Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Key Features
- Dam-and-Fill materials encapsulate your wire-bonded device as an electrically insulating material.
- Dispensing a high-viscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for your CSP and BGA.
- Dam-and-Fill materials offer high package reliability and reduced warpage.
Applications & Uses
Properties
- Typical Properties
Value Units Test Method / Conditions Viscosity 60.0 Pa･s - Glass Transition Temperature 145.0 °C - Modulus of Elasticity 18.0 GPa - - Coefficient of Thermal Expansion
- Coefficient of Thermal Expansion ≦ Glass Transition Temperature: 15 ppm
- Coefficient of Thermal Expansion ≧ Glass Transition Temperature: 50 ppm