Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Features
RO4000® Series Thermoset Platform
- Reduced Overall Cost of PCB Manufacturing versus PTFE Laminate Options
Optimized filler, Resin & Glass Composite System
- Dielectric Constant at 77 GHz of 3.2
Reverse Treated Smooth LoPro® Copper Foil
- Excellent Insertion Loss
Optimized Filler & Flat Glass
- Good Laser Drilling Performance
- Consistent Within Sheet Dielectric Constant
Applications & Uses
- Markets
- Applications
- Recommended Applications
76-81 GHz Automotive Radar Sensors
Properties
- Typical Properties
Value Units Test Method / Conditions Dielectric Constant, εr, Design 3.24 - microstrip differential phase length Transmission Line Loss 2.2 dB/in microstrip differential phase length Dissipation Factor, tan d 0.0033 - split-post dielctric resonator Thermal Coefficient of er (z direction) -30 ppm/°C IPC-TM-650 2.5.5.5 Dielectric Strength 78.7 kV/mm IPC-TM-650, 2.5.6.2 Water Absorption 0.15 % ASTM D570 Peel Strength after Thermal Stress 0.67 N/mm IPC-TM-650 2.4.8 Dimensional Stability (MD) -1.8 mm/m IPC-TM-650 2.4.39A Dimensional Stability (CMD) -1.8 mm/m IPC-TM-650 2.4.39A Decomposition Temperature (Td) 408 °C ASTM D3850 Time to Delamination (T288) min. 30 min IPC-TM-650, 2.4.24.1 Thermal Conductivity (calculated) 0.45 W/m/°K Through-plane calculation with series mixing rule Coefficient of Thermal Expansion - X Axis 23 ppm/°C IPC-TM-650 2.4.41 Coefficient of Thermal Expansion - Y Axis 23 ppm/°C IPC-TM-650 2.4.41 Coefficient of Thermal Expansion Z Axis 110 ppm/°C IPC-TM-650 2.4.41