Loxon has passed virtually all other chemical resistance tests called for in the appliance industry.

EPOXIBOND™ EB-109M-11 is a flexible, two components, low viscosity, clear epoxy adhesive for optical, medical, and semiconductor applications. This long working life adhesive can be cured at room temperature or with moderate heat and provides excellent adhesion to glass, quartz, metals, wood and most plastics.

EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.

Tack-film TK7758 is a reworkable, aluminum nitride-filled, electrically insulating epoxy film adhesive. It is designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged conductive adhesive offers excellent reworkability at 80-150°C and is storable at-40°C for one year. TK7758 has excellent thermal conductivity. Its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing

GP® CL-7003 phenolic resin from Georgia-Pacific Chemicals is a thermoplastic novolac. It is used as a crosslinking resin for epoxy and polyester resins. Its low phenol content, convenient softening point, and melt viscosity are conducive for use in powder coatings.

124-07-F is a B-staged, one part epoxy coating and laminating adhesive film. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. This product is available in thicknesses from 1 to 5 mils.

GP® CL-7002 phenolic resin from Georgia-Pacific Chemicals is a thermoplastic novolac. It is used as a crosslinking resin for epoxy and polyester resins. Its low phenol content, convenient softening point, and melt viscosity are conducive for use in powder coatings.

ME7635-RC is an thermally conductive insulating epoxy adhesive for die-attach applications. This thixotropic paste is solvent free. It is designed for automated, inline bonding processing ME7635-RC is low in ionic impurities (<60 ppm total) and meets all requirements for MIL-Std 883D 5011.4 specification for dielectric adhesive. Fast curing can be achieved from 80°C and higher temperatures.

ME8452-A is an accelerated version of ME8452 for snap-curing applications.This novel silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

SetWORX™ 411HP is a toughened, high strength, industrial grade structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. 411HP is a one component, heat cure, conductive epoxy adhesive. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications.

FLASHBOND™ UV-8504E is a low viscosity, fast curing, light-curing epoxy adhesive that offers excellent strength wetting properties. UV-8504E cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass.This product requires direct light exposure during cure. UV-8504E can cure fully in 30 seconds using optimal cure conditions. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths (315-365nm). FLASHBOND™ UV-8504E has been tested to and passes ISO-10993-5 standards for cytotoxicity.

118-06-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. The 118-06-F Series was developed with wafer manufacturing in mind. Some other applications for 118-06-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils (see product codes below). 118-06-F is designed with the performance criteria of Mil-Std-883 5011.4 in mind and is expected to pass ASTM E-595 outgassing testing when fully and properly cured.Features Excellent Electrical Conductivity. Easy Liner Release. Excellent Chemical Resistance. Low Ionics.

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.