TC600™ Laminates

The increased thermal conductivity of TC600 provides higher power handling, reduces hot-spots and improves device reliability. This higher heat transfer within the substrate complements designs using coins, heat sinks or thermal vias to provide designers additional design margin in managing heat. In designs with limited thermal management options, TC600 significantly improves heat transfer where the primary thermal path is through the laminate. This results in reduced in junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs. In addition, lower operating temperatures and chip-matching thermal expansion characteristics provide better reliability for component attachment prone to solder fatigue, solder softening and joint failure. TC600 has “Best-In-Class” Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes. Dielectric constant stability is also critical to phase sensitive devices such as network transformers utilized for impedance matching networks utilized in power amplifier circuitry. TC600 has low Z-Direction CTE.This feature provides unsurpassed plated through hole reliability. TC600 is a “soft substrate” and irrelatively insensitive to stress from vibration. Its robust nature overcomes the brittleness of thermoset ceramic loaded hydrocarbons or ceramics (such as alumina or LTCC) through suspension of micro-dispersed ceramics in a relatively soft, woven fiberglass reinforced PTFE-based substrate. This gives RF designers the advantage of low loss, without sacrificing mechanical robustness required to fulfill the needs of shock, drop and impact testing requirements of electronics. It is preferred by board manufacturers, as it can be easily cut, drilled and routed without being sensitive to cracking.

• Best in Class” Thermal Conductivity (1.1 W/mK) and Dielectric Constant Stability across Wide Temperatures (-75 ppm/ºC)
• Very Low Loss Tangent provides Higher Amplifier or Antenna Efficiency
• Mechanically Robust; replaces brittle laminates that cannot withstand processing, impact or High G forces
• Priced Affordably for Commercial Applications
• High Peel Strength for Reliable Narrow Lines

• Heat Dissipation and Management
• Replace Ceramic in Some Applications
• Improved Processing and Reliability
• Large Panel Sizes for Multiple Circuit
• Layout for lowered Processing Costs

• Power Amplifiers, Filters and Couplers
• Microwave Combiner and Power Divider Boards in Avionics Applications
• Small Footprint Antennas
• Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
• GPS & Hand-held RFID Reader Antennas