Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Highlights
RT/duroid® 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/ duroid 6035HTC laminates are an exceptional choice for high power applications. Rogers advanced filler system enables excellent drill ability, reducing drilling costs as compared to standard high thermally conductive laminates which use alumina fillers.
- Features
High Thermal conductivity
- Improved dielectric heat dissipation enables lower operating temperatures for high power applications
Low loss tangent
- Excellent high frequency performance
Thermally stable low profile and reverse treat copper foil
- Lower insertion loss and excellent thermal stability of traces
Advanced filler system
- Improved drill ability and extended tool life compared to alumina containing circuit material
- Features
- Low loss for excellent high frequency performance
- Tight εr and thickness control
- Excellent electrical and mechanical properties
- Extremely low thermal coefficient of dielectric constant
- In-plane expansion coefficient matched to copper
- Very low etch shrinkage
Applications & Uses
- Markets
- Applications
- Recommended Applications
- High power RF and microwave amplifiers
- Power amplifiers, couplers, filters, combiners, power dividers
- Recommended Applications
- Phased Array Antennas
- Ground Based and Airborne Radar Systems
- Global Positioning System Antennas
- Power Backplanes
- High Reliability Complex Multilayer Circuits
- Commercial Airline Collision Avoidance Systems
- Beam Forming Networks
Properties
- Typical Properties
Value Units Test Method / Conditions Dielectric Constant, εr, Process at 10 MHz 3.50 ± 0.05 - IPC-TM-650 2.5.5.5 Surface Resistivity 1x 10^8 MΩ IPC-TM-650, 2.5.17.1 Dielectric Constant, εr, Design 3.6 - Differential Phase Length Method Volume Resistivity 1x 10^8 MΩ-cm IPC-TM-650, 2.5.17.1 Dissipation Factor tan d, at 10 GHz 0.0013 - IPC-TM-650 2.5.5.5 Thermal Coefficient of εr -66 ppm/°C IPC-TM-650 2.5.5.5 Tensile Modulus (MD) 329 kpsi ASTM D638 Tensile Modulus (CMD) 244 kpsi ASTM D638 Dimensional Stability (CMD) -0.011 mm/m IPC-TM-650, 2.4.39A Dimensional Stability (MD) -0.08 mm/m IPC-TM-650, 2.4.39A Coefficient of Thermal Expansion - X Axis 19 ppm/°C IPC-TM-650 2.4.41 Coefficient of Thermal Expansion - Y Axis 19 ppm/°C IPC-TM-650 2.4.41 Coefficient of Thermal Expansion Z Axis 39 ppm/°C IPC-TM-650 2.4.41 Thermal Conductivity 1.44 W/m/°K ASTM C518 Moisture Absorption 0.06 % IPC-TM-650 2.6.2.1 and ASTM D570 Density 2.2 g/cm3 ASTM D792 Copper Peel Strength 7.9 pli IPC-TM-650 2.4.8