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CuClad® 250 Laminates

CuClad 250(Er=2.40–2.60) uses a hi gher fiberglass/PTFE ratio to prov ide mechanical properties approac hing those of conventional subs trates. Better di mensional stabi lity and lower thermal expansi on in all di rections are other si gnificant benefi ts. The el ectrical properti es of CuCl ad 250GT and CuClad 250GXare tested at 1MHz and 10GHz respectively. For cri tical perform ance appli cations, CuCl ad products may be specified with an “LX” testing grade; this designates that each sheet will be tested individually, and a te st report will be issued with the order.

Brand: CuClad (5 products)

Functions: Laminate

Reinforcement Material: Glass Fibers

Technical Data SheetSafety Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Fluoropolymers
Reinforcement Material
Glass Fibers
Composite Materials Functions
Laminate
Technologies
Composite Materials
Product Families
Composite Materials — Prepregs & Molding Compounds
Laminates

Features & Benefits

Materials Features
Dimensional Stability,
Good Electrical Properties,
Good Mechanical Properties
Features
  • Cross Plied Woven Fiberglass, alternating plies are oriented 90o to each other
  • High PTFE to Glass Ratio
  • Better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates
Benefits
  • Electrical and Mechanical Isotropy in the X-Y Plane
  • Extremely Low Loss
  • Well Suited for Er Sensitive Circuits

Applications & Uses

Markets
Electrical & Electronics
Applications
Electrical & Electronics — Parts & Components
Printed Circuit Boards (PCBs)
Recommended Applications
  • Military Electronics (Radars, ECM, ESM)
  • Microwave Components (LNAs, filters, couplers, etc.)

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Dielectric Constant at 10GHz2.4 - 2.6-IPC TM-650 2.5.5.5
Surface Resistivity1.5 x 10^6MΩIPC TM-650 2.5.17.1
Dielectric Constant at 1MHz2.4 - 2.6-IPC TM-650 2.5.5.3
Volume Resistivity8 x 10^8MΩ-cmIPC TM-650 2.5.17.1
Dissipation Factor tan d, at 10 GHz0.0018-IPC TM-650 2.5.5.5
Thermal Coefficient of εr-170ppm/°CIPC TM-650 2.5.5.5 Adapted
Peel Strength14lb/inIPC TM-650 2.4.8
Arc Resistancemin. 180secondsASTM D-495
Tensile Modulus725, 572kpsiASTM D-638
Tensile Strength26, 20.5kpsiASTM D-882
Compressive Modulus342kpsiASTM D-695
Flexural Modulus456kpsiASTM D-790
Dielectric Breakdownmin. 45kVASTM D-149
Specific Gravity2.31g/cm3ASTM D-792 Method A
Water Absorption0.03%MIL-S-13949H 3.7.7 and IPC TM-650 2.6.2.2
Coefficient of Thermal Expansion - X Axis18ppm/°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion - Y Axis19ppm/°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion Z Axis177ppm/°CIPC TM-650 2.4.24
Thermal Conductivity0.254-ASTM E-1225
Outgassing Total Mass Loss0.01%NASA SP-R-0022A
Outgassing Collected Volatile Condensable Material0.01%NASA SP-R-0022A
Outgassing Water Vapor Regain0%NASA SP-R-0022A

Packaging & Availability

Material Availability

CuClad laminates ar e suppli ed with 1/2, 1 or 2 oun ce electrodeposi ted copper on both s ides. Other copper wei ghts and rolle d cop per foil are avai lable. CuClad i s avai lable bonded t o a heavy metal ground plane. Aluminum, brass or cop per plates also provi de an i ntegral heat sink and mechanical support to the substrate. When ordering CuClad products please specify dielectric constant, thickness, cladding, panel size and any other special considerations. Available master sheet sizes include 36" x 36" in a crossplied configuration and 36" x 48" in a parallel plied configuration.