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Park Aerospace E-767 108 Glass

Park’s E-767 is a versatile, low flow, adhesive grade epoxy resin. When impregnated onfiberglass fabric it provides high bond strength at elevated temperatures while maintaining high electrical integrity.

Polymer Name: Epoxy Resins & Compounds

Reinforcement Material: Glass Fibers

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Epoxy & Epoxy Derivatives
Polymer Name
Epoxy Resins & Compounds
Reinforcement Material
Glass Fibers
Composite Materials Functions
Resins, Binders & Matrix Materials
Technologies
Composite Materials
Product Families
Composite Materials — Polymers & Resins
Thermoset Resins

Features & Benefits

Materials Features
Good Bonding Strength,
Low Flow
Key Features & Benefits
  • High Tensile Shear Strength
  • Excellent electrical Properties
  • High peel strength
  • Good thermal properties
Product Forms

Typical reinforcements are 1080 and 116 glass cloth Available in solution coated fabrics up to 60 inches wide (1.5 m)

Applications & Uses

Markets
Electrical & Electronics
Applications
Electrical & Electronics — Parts & Components
Printed Circuit Boards (PCBs)
Applications / Qualifications

The prime application of Park‘s E-767 Epoxy is in bonding metallic surfaces to base materials for printed circuit boards, comparable to G10. It is also an excellent adhesive for metal to metal bonding such as stainless steel or aluminum to itself. Copper and other metallics may be bonded to epoxy, polyester, Kapton®, Mylar® and other such dielectric systems. In addition to controlled flow, the E-767 on fiberglass cloth will maintain a specific bond line thickness. Selection of other fabric carriers will enable the user to vary this bond line thickness according to his or her needs. Other applications have included multilayer, heat sink bonding and overlay.

Properties

Mechanical Properties
ValueUnitsTest Method / Conditions
Resin Solids60-70%--
Roll length (Nominal (38” width) / 230 m (.97m)250yds-
Copper Bond Peel Strength (1 oz at 70°F) (35 micron at 21°C)15 / 2.1 lbs/in / N/mmMIL-P-13949
Solder Blister Resistance - (500°F) (260°C)20secondsMIL-P-13949
Tensile Shear (77°F) (25°C) (Aluminum to Aluminum)4100 psi / 28.3 kPa-ASTM D-1002
Tensile Shear (77°F) (25°C) (Steel to Steel)4250 psi / 29.3 kPa-ASTM D-1002
Tensile Shear (212°F) (100°C) (Aluminum to Aluminum)690 psi / 4.8 kPa-ASTM D-1002
Tensile Shear (212°F) (100°C) (Steel to Steel)2000 psi / 13.8 kPa-ASTM D-1002
Physical Properties
ValueUnitsTest Method / Conditions
Resin Flow (340°F, 50 psi) (170°C, 345 k/Pa) 1-5%%-
Gel Time (340°F/170°C)10-60Seconds-