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Identification & Functionality
- Chemical Family
- Composite Materials Functions
- Technologies
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Features & Benefits
- Materials Features
- Product Highlights
RO4725JXR™ and RO4730G3(TM) laminates have the mechanical and electrical properties that antenna designers need. The laminates have a dielectric constant (Dk) of 2.55 and 3.0 and a loss tangent (Df) of 0.0022 measured at 2.5 GHz when using LoPro® Reverse Treated EDC Foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with a demonstrated low PIM performance, with values better than -160 dBc (43dBm 1,900MHz signal). [2] RO4700 series antenna grade laminates are compatible with conventional epoxy and high temperature lead-free solder processing. These laminates do not require the special treatment needed on traditional PTFE-based laminates for plated through hole preparation. Lamination can be achieved using RO4400™ bondply series at 175°C. The resin systems of RO4700JXR materials are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280°C (536°F), leading to a low Z-axis CTE, excellent plated through hole reliability, and lead-free solder processability.
- Features
RO4700 Series Laminates - low loss dielectric with low profile foil
- Reduced PIM
- Low insertion loss
- RO4725JXR Dk 2.55
- RO4730G3 Dk 3.0 UL 94 V-0
Unique filler / closed microspheres
- Low density
- Light-weight 30% lighter than PTFE / Glass
Low Z-axis CTE
- Design flexibility
- Automated assembly compatible
Low TCDk <40 ppm/°C
- Consistent circuit performance
Specially formulated thermoset resin system/filler
- Low TCDk
- 2.55 Dk & 3.0 Dk
- Ease of fabrication
- PTH process capability
Environmentally Friendly
- Lead-free process compatibility
- RoHS compliant
Applications & Uses
- Markets
- Applications
- Recommended Applications
Cellular Base Station Antennas
Properties
- Typical Properties
Value Units Test Method / Conditions Dielectric Constant, εr, Process 2.55 ± 0.05 - IPC-TM-650, 2.5.5.5 Surface Resistivity 4.8 x 10^7 MΩ IPC-TM-650, 2.5.17.1 Dielectric Constant, εr, Design 2.64 - Differential Phase Length Method Volume Resistivity 2.16 x 10^8 MΩ-cm IPC-TM-650, 2.5.17.1 Dissipation Factor at 2.5 GHz 0.0026 - IPC-TM-650, 2.5.5.5 Dissipation Factor tan d, at 10 GHz 0.0022 - IPC-TM-650, 2.5.5.5 Thermal Coefficient of εr 34 ppm/°C IPC-TM-650, 2.5.5.5 PIM -166 dBc 43dBm 1900MHz Electrical Strength 630 V/mil IPC-TM-650, 2.5.6.2 Flexural Strength (MD) 17.5 kpsi ASTM D790 Flexural Strength (CMD) 13.3 kpsi ASTM D790 Dimensional Stability max. 0.4 mm/m IPC-TM-650, 2.4.39A Coefficient of Thermal Expansion - X Axis 13.9 ppm/°C IPC-TM-650, 2.1.24 Coefficient of Thermal Expansion - Y Axis 19 ppm/°C IPC-TM-650, 2.1.24 Coefficient of Thermal Expansion Z Axis 25.6 ppm/°C IPC-TM-650, 2.1.24 Thermal Conductivity 0.38 W/m/°K ASTM D5470 Moisture Absorption 0.24 % IPC-TM-650 2.6.2.1 ASTM D570 Tg min. 280 °C IPC-TM-650 2.4.24 Decomposition Temperature (Td) 439 °C ASTM D3850 Density 1.27 g/cm3 ASTM D792 Copper Peel Strength 8.5 pli IPC-TM-650 2.4.8