Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
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Features & Benefits
- Specific Features
Heat curing Silicone rubber adhesive.
Applications & Uses
- Application Area
- Compatible Substrates & Surfaces
- Cure Method
- Applications
Insulators
- Processing
- Before applying the adhesive the surfaces of the substrate should be cleaned with a non-polar solvent, e.g. chemically pure acetone or white spirit.
- After thorough mixing of component A with 1% of component B the mixture should be applied in a thin layer.
- The parts should be fixed with low pressure to avoid squeezing out the adhesive. Curing of the adhesive takes place at 130°C.
- The curing process of the adhesive is finished after approx. 30 seconds at 130°C.
- Cycle time is mainly depending on the heat transfer and volume of the substrate.
- Adhesion can be further improved by post curing, e.g. at 200°C for 4h.
Properties
- Cured Properties
Value Units Test Method / Conditions Density 1.15 g/cm³ DIN EN ISO 1183-1 A Elongation (at break) 350 % ISO 37 Type 1 Shore Hardness A 67 - DIN ISO 48-4 Tear Strength 22 N/mm ASTM D 624 B Tensile Strength 9 N/mm² ISO 37 Type 1 - Uncured Properties
Value Units Test Method / Conditions Dynamic Viscosity (Component A, Shear rate 10 s⁻¹) 4500000 - DIN EN ISO 3219 Dynamic Viscosity (Component B, Shear rate 10 s⁻¹) 22000 - DIN EN ISO 3219 Kick-Off Temperature 120 °C - Mix Ratio (A:B) 100:1 parts by weight - Pot Life (at 23°C) min. 3 hours - - Note
Cure conditions: 10 min / 165°C.
Packaging & Availability
- Country Availability
- Regional Availability