BONDiT™ B-4682

As an electrical encapsulant /sealant B-4682 offers very high shock isolation and protection of sensitive electronics from loads derived from extreme thermal cycling, (- 65°C to 150°C)
as well as mechanical shock and vibration. B-4682 has been successful in military aircraft applications for sealing exterior electronic sensors.
B-4682 handles harsh environments and is particularly effective against moisture, salt water, acids, alkalies, oils, fuels and detergents. The highly flexible (200% elongation)
properties of B-4682 permits assembly of materials with extreme dissimilar thermal expansion properties to survive thermal cycling. Likewise mechanical vibration, shock
and impact are easily absorbed by B-4682.
B-4682 is particularly useful for assembly of low surface energy substrates such as Delrin to itself and an almost unlimited list of other materials, while offering an
excellent balance between material strength, peel, shear and tensile bond strengths, chemical resistance, and environmental resistance. This product works very well as a
waterblock sealant for cable and transducer terminations that withstands years of
submersion in deep-sea and other harsh chemical environments.
Operational temperatures are from -65°C to 150°C, above which it will soften considerably, but not flow as it is a crosslinked epoxy system. B-4682 is very easy to use with low HAZMAT impact as a 100% solids epoxy system— no plasticizers that bloom to the surface and no solvents causing VOC problems. The product is also availble in a thixotropic silcate filled version B-4682TH which can be applied to vertical surfaces without sagging, or in paste or electrically conductive form.

A wide range of curing regimes may be employed: ambient set in 6 hours, tack free in 20 hours, and 95% cure in 2 days; will cure 98% in 4 hours at 200°F.
Mix part A with part B, 1:1 ratio by volume or weight. Degassing is optional. Pot life is typically 90 minutes, at ambient temperature. Optional: Surface prep
by abrading or grit blasting substrates with #100 AlOx followed by degrease and/or alcohol wipe will increase adhesion. Apply B-4682 by roller or brush.

This highly flexible potting material protects electronic sensors from high impact mechanical and thermal shock, and extreme thermal cycling and vibration with excellent chemical resistance

Two-part, primerless, highly flexible epoxy, ambient and thermal cure. Low HAZMAT impact. Excellent sealant for electronic and electrical encapsulation for harsh environments.

Marine,Civil Engineering, Industrial, Downhole oil, Underwater, Mining, Industrial,, Automotive.