TC350™ Plus Laminates

TC350™ Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/ mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and industrial heating applications requiring higher maximum operating temperatures, low circuit losses, and excellent thermal dissipation within the circuit board. Additionally, the advanced filler system used enables the composite to have much improved mechanical drilling performance when compared with other competitive laminates. This will result in lower manufacturing costs during circuit board fabrication. The standard TC350 Plus laminates are offered with a smooth (Rq = 1.0µm) electrodeposited copper foil cladding to reduce insertion loss and RF heating of conductors within the circuit. Resistive foil and metal plate options are available upon request. TC350 Plus laminates are available in thicknesses from 0.010” to 0.060” to address higher power design needs. The woven glass reinforcement combined with the high filler content of the laminate affords excellent dimensional stability. Other key features of the laminate include low z-axis CTE (38ppm/°C) for excellent plated through hole reliability, low loss tangent of 0.0017 at 10 GHz to enable low loss designs, low moisture absorption of 0.05% to ensure stable performance in a range of operating environments, high dielectric strength of 650 V/mil to ensure good z-axis insulation between conductor layers, and UL 94 V-0 flammability performance to enable the use of the material in commercial applications. TC350 Plus laminates are used in a range of applications including Amplifiers, Combiners, Power Dividers, Couplers, and Filters. Applicable markets range from Commercial and Consumer to Defense and Aerospace.

High Thermal Conductivity of 1.24 W/(m. K)
• Improved Thermal Dissipation
Enabling Lower Operating Temperatures for High Power Applications
Low Loss Tangent of 0.0017 at 10 GHz
• Excellent High Frequency Performance
Very Low Profile and Thermally Stable ED Copper Foil (Rq = 1.0 µm)
• Very Low Insertion Loss and Reduced RF Heat Generation of Conductors
Advanced Filler Systems
• Improved Drilling Performance When Compared to Competitive Materials

• High Power RF and Microwave Power Amplifiers
• High Power Amplifiers for Industrial Heating Applications
• Passive Components such as Couplers, Filters and Power Dividers