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Products
Ovation Polymers Brand
28 Products
found on Ovation Polymers
Nemcon™ H PC DP111/X1
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Injection Molding
Flexural Modulus:
4475.0 - 4475.0 MPa
Polycarbonate - Thermally and electrically conducting grade with high HDT and improved processability.
Nemcon™ E CPC/X1
Polymer Name:
Polycarbonate Alloy (PC Alloy)
Processing Methods:
Injection Molding
Density:
1260.0 - 1260.0 kg/m³
Flexural Modulus:
3200.0 - 3200.0 MPa
PC Alloy - ESD Range Electrical Conductivity with High HDT and improved processability.
Nemcon™ E HDPE 11000
Polymer Name:
High Density Polyethylene (HDPE)
Processing Methods:
Injection Molding
Additives Included:
UV Stabilizer
HDPE - ESD Range Conductivity with improved processability and UV resistance.
Nemcon™ E PC 08CF
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Flexural Modulus:
6400.0 - 6400.0 MPa
Nemcon™ E-series products are designed for use in ESDA electronic assembly environments where strict control of ESD and cleanliness are critical. Nemcon™ E PC 08CF is a carbon fiber reinforced polycarbonate characterized by high stiffness, consistent moldability, low sloughing and uniform conductivity.
Nemcon™ E PC CB
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Injection Molding
Additives Included:
Carbon Black
Flexural Modulus:
2800.0 - 2800.0 MPa
Nemcon™ E-series products are designed for use in ESDA electronic assembly environments. Nemcon™ E PC CB is a carbon black-filled polycarbonate characterized by consistent moldability, recyclability, low outgassing, and good conductivity.
Nemcon™ E PET 30131
Polymer Name:
Polyethylene Terephthalate (PET)
Processing Methods:
Injection Molding
Flexural Modulus:
3090.0 - 3090.0 MPa
PET - Fiber Grade with ESD Range Conductivity with improved processability.
Nemcon™ E PK DP104
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Flexural Modulus:
18600.0 - 18600.0 MPa
Nemcon™ E PK DP104 is a carbon fiber-reinforced polyetheretherketone, characterized by very high strength, stiffness, consistent moldability, and exceptional thermal resistance.
Nemcon™ E PP AS
Polymer Name:
Polypropylene (unspecified)
Processing Methods:
Injection Molding
Additives Included:
Anti-Static Agent
Nemcon™ E-series products are designed for use in ESDA electronic assembly environments. Nemcon™ E PP AS is a moisture independent anti-static polypropylene characterized by consistent moldability and recyclability.
Nemcon™ H ABS DP116P
Polymer Name:
Acrylonitrile Butadiene Styrene (ABS)
Processing Methods:
Injection Molding
Nemcon H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon H ABS DP116P is a thermally conductive, electrically insulating ABS compound, combining thermal conductivity with good HDT and processability.
Nemcon™ H ES DP110/X3
Polymer Name:
Polycarbonate Alloy (PC Alloy)
Processing Methods:
Injection Molding
Density:
1490.0 - 1490.0 kg/m³
Flexural Modulus:
7350.0 - 7350.0 MPa
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a thermally conductive polycarbonate alloy, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds.
Nemcon™ H PA DP117/X3
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Flexural Modulus:
4740.0 - 4740.0 MPa
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PA DP117/X3 is a thermally conductive polyetheretherketone, offering excellent chemical resistance, good stiffness and high HDT. It should be used in demanding applications where thermal management must be accomplished in harsh environments.
Nemcon™ H PA66 DP187
Polymer Name:
Polyamide 66 (PA 66)
Processing Methods:
Injection Molding
Flexural Modulus:
7400.0 - 7400.0 MPa
Thermally conductive Nylon 6,6.
Nemcon™ H PC DP105/X3 BK
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Injection Molding
Flexural Modulus:
8200.0 - 8200.0 MPa
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP105/X3 BK is a black colored, thermally conductive polycarbonate compound, combining excellent thermal conductivity with high HDT and good processability.
Nemcon™ H PC DP113/X5
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Injection Molding
Flexural Modulus:
2950.0 - 2950.0 MPa
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP113/X5 is a thermally conductive, electrically insulating polycarbonate compound, combining good thermal conductivity with high HDT and good processability.
