Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Features
Low dielectric loss (RO3003™ laminates)
• Laminates can be used in applications up to 77 GHz.
Excellent mechanical properties versus temperature
• Reliable stripline and multi-layer board constructions.
Uniform mechanical properties for a range of dielectric constants
• Ideal for multi-layer board designs with a range of dielectric constants
• Suitable for use with epoxy glass multilayer board hybrid designs
Stable dielectric constant versus temperature and frequency (RO3003 laminates)
• Ideal for band pass filters, microstrip patch antennas, and voltage controlled oscillators.
Low in-plane expansion coefficient (match to copper)
• Allows for more reliable surface mounted assemblies
• Ideal for applications sensitive to temperature change
• Excellent dimensional stability Volume manufacturing process
• Economical laminate pricing
Applications & Uses
- Markets
- Applications
- Recommended Applications
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems - power amplifiers and antennas
- Patch antenna for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
Properties
- Typical Properties
Value Units Test Method / Conditions Dielectric Constant, εr, Process 3.50 ± 0.05 - IPC-TM-650 2.5.5.5 Clamped Stripline Surface Resistivity 1 x 10^7 MΩ IPC 2.5.17.1 Dielectric Constant, εr, Design 3.6 - Differential Phase Length Method Volume Resistivity 1 x 10^7 MΩ-cm IPC 2.5.17.1 Dissipation Factor, tan d 0.0015 - IPC-TM-650 2.5.5.5 Thermal Coefficient of εr -45 ppm/°C IPC-TM-650 2.5.5.5 Dimensional Stability - X axis -0.11 mm/m IPC TM-650 2.2.4 Dimensional Stability - Y axis 0.11 mm/m IPC TM-650 2.2.4 Tensile Modulus - X axis 1025 MPa ASTM D638 Tensile Modulus - Y axis 1006 MPa ASTM D638 Moisture Absorption 0.04 % IPC-TM-650 2.6.2.1 Thermal Conductivity 0.5 W/m/°K ASTM C518 Coefficient of Thermal Expansion - X Axis 17 ppm/°C ASTM D3386-94 Coefficient of Thermal Expansion - Y Axis 17 ppm/°C ASTM D3386-94 Coefficient of Thermal Expansion Z Axis 24 ppm/°C ASTM D3386-94 Decomposition Temperature (Td) 500 °C TGA ASTM D3850 Density 2.1 g/cm3 ASTM D792 Copper Peel Strength 10.2 lb/in IPC-TM-2.4.8