KİSAMİD® 1023

KİSAMİD® 1023 is a formulated polyamine adduct used in SF epoxy systems and can be cured at low temperatures. KISAMID® 1023 can be used in combination with other hardeners in SF coatings, adhesives, mortars, self leveling.

Brand: KİSAMİD (15 products)

Functions: Curing Agent

Chemical Family: Polyamines

End Uses: Solventless & High Solids Coating

Compatible Polymers & Resins: Epoxies (EP)

Features: Low Temperature-Curing

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
CASE Ingredients Functions
Technologies
Product Families

Features & Benefits

CASE Ingredients Features

Applications & Uses

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Amine Value370-390--
Colormax. 10Gardner-
Viscosity at 25°C850-1000mPa.s-
Solid Content100%-
Density at 20°C0.95+0.05g/ml-
Active H Equivalent Weight95--
Flash Point130°C-
Mixing Ratio50--
Gel Time (100ml/23°C)25dk-
Chemical Resistance Acids2--
Chemical Resistance Bases0--
Chemical Resistance Solvents2--