Nemcon™ H PC DP120/X2
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Injection Molding
Flexural Modulus:
6000.0 - 6000.0 MPa
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a natural, thermally conductive polycarbonate, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds.Applications: Housings for power components. Encapsulation/housings for bobbins, actuators, and coils. IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. LED lighting assemblies.
Nemcon™ H PC DP120/X3 BK
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Injection Molding
Flexural Modulus:
8050.0 - 8050.0 MPa
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP105/X3 BK is a black colored, thermally conductive polycarbonate compound, combining excellent thermal conductivity with high HDT and good processability.Applications: Housings for power components. Encapsulation/housings for bobbins, actuators, and coils. IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. LED lighting assemblies.
Nemcon™ H PC DP164
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Injection Molding
PC based, thermally conducting, electrically insulating grade with improved processability.
Nemcon™ H PC DP184
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Injection Molding
Flexural Modulus:
6750.0 - 6750.0 MPa
Thermally conductive Polycarbonate
Nemcon™ H PC/ABS DP182
Polymer Name:
PC/ABS Alloy
Processing Methods:
Injection Molding
Density:
1690.0 - 1690.0 kg/m³
Flexural Modulus:
3690.0 - 3690.0 MPa
Polycarbonate/Acrylonitrile Butadiene Styrene, thermally and electrically conducting grade.
Nemcon™ H PC/ABS DP188
Polymer Name:
PC/ABS Alloy
Processing Methods:
Injection Molding
Density:
1700.0 - 1700.0 kg/m³
Flexural Modulus:
3500.0 - 3500.0 MPa
Polycarbonate/Acrylonitrile Butadiene Styrene, thermally and electrically conducting grade.
Nemcon™ H PK DP110/X5
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Flexural Modulus:
7050.0 - 7050.0 MPa
Thermally Conductive Polyetheretherketone, excellent chemical, high stiffness, modulus and HDT.
Nemcon™ H PO DP117/X2
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Flexural Modulus:
350.0 - 350.0 MPa
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PO DP117/X2 is a thermally conductive polyetheretherketone, offering excellent chemical resistance, good stiffness and high HDT. It should be used in demanding applications where thermal management must be accomplished in harsh environments.
Nemcon™ H PP DP172
Polymer Name:
Polypropylene (unspecified)
Processing Methods:
Injection Molding
Polypropylene based, thermally conducting, electrically insulating grade with improved processability.
Nemcon™ H PPS DP148
Polymer Name:
Polyphenylene Sulfide (PPS)
Processing Methods:
Injection Molding
Flexural Modulus:
4700.0 - 4700.0 MPa
PPS based, thermally conducting, electrically insulating grade with improved processability.
Nemcon™ H PPS DP149
Polymer Name:
Polyphenylene Sulfide (PPS)
Processing Methods:
Injection Molding
Flexural Modulus:
6150.0 - 6150.0 MPa
PPS based, thermally conducting, electrically insulating grade with improved processability.
Nemcon™ H PPS DP183
Polymer Name:
Polyphenylene Sulfide (PPS)
Processing Methods:
Injection Molding
Flexural Modulus:
9915.0 - 9915.0 MPa
Thermally conductive Polyphenylene Sulfide
Nemcon™ E ABS 20CF
Polymer Name:
High Density Polyethylene (HDPE)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Nemcon™ E-series products are designed for use in ESDA electronic assembly environments where strict control of ESD and cleanliness are critical. Nemcon™ E ABS 20CF is a high modulus carbon fiber-reinforced ABS with excellent conductivity. It is suitable for a wide variety of injection molding applications, including electronic components, shipping trays, storage racks, electronic housings and work surfaces.
Nemcon™ H PU DP124/X2
Polymer Name:
Polyurethane (MDI-based)
Processing Methods:
Injection Molding
End Uses:
Medical/Healthcare Applications, Medical Devices
Density:
1550.0 - 1550.0 kg/m³
Nemcon™ H-series products are designed for use in applications where heat removal is critical to system performance. Nemcon™ H PU DP124/X2 is thermally conductive polyurethane, available as an injection moldable grade to replace metals in enclosures and medical device parts. It should be used in applications where thermal management must be accomplished along with esthetics and cost-effectiveness.