Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Polymer Name
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
Applications & Uses
- Markets
- Applications
- Composites End Use
- Composites Processing Methods
- Recommended Applications
Crystic® 1122PA can be used without modification in most types of spray equipment. Its thixotropy will prevent draining when used on vertical or inclined surfaces with chopped strand mat. It requires only the addition of catalyst to start the curing reaction and is therefore ideal for long production runs under controlled workshop conditions. Crystic® 1122PA has been formulated to give a tough resilient laminate. It can be used with confidence in the construction of industrial and general-purpose moldings.
- Formulation Guidelines
Crystic® 1122PA is formulated for room temperature curing applications. It requires only addition of the correct amount of catalyst to start the curing reaction. The recommended formulation is given in table 1.
Component Parts by weight Crystic 1122PA 100 Andonox® KP9 or Norox® MEKP 925H 1.0 - 3.0
The catalyst must be stirred thoroughly into the resin shortly before use. Curing should not be carried out at temperatures below 15°C. Scott Bader (Pty) Ltd. will not be liable for problems caused by use at lower temperatures than recommended. The resin must be allowed to attain workshop temperature (15-30°C) before being formulated for use.- Pot Life
The temperature, and the amount of Andonox KP9 or Norox MEKP 925H control the gel time of the resin formulation and can be approximately determined from Table .
Table : Geltimes for Crystic 1122PA at varying temperatures and catalyst levels.
NR= combination not recommended.
Catalyst type Andonox® KP9 Norox® MEKP 925H Catalyst addition 2.5% 2.0% 1.5% 1.0% 2.0% 1.5% 1.0% Temperature 40 °C NR NR NR NR NR 10 16 35 °C NR NR NR NR 12 15 19 30 °C NR NR 11 16 16 19 NR 25 °C NR 13 16 22 23 NR NR 20 °C 16 18 20 34 NR NR NR 15 °C 20 28 33 NR NR NR NR - Crystic 1122PA is formulated for use between 15°C and 30°C. It is recommended that workshop temperatures be maintained within this range.
- At temperatures above 30°C, the gel time even at 1% Andonox® KP9 catalyst can be so short that there is insufficient working time to use up all the resin that has been mixed. In such cases, do not use less than 1% catalyst as this can cause undercure. Rather use Norox® MEKP-925H. If using 1% Norox® MEKP 925H catalyst still gives too short a working time, do not use less than this. Rather mix smaller quantities of resin at a time so that it can all be used within the working time available.
- At temperatures below 15°C, the curing reaction can be so slow that there is a high probability of undercure of the resin, even with over 2.5% Andonox® KP9. Do not use more than 3% catalyst as that will not speed up the geltime appreciably or result in a faster cure; in fact it can further retard the cure. Rather warm up the resin and working area so that it is above 15°C.
Properties
- Color (Properties)
- Typical Properties
Value Units Test Method / Conditions Acid Value 23 mg KOH/g - Thixotropic Index 1.5 Ratio - Viscosity (at 25°C, Brookfield RVT, 100 rpm) 355 Centipoise - Relative Density (at 25/25°C) 1.1 g/cm³ - Volatile Content 39.5 % - Gel Time (at 25°C, using 1% Andonox® KP9 catalyst) 22 Minutes - Stability (at 25°C) 3 Months -
Technical Details & Test Data
- Pigments and Fillers
Crystic® 1122PA may be pigmented with up to 5 percent of Crystic® Pigment Paste, although lesser amounts are normally sufficient in a laminating resin. Pigment pastes and fillers should be used with caution, as they are likely to have a significant effect on the storage stability, geltime and cure of the resin system, and the physical strength properties of the final product.
- Post Curing
- For most applications, where the molded product will be used at ambient temperatures, satisfactory laminates can be produced without post curing at elevated temperatures, provided workshop temperatures are not below 20°C.
- For more critical applications, where optimum properties are required, or where the service temperature of the molding will be above ambient temperature, post curing at elevated temperature is recommended. The optimum temperature for Crystic 1122PA is 80°C. After release from the mold, laminates should be allowed to mature for 24 hours at a workshop temperature of not less than 20°C. before being post cured. Place the part in an oven, suitably supported to prevent warping, and increase the temperature from ambient to 80°C in 10°C stages.
- Leave the molding at 80°C for three hours, and then switch the oven off. Allow the molding to cool slowly in the oven. Post curing is most effective if it is carried out immediately after the 24 hour maturing period.
Packaging & Availability
- Packaging Type
- Packaging
- Crystic® 1122PA is supplied in 25kg and 225kg drums. Bulk supplies can be delivered by road tanker.
- Variants
Crystic 1122PA is also available as an unwaxed version, Crystic 1122PANW.
Storage & Handling
- Storage
- Crystic® 1122PA should be stored in the dark in suitable closed containers. It is recommended that the storage temperature should be less than 20°C where practical, but should not exceed 30°C. Ideally, containers should be opened only immediately prior to use. Where they have to be stored outside, it is recommended that drums be kept in a horizontal position to avoid the possible ingress of water.