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Rogers is a global leader in engineered materials to power, protect and connect our world. We are passionate about helping the world's leading innovators solve their toughest material challenges. Rogers is headquartered in Chandler, Arizona, USA, and we manufacture products in the U.S., China, Japan, Korea, Germany, Hungary and Belgium. Our innovative solutions empower our customers’ technological breakthroughs. We are proud to set the standard for reliability, efficiency and performance.

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TC600

RO3003G2

RO3035

RO4360G2

TC350

RO3003

RO4350B

CuClad® laminates are woven fi berglass/PTFE com posite materials for use as pri nted ci rcuit board substr ates. Using precision c ontrol o f t he f iberglass/PTFE ra tio, C uClad la minates off er a range of choi ces from the l owest di electric constant and loss tangent to a more highly reinforced laminate with better dimensional stability.

CuClad

Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity.The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits.Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.


Arlon® 25FR

AD1000 is a high dielectric constant substrate that permits circuit miniaturization, compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.AD1000 is a woven glass reinforced laminate. This allows for Greater Dimensional Stability and Mechanical Robustness than other 10 Dk Products. Its large panel size is also advantageous for “multi-circuits per panel” processing.

AD1000™ Laminates

CuClad 250(Er=2.40–2.60) uses a hi gher fiberglass/PTFE ratio to prov ide mechanical properties approac hing those of conventional subs trates. Better di mensional stabi lity and lower thermal expansi on in all di rections are other si gnificant benefi ts. The el ectrical properti es of CuCl ad 250GT and CuClad 250GXare tested at 1MHz and 10GHz respectively. For cri tical perform ance appli cations, CuCl ad products may be specified with an “LX” testing grade; this designates that each sheet will be tested individually, and a te st report will be issued with the order.

CuClad® 250 Laminates

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

AD255C™ Laminates

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highly reliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4 constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

RO3003™ Laminates

CuClad 217(Er=2.17, 2.20) uses a low fiberglass/PTFE ratio to provide the lo west di electric constant and di ssipation factor available in fiberglass reinforced PTFE based laminates. Together, these prop erties offer fas ter signal propagati on and higher signal/noise ratios.

CuClad® 217 Laminates

TMM® thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings. The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials. TMM laminates do not require a sodium napthanate treatment prior to electroless plating.

TMM® 10 Laminates

RT/duroid® 5870 and 5880 glass microfi ber reinforced PTFE composites are designed for exacting stripline and mi crostrip circuit applications.

RTduroid® 5880 Laminates

RT/duroid® 6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

RTduroid® 6002 Laminates

Rogers Corporation

Rogers is a global leader in engineered materials to power, protect and connect our world. We are passionate about helping the world's leading innovators solve their toughest material challenges. Roge

Rogers Corporation - Engineered Materials - Power - Protect

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RT/duroid® 5880LZ filled PTFE composites are designed for exacting stripline and microstrip circuit applications

RTduroid 5880LZ Laminates (ZH) Technical Data Sheet

RTduroid 5880LZ Laminates (ZH) Technical Data Sheet - Rogers Corporation

Rogers Corporation RT Duroid® 5880LZ Laminates Safety Data Sheet (English)

Rogers Corporation RT Duroid® 5880LZ Laminates Safety Data Sheet (English) - Rogers Corporation

RTduroid® 5880LZ Laminates

RTduroid 5880LZ Laminates - Rogers Corporation - Laminate

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	Value	Units	Test Method / Conditions
Dielectric Constant, εr, Process at 10 MHz	2.00 ± 0.04	-	IPC-TM-650 2.5.5.5
Surface Resistivity	2.08 x 10^6	MΩ	IPC-TM-650, 2.5.17.1
Dielectric Constant, εr, Design	2	-	Differential Phase Length Method
Volume Resistivity	1.74 x 10^7	MΩ-cm	IPC-TM-650, 2.5.17.1
Dissipation Factor tan d, at 10 GHz	0.0021	-	IPC-TM-650 2.5.5.5
Thermal Coefficient of εr	20	ppm/°C	IPC-TM-650 2.5.5.5
Electrical Strength	40	kV	IPC-TM-650, 2.5.6
Dimensional Stability	-0.38	%	IPC-TM-650, 2.4.39A
Moisture Absorption	0.31	%	IPC-TM-650, 2.6.2.1
Thermal Conductivity	0.33	W/m/°K	ASTM C518
Coefficient of Thermal Expansion - X Axis	54	ppm/°C	IPC-TM-650 2.1.41
Coefficient of Thermal Expansion - Y Axis	47	ppm/°C	IPC-TM-650 2.1.41
Coefficient of Thermal Expansion Z Axis	40	ppm/°C	IPC-TM-650 2.1.41
Outgassing Total Mass Loss	0.01	%	ASTM E-595
Outgassing Collected Volatile Condensable Material	0.01	%	ASTM E-595
Outgassing Water Vapor Regain	0.01	%	ASTM E-595
Density	1.4	g/cm3	ASTM D792
Copper Peel	min. 4	pli	IPC-TM-650, 2.4.8

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