POLYFIL L is a microcellular, patented endothermic solution that serves as a foaming agent. It is compatible with linear low-density polyethylene (LLDPE), high-density polyethylene (HDPE), polystyrenes (PS), polypropylenes (PP), and low-density polyethylene (LDPE). The product can be processed using blow molding and injection molding methods, and its carrier is resin-based, using low-density polyethylene (LDPE).
