Shinepoly® LP2088

Shinepoly® LP2088 modifier has crosslinked silicone and butyl-acylate copolymer core with grafted poly-methyl methacrylate shell. It provides superior low temperature impact performance, thermal stability and hydrolytic resistance with minimum affect on flame retardant performance of PC.

Brand: Shinepoly (11 products)

Functions: Impact Modifier

Chemical Family: Acrylics, Acrylates & Methacrylates, Poly(methyl methacrylate) (PMMA), Silicones

Compatible Polymers & Resins: Acrylonitrile Butadiene Styrene (ABS), Polycarbonates (PC), Polyesters

Processing Methods: Extrusion

End Uses: Automotive Electronics, Doors, Electrical Components, Machine/Mechanical Parts, Windows

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Features & Benefits

Applications & Uses

Markets
Applications
Compatible Polymers & Resins
Plastics & Elastomers End Uses
Plastics & Elastomers Processing Methods
Application

Shinepoly® LP2088 is recommended for use in PC and PC  blends with polyesters and ABS where superior low temperature impact  performance and excellent colorability are required. It is targeted for use  in painted automotive applications, electrical/electronic components, appliances,  business machines, lawn and garden equipment, and recreational vehicles where  ease of processing, thermal stability, excellent low temperature impact and a  good balance of physical properties are important.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Bulk density0.28g/cm3-
Particle size(<10 mesh) at Neat PC98%-
Izod Notched 23℃ at Neat PC81kJ/m²ASTM D256
Izod Notched -40℃ at Neat PC18kJ/m²ASTM D256
Tensile Strength at Neat PC61MpaASTM D638
Flexural Strength at Neat PC96MpaASTM D790
Flexural Modulus at Neat PC2930MpaASTM D790
Heat deflection temperature at Neat PC128°CISO-75
Melt flow rate 300 ℃ at Neat PC13°CASTM 1238
Izod Notched 23℃ 5% LP208870kJ/m²ASTM D256
Izod Notched -40℃ 5% LP208832kJ/m²ASTM D256
Tensile Strength 5% LP208867MpaASTM D638
Flexural Strength 5% LP208884MpaASTM D790
Flexural Modulus 5% LP20882638MpaASTM D790
Heat deflection temperature 5% LP2088121°CISO-75
Melt flow rate 5% LP208815.3°CASTM 1238

Technical Details & Test Data

Processing Guide

LP2088 can be directly added into the formulation during plastic compound extrusion.1-6 % on total formulation..

Packaging & Availability

Packaging Type
Packing & Availability

Packing:

15KG/bag

Storage & Handling

Storage

2 years, below 40℃. Store in a cool, dry place.